OSP

pro- excellent solderability, especially for small, tight packages
pro- flat solderable surface

con- must be used rather quickly, low shelf-life
con- handling procedures should be in place, contaminates easily
con- may require significant process changes

HASL

pro- solderability is good, often even without pre-cleaning
pro- often no major change is required of processes (existing process does
not need modification)
pro- long shelf-life (in some cases...years)

con- not a very flat surface
con- often find solder shorts after assembly
con- not good for tight pitch product (for the baove reasons)

These are I'm sure only a few issues...but probably the most significant

Franklin

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