All,
I have received a request from a customer to install an unusual package on
their board. The package dimension is .85mm x .85mm (yes, millimeters) with
four solder bumps. The solder bumps is .16mm - .18mm in diameter with a .5mm
pitch.
The part is .78mm thick. The material is silicon.
Question 1: What do you call this type of package?
Question 2: Is there a recommended assembly process?
Here is my plan of action:
1. Get data on the type of solder bump
2. Use sticky flux and not paste to print
3. Use Machine or hand mount the component
4. Use X-ray to inspect for misaligment
5. Reflow and X-ray
Thank you for your input!
Tuan
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################