That seems like a tough question, did you get any answers yet? In my opinion (take it with a grain of salt, sometimes common sense doesn't count for much in this industry) the lifecycle is most dependant on thermal cycling, and there is no data for burn-in type studies in the design specs or acceptance criteria that I know of. Maybe you would have better luck looking for solderability studies done by the committees, they might have some useful data for you. Good luck, Jack (the new guy) -----Original Message----- From: Norman Moseng [mailto:[log in to unmask]] Sent: Monday, March 26, 2001 3:18 PM To: [log in to unmask] Subject: [DC] Product Lifecycle Does anyone know what the lifecycle of the boards designed to IPC standards is? Is it stated anywhere in the documentation? Thanks Norm -- \\\|/// ( 0 0 ) +-----------------------oOOO--(_)--OOOo---------------------------+ | | | Norm Moseng Voice 630-378-6258 | | Tellabs Inc. Fax 630-378-6721 | | 1000 Remington Blvd. Email [log in to unmask] | | Bolingbrook, Illinois 60440 MS 214 | | Cube A231E | | | | ooooO | | ( ) Ooooo | +---------------------------\ (----( )--------------------------+ \_) ) / (_/