The American Electroplaters and Surface
Finishers Society's Electronic Com. is issusing a Call for papers for Chicago on
June 26- 29,2000. The subject matter includes but not limited to: pulse plating,
cell designs, electroless nickel and gold,
Attachment techniques i.e. wire bonding , use of
silver and other subject matter you can think of interest to the electronic
Industry.
Please sent a notification of interest and
follow up with a 50-100 abstract/ The paper is due March 1, 2000.
Thanks
Richard Haynes