Design and Assembly Process
Implementation for BGAs
Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array
(FBGA) technology presents some unique challenges for design, assembly,
inspection and repair personnel. IPC-7095B delivers useful and practical
information to anyone currently using BGAs or considering a conversion to area
array packaging formats, This has become especially important due to the change
in the alloys being used, both on the BGA packages and the solder alloy used to
attach it to the printed board land pattern. The major emphasis of Revision B
is to provide information to those companies transitioning from the standard
tin-lead reflow processes to those that use lead-free materials in the assembly
of BGA type components.
In addition to providing guidelines for BGA inspection and repair,
IPC-7095B also addresses reliability issues and the use of lead-free joint
criteria associated with BGAs. There are many new photographs of X-ray or
endoscope illustrations to identify some of the characteristics that the
industry is experiencing in the implementation of BGA assembly processes as
well as void process indicators. 152 pages. Released March 2008.
Click through the link above or visit www.ipc.org/onlinestore for formats and pricing.
Available in hard copy, single user, site license and global license.
IPC members may request a free hard copy of this new standard by
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within 90 days.