Techneters, I have another tricky question. We see separation at the Cu pad/laminate interface. The area is rather small (20 microns in section), BUT it's located at the periphery of BGA pads. My concern is that the separation will act as a stress concentrator causing pad cratering, once the BGA is placed. I'm positive it's a real scenario, as we investigated a similar case over a year ago. According to 6012C the board is acceptable (at least from my understanding). The question is: Is there a way to legitimately reject the board? Regards, Vladimir SENTEC Testing Laboratory Inc. 11 Canadian Road, Unit 7. Scarborough, ON M1R 5G1 Tel: (647) 495-8727 Cell: (416) 899-1882 www.sentec.ca ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________