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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 25 May 2001 11:17:19 +0800 |
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Larry. How are the interconnections performing now? My first reaction is
'Ouch!', but can't specify the metalurgy for you.
Pete Duncan
"Jindra,
Larry" To: [log in to unmask]
<Larry.Jindra cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST Aero/ST Group)
@TRW.COM> Subject: [TN] ENIG in flex layers
Sent by:
TechNet
<[log in to unmask]
ORG>
05/25/01
03:16 AM
Please
respond to
"TechNet
E-Mail
Forum.";
Please
respond to
"Jindra,
Larry"
Our rigid/flex vendor deposited immersion gold over electroless nickel on
internal 1 oz copper flex layers prior to lamination of a rigid-flex-rigid
board. Our intent was to have ENIG finish only on the exposed connector
pads on the one end of the rigid/flex (6 layers). Instead, the ENIG is on
the pads, on the flex, and continues on in internal to the other rigid
portion of the circuit board (10 layers).
I have concerns about the durability of the flex and the via stackup in the
10 layer rigid section, which now has nickel on layers 3 & 8. Am I just
paranoid, or am I in trouble?
> Larry Jindra
> mailto:[log in to unmask] ph (858) 592-3424 fax (858) 592-3940
>
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