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Subject:	Re: ICT over RoHS Via
From:	Pete Houwen <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Pete Houwen <[log in to unmask]>
Date:	Tue, 16 Sep 2008 08:35:19 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (19 lines)

Eli,

ENiG vias will ICT just fine.  The only reason to add solder would be to plug 
the holes if you want to keep the probes out, or to aid vacuum.  But you're 
generally better off not adding unneccesary solder to a board.  We haven't 
needed to change anything in our ICT processes for RoHS materials.

Pete

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