>     Hi,
>
>     I am looking for a underfill material for our flip chip with solder
>     bump. I very appreciate if someone can recommend the suppliers and
>     comment its advantage or disadvantage.
>
>     Thank you
>
>
>     Eden

--------------------------------------------------------------------------------
--------------
 Eden,
        Try Emerson & Cuming - they have a Singapore office and Allen Chen
should be able to  give tech support. I think the phone no is (65) 831 4142

Regards,


>
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