Dear TechNetters! In order to improve our assembly and repair process we try always to get the most complete information about the BGA construction,especially the composition of the solder balls. Some of the plastic BGA's we are mounting lately, have non eutectic solder balls. 1. Do you know which families of PBGA have non eutectic solder balls? 2. Is the composition of non eutectic solder balls the same as in CBGA? 3. Are the pad and stencil requirements the same as for "normal" (I don't know anymore what it means) PBGA, or like for CBGA? 4.One of the examples is from the FREEDM family, although the brand name is for the application, not the component manufacturer. I had no idea about the composition until our repair people tried to replace it only with paste flux, and it fell off. Looking at the solder balls I saw no melting at all. Any help is greatly appreciated! Gaby Bogdan Technology Lab. SCI TEL AVIV --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------