LY,

Here's a few links to check out information about Low Inductance Capacitor
Arrays:

http://www.ryston.cz/pdf/avx/ti_nee.pdf
http://www.avxcorp.com/docs/techinfo/LI_TI.pdf
http://www.avxcorp.com/docs/catalogs/liarray.pdf
http://www.kyocera.com/kai/semiparts/pdfs/flipchip.pdf
http://lc.cray.com/models/cbga/

-Steve Gregory-



> I need your advice. Any information would be helpful.
>
> My boss asked me to check into the dimension feasibility of
> putting LICA in the Flip chip packages, such as,  What is the clearance
> between the edge of the die to the edge
> of heat sink we need for LICA?  How about the thickness of LICA vs. the
> heat sink?  I will use uF range of LICA for my study.
>
> Thanks,
>
> YL
>