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October 1998

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Subject:
From:
Douglas McKean <[log in to unmask]>
Reply To:
DesignerCouncil E-Mail Forum.
Date:
Tue, 27 Oct 1998 11:31:18 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (47 lines)
At 01:09 PM 10/27/98 -0500, Chris Ball wrote:
>Hi Doug,
>
>>          Component Side
>>
>>             trace
>>S1    IC#1 --->---+    +-->-IC#2
>>Gnd  ---------<---|----|--<-----
>>Pwr  ??? ---------|--<-|---- ???
>>S2   -------------+-->-+--------
>>
>>          Solder Side
>
>So what's a better way? Another ground layer between Pwr and S2? Please
>elaborate when you have the time.

Well, yes ---> if it's allowed <---.
Then, sock the ground planes down to
one another with plenty of connections.

My personal preference to start *any* stack up with

 Gnd  ----------------
 Pwr  ----------------
 Gnd  ----------------

as a cornerstone for the entire board layout.
Then add extra signal and ground layers above
and below this structure.

*** This is obviously not a hard fast rule. I.e. what's
    the cost differential between a 4 and 5 layer board,
    or between a 6 and 7 layer board?
    <I ask rhetorically sort of chuckling ...>

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