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Wed, 17 Apr 2013 22:46:57 +0000 |
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Techneters,
I have another tricky question.
We see separation at the Cu pad/laminate interface. The area is rather small (20 microns in section), BUT it's located at the periphery of BGA pads.
My concern is that the separation will act as a stress concentrator causing pad cratering, once the BGA is placed.
I'm positive it's a real scenario, as we investigated a similar case over a year ago.
According to 6012C the board is acceptable (at least from my understanding).
The question is: Is there a way to legitimately reject the board?
Regards,
Vladimir
SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (647) 495-8727
Cell: (416) 899-1882
www.sentec.ca
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