OSP pro- excellent solderability, especially for small, tight packages pro- flat solderable surface con- must be used rather quickly, low shelf-life con- handling procedures should be in place, contaminates easily con- may require significant process changes HASL pro- solderability is good, often even without pre-cleaning pro- often no major change is required of processes (existing process does not need modification) pro- long shelf-life (in some cases...years) con- not a very flat surface con- often find solder shorts after assembly con- not good for tight pitch product (for the baove reasons) These are I'm sure only a few issues...but probably the most significant Franklin --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------