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September 1999

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Subject:
From:
"Feng Yi,BISC PD IE(BJ)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 30 Sep 1999 15:02:03 +0800
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Hi,Vincent,

You can try to use double solder wave. the chip solder should be high!
Best Regards


Qu Zenglong

Industrial Engineering Department
Production Division
BISC, China
Tel: 0086-10-64346323
Fax:0086-10-64367731
e-mail: [log in to unmask]

> ----------
> From:         Vincent BADA[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;Vincent BADA
> Sent:         Thursday, September 30, 1999 2:32 PM
> To:   [log in to unmask]
> Subject:      [TN] Wave soldering
> Sensitivity:  Confidential
>
> Hi all,
>
> What is the minimum vertical fill of solder for plated through holes ?
>
> We have some problems to obtain the 75% requested by IPC-A-610 for a class
> 2
> board.
> In fact, the board has a thickness of 3,2 mm.
> We use a no-clean flux and the wave is under nitrogen.
>
> Is there any special criteria regarding to the thickness of the board ?
> Has anyone succeeded in obtaining a correct solder filet for thick boards
> ?
>
> Thanks,
>
> Vincent Bada
> Process Engineer
> Alcatel Etca
> Charleroi
> Belgium
>
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