Hello TechNet! I have a couple question concerning OSPs and adhesives for holding down chip components and incircuit test probes. 1. How does the adhesive create a sufficient bond between the chip component and the FR4 with OSP material on the board (bottom side). If the board was to be processed across the wave later, it would seem that the components would fall off. Maybe I am missing something that is obvious. Educate me please. Be gentle if this is a silly question. I am just getting into this OSP thing. 2. If OSPs are probeable with "bed of nails", what is the condition of the probes after multiple probing. Does one start to get ghost failures because of gummed up probes? If wave would take care of the bottom side, then what about the top side OSP that would not be removed from solder paste reflow (i.e. test pads, vias). Thanks Ron ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ##############################################################