Hi All Is anyone out there using a no clean solder paste which reportedly only leaves an epoxy residue after reflow. Currently we are considering a product which meets these specifications. The reason for the change stems from flux residue on gold finger connections which are adjacent to the surface mounts. If anyone has had a similar problem I would appreciate some feedback. Thanks Paul Gill Process Engineer ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################