That seems like a tough question, did you get any answers yet?

In my opinion (take it with a grain of salt, sometimes common sense
doesn't count for much in this industry) the lifecycle is most dependant
on thermal cycling, and there is no data for burn-in type studies in
the design specs or acceptance criteria that I know of.

Maybe you would have better luck looking for solderability studies
done by the committees, they might have some useful data for you.

Good luck,
Jack (the new guy)

-----Original Message-----
From: Norman Moseng [mailto:[log in to unmask]]
Sent: Monday, March 26, 2001 3:18 PM
To: [log in to unmask]
Subject: [DC] Product Lifecycle


Does anyone know what the lifecycle of the boards designed to IPC standards
is? Is it stated
anywhere in the documentation?

Thanks Norm

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