LY, Here's a few links to check out information about Low Inductance Capacitor Arrays: http://www.ryston.cz/pdf/avx/ti_nee.pdf http://www.avxcorp.com/docs/techinfo/LI_TI.pdf http://www.avxcorp.com/docs/catalogs/liarray.pdf http://www.kyocera.com/kai/semiparts/pdfs/flipchip.pdf http://lc.cray.com/models/cbga/ -Steve Gregory- > I need your advice. Any information would be helpful. > > My boss asked me to check into the dimension feasibility of > putting LICA in the Flip chip packages, such as, What is the clearance > between the edge of the die to the edge > of heat sink we need for LICA? How about the thickness of LICA vs. the > heat sink? I will use uF range of LICA for my study. > > Thanks, > > YL >