Alexis, We have used Speedboard-C for a thermoset, Teflon-based, bonding film when FEP, a thermoplastic, is not appropriate, e.g. sequential lamination. The material is very expensive, and there are a few processing tricks which must be developed to process it successfully. The Core material selection is usually Rogers 6002 or 4003. Rogers has recently introduced some bonding films of their own which are interesting, but I have not used them. Of the cheaper side, there are some Epoxy blends which are not too "loss"-y at reasonably high frequencies, especially when a high speed core material is used with it. Good Luck, and God Bless. George Franck Raytheon, Falls Church Alexis Meehan wrote: > Has anyone out there tried the Speedboard laminates and prepreg for > high-speed designs? I'd like to hear from folks who have tried it. Were the > results satisfactory? Was there an increase in cost? Thanks in advance for > any info you can provide. > > ******************** > Alexis Meehan > PCB CAD Mgr. > 408-328-4595 > [log in to unmask] > LuxN, Inc. > 570 Maude Court > Sunnyvale, CA 94086 > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with following text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional > information. > If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or > 847-509-9700 ext.5365 > ############################################################## > > ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################