We are about to start using BGAs in our designs.  Can anyone recommend a BGA
rework station and BGA inspection equipment to inspect for poor alignment,
solder cracks,poor soldering, etc.  Is there X-ray equipment that will highlight
defects by enhancing the image with a different color to call out a possible
defect?  What features should we look for in both kinds of equipment?  The PCA's
are manufactured off site and sent to my facility for testing and incorporation
into the product.  Any help would be appreciated.  Thank you in advance.

Best Regards,

Mike Forrester
LeCroy Corp

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################