Vincent, on 3.2 i'd go with Qu , chip push and FOAM , no spray (and a mile
[or a minute] long preheat) ,
If you'd have bow problems , and no carriers, stretch a piano wire somewhere
in the middle .
paul
Ps : you didn't really mean the confidential sensitivity , did you
-----Original Message-----
From: Feng Yi,BISC PD IE(BJ) [mailto:[log in to unmask]]
Sent: Thursday, 30 September 1999 17:02
To: [log in to unmask]
Subject: Re: [TN] Wave soldering
Sensitivity: Confidential
Hi,Vincent,
You can try to use double solder wave. the chip solder should be high!
Best Regards
Qu Zenglong
Industrial Engineering Department
Production Division
BISC, China
Tel: 0086-10-64346323
Fax:0086-10-64367731
e-mail: [log in to unmask]
----------
From: Vincent BADA[SMTP:[log in to unmask]]
Reply To: TechNet E-Mail Forum.;Vincent BADA
Sent: Thursday, September 30, 1999 2:32 PM
To: [log in to unmask]
Subject: [TN] Wave soldering
Sensitivity: Confidential
Hi all,
What is the minimum vertical fill of solder for plated through holes
?
We have some problems to obtain the 75% requested by IPC-A-610 for a
class 2
board.
In fact, the board has a thickness of 3,2 mm.
We use a no-clean flux and the wave is under nitrogen.
Is there any special criteria regarding to the thickness of the
board ?
Has anyone succeeded in obtaining a correct solder filet for thick boards ?
Thanks,
Vincent Bada
Process Engineer
Alcatel Etca
Charleroi
Belgium
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