Hello TechNet!
     I have a couple question concerning OSPs and adhesives for holding
     down chip components and incircuit test probes.

     1.  How does the adhesive create a sufficient bond between the chip
     component and the FR4 with OSP material on the board (bottom side).
     If the board was to be processed across the wave later, it would seem
     that the components would fall off.  Maybe I am missing something that
     is obvious.  Educate me please.  Be gentle if this is a silly
     question.  I am just getting into this OSP thing.

     2.  If OSPs are probeable with "bed of nails", what is the condition
     of the probes after multiple probing.  Does one start to get ghost
     failures because of gummed up probes?  If wave would take care of the
     bottom side, then what about the top side OSP that would not be
     removed from solder paste reflow (i.e. test pads, vias).

     Thanks
     Ron

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