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November 1998

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TechNet <[log in to unmask]>
Subject:
Solder Paste????
From:
Paul <[log in to unmask]>
Date:
Fri, 6 Nov 1998 12:27:31 -0500
In-Reply-To:
<[log in to unmask]>
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"TechNet E-Mail Forum." <[log in to unmask]>, Paul <[log in to unmask]>
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TEXT/PLAIN (27 lines) 
Hi All
        Is anyone out there using a no clean solder paste which reportedly
only leaves an epoxy residue after reflow.

        Currently we are considering a product which meets these
specifications.  The reason for the change stems from flux residue on gold
finger connections which are adjacent to the surface mounts.

        If anyone has had a similar problem I would appreciate some
feedback.

Thanks
Paul Gill
Process Engineer

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