Alexis,

We have used Speedboard-C for a thermoset, Teflon-based, bonding film when FEP,  a
thermoplastic, is not appropriate, e.g. sequential lamination.  The material is very
expensive, and there are a few processing tricks which must be developed to process it
successfully.  The Core material selection is usually Rogers 6002 or  4003.  Rogers has
recently introduced some bonding films of their own which are interesting, but I have
not used them.  Of the cheaper side, there are some Epoxy blends which are not too
"loss"-y at reasonably high frequencies, especially when a high speed core material is
used with it.

Good Luck, and God Bless.

George Franck
Raytheon, Falls Church


Alexis Meehan wrote:

> Has anyone out there tried the Speedboard laminates and prepreg for
> high-speed designs? I'd like to hear from folks who have tried it. Were the
> results satisfactory? Was there an increase in cost? Thanks in advance for
> any info you can provide.
>
> ********************
> Alexis Meehan
> PCB CAD Mgr.
> 408-328-4595
> [log in to unmask]
> LuxN, Inc.
> 570 Maude Court
> Sunnyvale, CA 94086
>
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