All,

I have received a request from a customer to install an unusual package on
their board.  The package dimension is .85mm x .85mm (yes,  millimeters) with
four solder bumps.  The solder bumps is .16mm - .18mm in diameter with a .5mm
pitch.
The part is .78mm thick.  The material is silicon.

Question 1:  What do you call this type of package?

Question 2:  Is there a recommended assembly process?

Here is my plan of action:

1. Get data on the type of solder bump
2. Use sticky flux and not paste to print
3. Use Machine or hand mount the component
4. Use X-ray to inspect for misaligment
5. Reflow and X-ray

Thank you for your input!

Tuan

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