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August 1997

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From:
"Robinson, Mike (AZ75)" <[log in to unmask]>
Date:
Wed, 20 Aug 1997 15:59:53 -0500
X-cc:
"Smith, Gary (AZ15) (Return requested)" <[log in to unmask]>, "Cluff, Kevin (AZ75) (Return requested)" <[log in to unmask]>, "Nachbor, Suzanne (MN51) (Return requested)" <[log in to unmask]>
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"Tully, Marti (AZ15) (Return requested)" <[log in to unmask]>
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"TechNet Mail Forum." <[log in to unmask]>, "Robinson, Mike (AZ75)" <[log in to unmask]>
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Marti,

If the pad is the same width as the lead, you can't form side fillets. Per
the PWB Design guidelines we have a minimum of 1.5 mils on each side on our
20 mil pitch and even more at larger pitches. There's and equation used for
each lead with and type.

Since 45 degree screening is not an option, consider squeegee pressure,
speed, and material for optimum solder on axis usually low on volume. Are
using fine pitch paste which has smaller particles than regular SMT paste.

Mike Robinson
 ----------
From: Tully, Marti (AZ15)
To: [log in to unmask]
Cc: Smith, Gary (AZ15); Robinson, Mike (AZ75); Cluff, Kevin (AZ75); Nachbor,
Suzanne (MN51)
Subject: Assy & Design SMT


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