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April 2008

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Subject:	IPC New release: 7095B
From:	Kim Sterling <[log in to unmask]>
Reply To:	Kim Sterling <[log in to unmask]>
Date:	Mon, 7 Apr 2008 16:03:14 -0500
Content-Type:	multipart/alternative
Parts/Attachments:	text/plain (2263 bytes) , text/html (5 kB)


IPC-7095B<http://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=a9815fda-c900-dd11-91f9-001422202d38>
Design and Assembly Process Implementation for BGAs

Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. IPC-7095B delivers useful and practical information to anyone currently using BGAs or considering a conversion to area array packaging formats, This has become especially important due to the change in the alloys being used, both on the BGA packages and the solder alloy used to attach it to the printed board land pattern. The major emphasis of Revision B is to provide information to those companies transitioning from the standard tin-lead reflow processes to those that use lead-free materials in the assembly of BGA type components.

In addition to providing guidelines for BGA inspection and repair, IPC-7095B also addresses reliability issues and the use of lead-free joint criteria associated with BGAs. There are many new photographs of X-ray or endoscope illustrations to identify some of the characteristics that the industry is experiencing in the implementation of BGA assembly processes as well as void process indicators. 152 pages. Released March 2008.

Click through the link above or visit www.ipc.org/onlinestore<http://www.ipc.org/onlinestore> for formats and pricing. Available in hard copy, single user, site license and global license.

IPC members may request a free hard copy of this new standard by e-mailing [log in to unmask]<mailto:[log in to unmask]> within 90 days.






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