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September 1999

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Subject:
Call for Papers
From:
Richard Haynes <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 15 Sep 1999 15:50:15 -0400
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The American Electroplaters and Surface Finishers Society's Electronic Com. is issusing a Call for papers for Chicago on June 26- 29,2000. The subject matter includes but not limited to: pulse plating, cell designs, electroless nickel and gold,
Attachment techniques i.e. wire bonding , use of silver and other subject matter you can think of interest to the electronic Industry.

Please sent a notification of interest  and follow up with a 50-100 abstract/ The paper is due March 1, 2000.

Thanks
Richard Haynes
[log in to unmask]

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