Dear TechNetters!

In order to improve our assembly and repair process we try always to get
the most complete information about the BGA construction,especially the
composition of the solder balls.
Some of the plastic BGA's we are mounting lately, have non eutectic
solder balls.
1. Do you know which families of PBGA have non eutectic solder balls?
2. Is the composition of non eutectic solder balls the same as in CBGA?
3. Are the pad and stencil requirements the same as for "normal" (I
don't know anymore what it means) PBGA, or like for CBGA?
4.One of the examples is from the FREEDM family, although the brand name
is for the application, not the component manufacturer.
I had no idea about the composition until our repair people tried to
replace it only with paste flux, and it fell off. Looking at the solder
balls I saw no melting at all.

Any help is greatly appreciated!

Gaby Bogdan
Technology Lab.
SCI TEL AVIV

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