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Tue, 21 Jul 1998 12:32:41 +1000 |
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<H0000113005bb0b2@MHS> |
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> Hi,
>
> I am looking for a underfill material for our flip chip with solder
> bump. I very appreciate if someone can recommend the suppliers and
> comment its advantage or disadvantage.
>
> Thank you
>
>
> Eden
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Eden,
Try Emerson & Cuming - they have a Singapore office and Allen Chen
should be able to give tech support. I think the phone no is (65) 831 4142
Regards,
>
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