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Reply To: | DesignerCouncil E-Mail Forum. |
Date: | Tue, 27 Oct 1998 11:31:18 -0800 |
Content-Type: | text/plain |
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At 01:09 PM 10/27/98 -0500, Chris Ball wrote:
>Hi Doug,
>
>> Component Side
>>
>> trace
>>S1 IC#1 --->---+ +-->-IC#2
>>Gnd ---------<---|----|--<-----
>>Pwr ??? ---------|--<-|---- ???
>>S2 -------------+-->-+--------
>>
>> Solder Side
>
>So what's a better way? Another ground layer between Pwr and S2? Please
>elaborate when you have the time.
Well, yes ---> if it's allowed <---.
Then, sock the ground planes down to
one another with plenty of connections.
My personal preference to start *any* stack up with
Gnd ----------------
Pwr ----------------
Gnd ----------------
as a cornerstone for the entire board layout.
Then add extra signal and ground layers above
and below this structure.
*** This is obviously not a hard fast rule. I.e. what's
the cost differential between a 4 and 5 layer board,
or between a 6 and 7 layer board?
<I ask rhetorically sort of chuckling ...>
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