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May 1997


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Table of Contents:

(2)Re: FAB: IPC-HF-318 and Teflon Smear (1 message)
(Fwd) PCB Material tracking capability (1 message)
(Fwd) Re[2]: small pcb "V" score (1 message)
(More) In-House Hand Soldering Training for ISO ... (1 message)
1997 PCB Deesign Conference Proceedings (1 message)
50um copper and 2 micron tin-lead (1 message)
90/10 to 63/37 SnPb Comparison (2 messages)
Acronyms (1 message)
admin Re: Handling spam - From IPC Please no more. (1 message)
Ask for help on barcode labeling (2 messages)
ASSEM (2 messages)
assem : Moisture sensitive components (1 message)
Assem-Baking components (3 messages)
ASSEM: SMELF reliability (2 messages)
assem: Temp hardware (4 messages)
assy - loctite hardware on pcb assemblies (1 message)
Assy - solder paste deposition (1 message)
ASSY - TEST - ESS (1 message)
ASSY 4X standlupe source found (1 message)
Assy : Action Pin Header (1 message)
ASSY : SPC (1 message)
Assy :Conformal coating (1 message)
Assy BGA soldering standards (2 messages)
Assy fluxes (1 message)
ASSY, solder thieves (1 message)
ASSY: Clamshell cleaning baskets (2 messages)
ASSY: Component Prep (2 messages)
Assy: conformal coating (3 messages)
ASSY: Dull leads (3 messages)
ASSY: Flex Circuit Routing (1 message)
Assy: Intrusive Reflow techniques (4 messages)
Assy: labels on ICs (3 messages)
ASSY: LITZ WIRE (2 messages)
ASSY: MOLE temperature probes (6 messages)
ASSY: PCB Surface Flatness (2 messages)
ASSY: Profiling parts. (9 messages)
ASSY: radial components forming tool (1 message)
ASSY: Seho Wave Solder Machine (2 messages)
ASSY: SOLDER ALLOY MELTING POINT (2 messages)
ASSY: solder choices for Elkonite (3 messages)
ASSY: Soltec wave soldering machine (1 message)
ASSY:Au/Ni Coated Boards (3 messages)
ASSY:JumperStaking (2 messages)
ASSY:SEHO MWM 3100/3200 Soldering System (1 message)
Auto T-Stamp Retrofit? (2 messages)
BGA Specs (1 message)
Buried Resistance (1 message)
Burried Capacitance/Burried Resistance (4 messages)
Call for Papers IPC National Conference on PWB Solderability (1 message)
CF-8 (1 message)
Cleaning & Scrubbing (1 message)
Cleaning in General (1 message)
Cleanliness Qualification (1 message)
Component breaking off on Cab Maestro 4M (1 message)
Component Rated Temperatures (2 messages)
Conductive Adhesives (3 messages)
conformal coatings and fuji syringes (1 message)
Copper plating properties (2 messages)
COPPER PLATING:Tiny nodules in plated through holes (3 messages)
Copper Sulphide corrosion (4 messages)
DES - PCB physical characteristics (3 messages)
DES-Solder Paste Slump (1 message)
DES: Current carrying capacity of innerlayer planes (2 messages)
DES: ICT Access on High-Speed Nets (2 messages)
DES: Re: Design spec (1 message)
DES: Surface Mount Components (1 message)
Design spec (1 message)
Design, 1/2 oz CU callout per MIL-P-13949 (2 messages)
Differential Impedance (2 messages)
Dimensional Stability (2 messages)
Disk Drive Loading (2 messages)
DMS vs. Electroless copper (2 messages)
Echo (1 message)
Electronic system/assembly reliability (5 messages)
Everrett Charles 9090 Test Fixtures (4 messages)
FAB (5 messages)
fab - copper area calculation (2 messages)
FAB - Scoring PCB panels (6 messages)
Fab Multiwire (2 messages)
FAB Prepreg style 2113 (1 message)
Fab RE IPC-A-600E Haloing (3 messages)
Fab re: Haloing (1 message)
FAB-Heat Sinking Properties of Copper (2 messages)
Fab: Carbon Ink (1 message)
FAB: copper checking (2 messages)
FAB: Drill Wander (6 messages)
fab: drilling (2 messages)
FAB: DST foil (1 message)
FAB: HASL mask for Gold Contacts (2 messages)
FAB: IPC-350-D Photoplotting format (2 messages)
FAB: IPC-HF-318 and Teflon Smear (2 messages)
Fab: LPI (3 messages)
FAB: Marking rejected inner layers. (1 message)
Fab: Mesogenic Imagable Films (1 message)
FAB: Multiwire (1 message)
FAB: Nitric Acid Strip (5 messages)
FAB: Plating maskants (1 message)
Fab: plating tape alternative (2 messages)
Fab: Plotter Contacts (1 message)
FAB: Price structure for Flex Ckts (1 message)
Fab: Pwb Fabrication Panel Sizes (3 messages)
Fab: PWB Manufacturing Capability (2 messages)
Fab: Reject Codes (2 messages)
FAB: REPLY- Prelamination Cleaning (1 message)
Fab: Routing (2 messages)
FAB: small pcb "V" score (1 message)
FAB: SPC (2 messages)
fab: Touch-up on plating resist (2 messages)
Fab: Wanted (1 message)
FAB:Drill Wander (2 messages)
FAB:Drill Wander -Reply (2 messages)
FAB:Epoxy Paste (2 messages)
FAB:ipc 6012 Interpretation (2 messages)
FAB:Precleaning (6 messages)
FAB:Precleaning -Reply (1 message)
Fab:Re Copper Plating :Tiny Nodules (1 message)
Ftp and S-Ftp cables (1 message)
ftp/s-ftp cables specifications and differences (1 message)
ftp/sftp cables (1 message)
Fusued SnPb on 50 uml lines and spaces (4 messages)
FW: Acronyms (1 message)
FW: ASSY: Component Prep (2 messages)
FW: Assy: labels on ICs (1 message)
FW: ASSY: Profiling parts. (1 message)
FW: ASSY:Au/Ni Coated Boards (4 messages)
FW: component breakage at panel separation station (1 message)
FW: Conductive Adhesives (1 message)
FW: Copper Sulphide corrosion (1 message)
FW: Drill Wander (1 message)
FW: FAB - Scoring PCB panels (1 message)
FW: FAB: Dross in Solder Joints (2 messages)
FW: FW(wr): ftp/s-ftp cables specifications and differences (1 message)
Fw: IPC-SM-782 rev A (1 message)
FW: Just for fun, try it!! (3 messages)
FW: Label Specs (1 message)
FW: Labeling of PC Boards - Comments-WE ALSO NEED (1 message)
Fw: Message not deliverable (2 messages)
FW: PCB Testing House (1 message)
FW: Question on design software (4 messages)
Fw: Re: GEN: Market Growth Indicators (1 message)
FW: small pcb "V" score (1 message)
Fwd: Assy: Intrusive Reflow techniques (1 message)
Fwd: Buried Resistance (1 message)
Fwd: FW: Just for fun, try it!! (1 message)
FWD>ASSY- What is an HSOP ? (1 message)
GEN - Mentor Graphics Conversions (2 messages)
Gen- Durometer Measurement (1 message)
GEN- H2O Bake out (2 messages)
GEN--MIME (1 message)
GEN: Acronyms (1 message)
GEN: Laminate materials (1 message)
GEN: Market Growth Indicators (2 messages)
Gen: Multi-wire (1 message)
GEN: No subject (1 message)
GEN: Parts Needed (1 message)
GEN: Soldering Problem (2 messages)
GEN: Wanted-Guidebook for PCB -Reply (1 message)
Gen: Where to post Equipment for sale (1 message)
Gen:Lead stiffness (1 message)
General Soldering (2 messages)
Getek or FR-4? (1 message)
Gold edge connector (2 messages)
Guidelines on ordering electronic mfg equipment (2 messages)
HAL Solder Bath (2 messages)
Halide Levels (1 message)
Handling spam (2 messages)
high current tester (2 messages)
Immersion Ni/Au (2 messages)
In-House Hand Soldering Training for ISO ... (2 messages)
info? (1 message)
information (1 message)
intrusive reflow (3 messages)
Invitation to cooperate to build a printed circuit board manufacturing Plant in Bangladesh. (1 message)
IPC A 600 E (1 message)
IPC A 600 E:vert hasl (4 messages)
IPC vs. MIL standards (3 messages)
IPC-6012 (1 message)
IPC-SM-782 rev A (2 messages)
IPCchat session announcement (1 message)
Just for fun, try it (1 message)
Just for fun, try it!! (6 messages)
Label Specs (1 message)
Labeling of PC Boards - Comments (1 message)
LPISM Stripping (4 messages)
Mentor design info extraction tool (2 messages)
micro via (3 messages)
micro via supplier (1 message)
micro vias (4 messages)
Microvias (1 message)
MicroVias supplier wanted (5 messages)
MISC: Jupiter Standlupe (1 message)
More 1/2 oz CU (1 message)
Need Advisor Gold to purchase (1 message)
Need help on conversion (8 messages)
Need help on conversion -Reply (3 messages)
No clean flux for airborn boards (1 message)
No-clean & High Voltage (1 message)
NON-CONDUCTIVE TIE BARS... (1 message)
Non-halogenated fire retardant additives for laminates (1 message)
North Texas Chapter ~ IPC Designers Council Meeting June 5th (2 messages)
Numbering of ckts. for traceability. (2 messages)
Old Plating Lines for disposal. (1 message)
One,Two and Three lettes (1 message)
Palladium Specs (2 messages)
PalPilot (1 message)
Panel Sizing, pricing program (1 message)
Panel Sizing, pricing program - Free!(long) (1 message)
PBGA warpage (assy) (2 messages)
PCB DESIGN CONFERENCE WEST (1 message)
PCB Material tracking capability (2 messages)
PCB quality (2 messages)
PCB Testing House (2 messages)
Pd edge connector (1 message)
Pd edge connectors (3 messages)
PGA INSERTION Method/ Infor (2 messages)
PISM/SMOBC (2 messages)
Plating over Monel (3 messages)
plating tape alternative (1 message)
Plating Thickness inside hole walls ; reliability of measurement (1 message)
Positional tolerancing (1 message)
Pre-Lamination Cleaning- Avoid it! (1 message)
Prep Tools (3 messages)
Problems with Via in Pads (2 messages)
Process - permanganate desmear (1 message)
Process: Permanganate Desmear (1 message)
Published Documents (1 message)
question (2 messages)
Re- Conductive Adhesiv (1 message)
re-wire wrap (1 message)
Re: Design spec (1 message)
RE: Design, 1/2 oz CU callout per MIL-P-13949 (1 message)
RE: IPC A 600 E:vert hasl (1 message)
RE: Re:FAB Prepreg style 2113 (1 message)
Re:FAB Prepreg style 2113 (1 message)
Re; Solderballs (1 message)
Reliability (1 message)
Resin Cure (2 messages)
Resist Strippers (1 message)
Rework: IPC-R-700D? (1 message)
Re[2]: LPISM Stripping (3 messages)
Re[2]: small pcb "V" score (1 message)
Rf interference from No cleans (GEN/ASSY/DES) (3 messages)
rinse/deburr of small holes (1 message)
RS-274-X Gerber format (1 message)
SAI test (1 message)
Sampling of PWA (2 messages)
Screen Printing of pattern for DSPTH (2 messages)
Second Hand MAchineries (2 messages)
Shear Test and IBM vibration Test for Ball Grid Array (1 message)
shore/durometer hardness measurements (1 message)
SILKSCREENING (4 messages)
small pcb "V" score (6 messages)
SMEMA (2 messages)
smobc alternatives (1 message)
Sn/Cu intermetallics (1 message)
Soft Etching (1 message)
Solder balls (4 messages)
Solder balls problem (3 messages)
Solder Paste: Residue (1 message)
soldermask stripping (1 message)
Solderpaste Viscometers (2 messages)
Stencil opening (2 messages)
Supplier (3 messages)
Supplier Needed (1 message)
Surface Mount Devices (6 messages)
SV: MicroVias supplier wanted (1 message)
TEST: Flexible Printed Circuits (2 messages)
thermal epoxy (1 message)
thickness and tolerances for laminate (1 message)
Tin Institute (2 messages)
Tin Whisker (4 messages)
UL Requirements for Electronic Hardware (2 messages)
Unidentified subject! (6 messages)
Unidentified subject! (IMPEDANCE) (1 message)
visual inspection (1 message)
Wanted-Guidebook for PCB (3 messages)
WAVE SOLDER SANDBAGS (6 messages)
What is ED? (2 messages)
wire wrap (1 message)
wire wrap test fixtures. (1 message)

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Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

(2)Re: FAB: IPC-HF-318 and Teflon Smear

(2)Re: FAB: IPC-HF-318 and Teflon Smear

Michael Barmuta <[log in to unmask]>

Fri, 2 May 1997 09:27:59 -0700

146 lines

New Thread

(Fwd) PCB Material tracking capability

(Fwd) PCB Material tracking capability

Phil Hancock <[log in to unmask]>

Tue, 13 May 1997 16:10:14 +0000

68 lines

New Thread

(Fwd) Re[2]: small pcb "V" score

(Fwd) Re[2]: small pcb "V" score

[log in to unmask]

Wed, 14 May 1997 09:26:26 +0000

119 lines

New Thread

(More) In-House Hand Soldering Training for ISO ...

(More) In-House Hand Soldering Training for ISO ...

Jack Crawford <[log in to unmask]>

Thu, 22 May 1997 15:38:27 -0500

127 lines

New Thread

1997 PCB Deesign Conference Proceedings

1997 PCB Deesign Conference Proceedings

K.Varadaraj@CADET, India. <[log in to unmask]>

Fri, 23 May 1997 15:43:41 +0530 (IST)

59 lines

New Thread

50um copper and 2 micron tin-lead

50um copper and 2 micron tin-lead

Paul Gould <[log in to unmask]>

Wed, 21 May 1997 16:38:16 +0100

90 lines

New Thread

90/10 to 63/37 SnPb Comparison

90/10 to 63/37 SnPb Comparison

[log in to unmask]

Wed, 21 May 1997 12:02:52 -0500

49 lines

Re: 90/10 to 63/37 SnPb Comparison

ddhillma <[log in to unmask]>

Fri, 30 May 97 05:40:51 cst

81 lines

New Thread

Acronyms

RE: Acronyms

Darrell Bonzo <[log in to unmask]>

Tue, 13 May 97 7:47

100 lines

New Thread

admin Re: Handling spam - From IPC Please no more.

admin Re: Handling spam - From IPC Please no more.

David Bergman <[log in to unmask]>

Wed, 14 May 1997 11:59:47 -0500 (CDT)

141 lines

New Thread

Ask for help on barcode labeling

Ask for help on barcode labeling

[log in to unmask]

Fri, 16 May 97 08:49:31 MDT

51 lines

Re: Ask for help on barcode labeling

Lee McCuistion <[log in to unmask]>

Fri, 16 May 1997 08:58:18 +0000

90 lines

New Thread

ASSEM

ASSEM

Todd Jaco <[log in to unmask]>

Mon, 19 May 1997 17:05:42 -0500

42 lines

ASSEM

Todd Jaco <[log in to unmask]>

Mon, 19 May 1997 17:01:13 -0500

44 lines

New Thread

assem : Moisture sensitive components

assem : Moisture sensitive components

Marie-Jose Lambert (Marie-Jose Lambert Marie„Jose Lambert) <[log in to unmask]>

Thu, 15 May 1997 15:33:20 -0300

53 lines

New Thread

Assem-Baking components

Assem-Baking components

Marie-Jose Lambert (Marie„Jose Lambert) <[log in to unmask]>

Thu, 22 May 1997 16:16:19 -0300

50 lines

Assem-Baking components

Marie-Jose Lambert (Marie-Jose Lambert Marie„Jose Lambert) <[log in to unmask]>

Fri, 23 May 1997 08:33:08 -0300

50 lines

Re: Assem-Baking components

Mike Buetow <[log in to unmask]>

Fri, 23 May 1997 10:01:36 -0500 (CDT)

109 lines

New Thread

ASSEM: SMELF reliability

ASSEM: SMELF reliability

Mike Buetow <[log in to unmask]>

Wed, 21 May 1997 11:30:14 -0500 (CDT)

51 lines

Re: ASSEM: SMELF reliability

[log in to unmask]

Fri, 23 May 1997 21:58:38 -0400 (EDT)

43 lines

New Thread

assem: Temp hardware

assem: Temp hardware

Jack W. Bryant <[log in to unmask]>

Sat, 10 May 1997 11:19:17 -0400

45 lines

assem: Temp hardware

Jack W. Bryant <[log in to unmask]>

Sat, 10 May 1997 11:34:19 -0400

45 lines

Re: assem: Temp hardware

[log in to unmask]

Mon, 12 May 97 07:34:38 PST

66 lines

RE: assem: Temp hardware

Jan Satterfield <[log in to unmask]>

Mon, 12 May 97 9:17

137 lines

New Thread

assy - loctite hardware on pcb assemblies

assy - loctite hardware on pcb assemblies

samples <[log in to unmask]>

Sat, 31 May 1997 07:29:41 +0000

62 lines

New Thread

Assy - solder paste deposition

Assy - solder paste deposition

samples <[log in to unmask]>

Thu, 15 May 1997 13:30:07 +0000

59 lines

New Thread

ASSY - TEST - ESS

ASSY - TEST - ESS

[log in to unmask]

Wed, 14 May 97 16:24:00 PST

57 lines

New Thread

ASSY 4X standlupe source found

Re: ASSY 4X standlupe source found

Jerry Cupples <[log in to unmask]>

Thu, 15 May 1997 14:45:26 -0500

80 lines

New Thread

Assy : Action Pin Header

Assy : Action Pin Header

Johannes Sivula <[log in to unmask]>

Tue, 27 May 1997 11:46:37 +0300

47 lines

New Thread

ASSY : SPC

ASSY : SPC

Blanchet,Richard <[log in to unmask]>

Tue, 13 May 1997 08:02:00 -0400 (EDT)

44 lines

New Thread

Assy :Conformal coating

Assy :Conformal coating

Johannes Sivula <[log in to unmask]>

Mon, 19 May 1997 11:05:31 +0300

59 lines

New Thread

Assy BGA soldering standards

RE: Assy BGA soldering standards

Dumond, Charles <[log in to unmask]>

Wed, 7 May 1997 11:40:37 -0400

42 lines

Re: Assy BGA soldering standards

Vijay Sankaran <[log in to unmask]>

Wed, 07 May 1997 12:18:29 +0500

82 lines

New Thread

Assy fluxes

Assy fluxes

whu <[log in to unmask]>

Thu, 29 May 1997 16:55:56 +0100

43 lines

New Thread

ASSY, solder thieves

ASSY, solder thieves

Patrick Ducas <[log in to unmask]>

Fri, 30 May 1997 15:17:39 -0400

53 lines

New Thread

ASSY: Clamshell cleaning baskets

ASSY: Clamshell cleaning baskets

Kasprzak, Bill (esd) US <[log in to unmask]>

Fri, 02 May 97 14:29:00 PDT

50 lines

Re: ASSY: Clamshell cleaning baskets

[log in to unmask]

Fri, 2 May 1997 15:34:04 -0500

185 lines

New Thread

ASSY: Component Prep

ASSY: Component Prep

Kasprzak, Bill (esd) US <[log in to unmask]>

Wed, 07 May 97 07:08:00 PDT

65 lines

Re: ASSY: Component Prep

ddhillma <[log in to unmask]>

Wed, 07 May 97 10:17:03 cst

92 lines

New Thread

Assy: conformal coating

Assy: conformal coating

Blanchet,Richard <[log in to unmask]>

Wed, 28 May 1997 09:51:00 -0400 (EDT)

44 lines

Re: Assy: conformal coating

[log in to unmask]

28 May 97 12:18:31 EDT

98 lines

Re: Assy: conformal coating

Chris Messner <[log in to unmask]>

Wed, 28 May 1997 11:58:35 -0500

76 lines

New Thread

ASSY: Dull leads

ASSY: Dull leads

[log in to unmask]

Thu, 22 May 1997 15:31:54 -0500

47 lines

ASSY: Dull leads

[log in to unmask] <[log in to unmask]>

Thu, 22 May 1997 15:26:37 -0500

62 lines

Re: ASSY: Dull leads

[log in to unmask]

Fri, 23 May 1997 09:30:55 -0400 (EDT)

47 lines

New Thread

ASSY: Flex Circuit Routing

ASSY: Flex Circuit Routing

Ploughman, Mark <[log in to unmask]>

Thu, 08 May 97 10:39:24

58 lines

New Thread

Assy: Intrusive Reflow techniques

Assy: Intrusive Reflow techniques

Mark F. Hanrahan <[log in to unmask]>

Wed, 7 May 1997 07:15:07 +0000

54 lines

Re: Assy: Intrusive Reflow techniques

Jeffery L. Hempton <[log in to unmask]>

Thu, 08 May 1997 07:43:49 -0500

84 lines

Re: Assy: Intrusive Reflow techniques

Jack Crawford <[log in to unmask]>

Mon, 12 May 1997 08:57:58 -0500

76 lines

Assy: Intrusive Reflow techniques

[log in to unmask]

Fri, 30 May 1997 15:59:59 -0400

89 lines

New Thread

Assy: labels on ICs

Assy: labels on ICs

Blanchet,Richard <[log in to unmask]>

Mon, 26 May 1997 09:37:00 -0400 (EDT)

41 lines

RE: Assy: labels on ICs

Hooper Doug <[log in to unmask]>

Wed, 28 May 97 06:52:00 -0500

75 lines

RE: Assy: labels on ICs

Greg Parke <[log in to unmask]>

Wed, 28 May 1997 08:48:19 -0400

47 lines

New Thread

ASSY: LITZ WIRE

ASSY: LITZ WIRE

Jim Marsico 516-595-5879 <[log in to unmask]>

Thu, 15 May 1997 07:25:00 -0400 (EDT)

85 lines

Re: ASSY: LITZ WIRE

Ploughman, Mark <[log in to unmask]>

Fri, 16 May 97 12:02:36

102 lines

New Thread

ASSY: MOLE temperature probes

ASSY: MOLE temperature probes

[log in to unmask]

Thu, 29 May 97 16:46:41 +0200

55 lines

RE: ASSY: MOLE temperature probes

JIM ENNIS <[log in to unmask]>

Thu, 29 May 97 11:44:00 PDT

78 lines

RE: ASSY: MOLE temperature probes

JIM ENNIS <[log in to unmask]>

Thu, 29 May 97 11:44:00 PDT

80 lines

Re: ASSY: MOLE temperature probes

[log in to unmask]

Thu, 29 May 97 14:15:41 PST8

80 lines

ASSY: MOLE temperature probes

Jan Merstrand <[log in to unmask]>

Fri, 30 May 1997 14:08:41 +0100

114 lines

Re: ASSY: MOLE temperature probes

[log in to unmask]

Thu, 29 May 1997 22:39:31 -0400 (EDT)

51 lines

New Thread

ASSY: PCB Surface Flatness

ASSY: PCB Surface Flatness

[log in to unmask]

Thu, 15 May 97 16:58:22 EST

41 lines

Re: ASSY: PCB Surface Flatness

Ploughman, Mark <[log in to unmask]>

Fri, 16 May 97 12:02:34

66 lines

New Thread

ASSY: Profiling parts.

ASSY: Profiling parts.

Steve Quinn <[log in to unmask]>

Wed, 28 May 1997 10:14:23 -0500 (CDT)

53 lines

Re: ASSY: Profiling parts.

[log in to unmask]

28 May 97 12:42:23 EDT

109 lines

Re: ASSY: Profiling parts.

[log in to unmask]

Wed, 28 May 1997 14:51:30 -0400 (EDT)

55 lines

Re: ASSY: Profiling parts.

[log in to unmask] <[log in to unmask]>

Wed, 28 May 1997 14:55:29 -0500

76 lines

Re: ASSY: Profiling parts.

Mark W. Spitnale <[log in to unmask]>

Thu, 29 May 1997 06:58:07 -0500

95 lines

RE: ASSY: Profiling parts.

John Guy <[log in to unmask]>

Thu, 29 May 1997 08:17:42 -0500

120 lines

RE: ASSY: Profiling parts.

John Guy <[log in to unmask]>

Thu, 29 May 1997 08:29:58 -0500

121 lines

Re: ASSY: Profiling parts.

[log in to unmask]

Thu, 29 May 1997 17:55:41 -0400 (EDT)

51 lines

RE: ASSY: Profiling parts.

Fritz Byle <[log in to unmask]>

Fri, 30 May 1997 21:19:53 -0500

84 lines

New Thread

ASSY: radial components forming tool

ASSY: radial components forming tool

Blanchet,Richard <[log in to unmask]>

Thu, 08 May 1997 15:49:00 -0400 (EDT)

47 lines

New Thread

ASSY: Seho Wave Solder Machine

ASSY: Seho Wave Solder Machine

[log in to unmask]

Tue, 6 May 1997 11:04:08 -0500

44 lines

Re: ASSY: Seho Wave Solder Machine

Jan Merstrand <[log in to unmask]>

Wed, 07 May 1997 08:54:10 +0100

100 lines

New Thread

ASSY: SOLDER ALLOY MELTING POINT

ASSY: SOLDER ALLOY MELTING POINT

Jim Marsico 516-595-5879 <[log in to unmask]>

Fri, 02 May 1997 14:53:00 -0400 (EDT)

71 lines

Re: ASSY: SOLDER ALLOY MELTING POINT

ddhillma <[log in to unmask]>

Mon, 05 May 97 07:57:51 cst

96 lines

New Thread

ASSY: solder choices for Elkonite

ASSY: solder choices for Elkonite

Sheila Smith <[log in to unmask]>

Wed, 21 May 1997 14:52:25 -0400 (EDT)

43 lines

Re: ASSY: solder choices for Elkonite

[log in to unmask] <[log in to unmask]>

Wed, 21 May 1997 14:11:46 -0500

53 lines

Re: ASSY: solder choices for Elkonite

[log in to unmask]

22 May 97 14:28:53 EDT

65 lines

New Thread

ASSY: Soltec wave soldering machine

ASSY: Soltec wave soldering machine

[log in to unmask]

Thu, 8 May 1997 09:22:12 -0500

45 lines

New Thread

ASSY:Au/Ni Coated Boards

ASSY:Au/Ni Coated Boards

Raich, Zoran <[log in to unmask]>

Thu, 29 May 97 12:00:00 PDT

48 lines

Re: ASSY:Au/Ni Coated Boards

[log in to unmask]

Thu, 29 May 1997 09:15:15 -0400 (EDT)

45 lines

Re: ASSY:Au/Ni Coated Boards

ddhillma <[log in to unmask]>

Fri, 30 May 97 06:21:17 cst

84 lines

New Thread

ASSY:JumperStaking

ASSY:JumperStaking

???@???

Wed, 21 May 1997 14:20:00 +0000

66 lines

Re: ASSY:JumperStaking

Peter Swanson <[log in to unmask]>

Thu, 22 May 1997 18:57:36 GMT

78 lines

New Thread

ASSY:SEHO MWM 3100/3200 Soldering System

ASSY:SEHO MWM 3100/3200 Soldering System

Brian Smyth <[log in to unmask]>

Wed, 21 May 1997 09:54:50 +0100

51 lines

New Thread

Auto T-Stamp Retrofit?

Auto T-Stamp Retrofit?

Roger S. <[log in to unmask]>

Tue, 6 May 1997 09:39:42 -0600

72 lines

Auto T-Stamp Retrofit?

Roger S. <[log in to unmask]>

Tue, 6 May 1997 09:39:42 -0600

72 lines

New Thread

BGA Specs

BGA Specs

[log in to unmask]

Fri, 16 May 97 18:49:49 +0800

46 lines

New Thread

Buried Resistance

Buried Resistance

Ohmega Technologies, Inc. <[log in to unmask]>

Mon, 19 May 1997 13:46:38 -0500 (CDT)

36 lines

New Thread

Burried Capacitance/Burried Resistance

Burried Capacitance/Burried Resistance

chris wu <[log in to unmask]>

Sat, 17 May 1997 10:13:22 +0800

52 lines

Re: Burried Capacitance/Burried Resistance

[log in to unmask]

Sat, 17 May 1997 08:38:42 -0400 (EDT)

43 lines

Re: Burried Capacitance/Burried Resistance

nbiunno <[log in to unmask]>

Mon, 19 May 97 08:54:01 PST

78 lines

Re: Burried Capacitance/Burried Resistance

[log in to unmask]

Mon, 19 May 97 09:20:04 -0500

81 lines

New Thread

Call for Papers IPC National Conference on PWB Solderability

Call for Papers IPC National Conference on PWB Solderability

John Riley <[log in to unmask]>

Thu, 29 May 1997 16:19:09 -0500 (CDT)

82 lines

New Thread

CF-8

CF-8

Blanchet,Richard <[log in to unmask]>

Wed, 07 May 1997 08:34:00 -0400 (EDT)

57 lines

New Thread

Cleaning & Scrubbing

Cleaning & Scrubbing

[log in to unmask]

Thu, 15 May 1997 03:37:39 -0400 (EDT)

63 lines

New Thread

Cleaning in General

Cleaning in General

[log in to unmask]

Wed, 14 May 1997 22:04:56 -0400 (EDT)

60 lines

New Thread

Cleanliness Qualification

Cleanliness Qualification

Kenny Bloomquist <[log in to unmask]>

Wed, 21 May 1997 10:05:28 -0700

54 lines

New Thread

Component breaking off on Cab Maestro 4M

Component breaking off on Cab Maestro 4M

Dhawan, Ashok CA-WINPO2 <[log in to unmask]>

Fri, 16 May 97 17:32:00 GMT

41 lines

New Thread

Component Rated Temperatures

Component Rated Temperatures

Hans Ohman <[log in to unmask]>

Thu, 15 May 97 16:57:00 DST

55 lines

RE: Component Rated Temperatures

Max Bernhardt <[log in to unmask]>

Fri, 16 May 1997 07:27:00 -0500

98 lines

New Thread

Conductive Adhesives

Conductive Adhesives

[log in to unmask]

Fri, 2 May 97 10:03:26 CDT

55 lines

Re: Conductive Adhesives

Charles Elliott <[log in to unmask]>

2 May 1997 13:07:09 -0400

122 lines

Re: Conductive Adhesives

R. B. RAJ <[log in to unmask]>

Fri, 2 May 1997 14:08:00 -0400 (EDT)

98 lines

New Thread

conformal coatings and fuji syringes

conformal coatings and fuji syringes

Seth Tompkins <[log in to unmask]>

Fri, 02 May 1997 09:15:24 -0400

61 lines

New Thread

Copper plating properties

Copper plating properties

Joseph Fjelstad <[log in to unmask]>

Tue, 20 May 1997 20:57:39 -0700

104 lines

Re: Copper plating properties

[log in to unmask]

Thu, 22 May 1997 10:41:41 -0400 (EDT)

52 lines

New Thread

COPPER PLATING:Tiny nodules in plated through holes

COPPER PLATING:Tiny nodules in plated through holes

Anil K Singh <[log in to unmask]>

Thu, 22 May 1997 07:20:50 +0530

79 lines

Re: COPPER PLATING:Tiny nodules in plated through holes

Paul A Galatis <[log in to unmask]>

Thu, 22 May 1997 11:03:50 -0500

82 lines

Re[2]: COPPER PLATING:Tiny nodules in plated through holes

[log in to unmask]

Fri, 23 May 97 10:44:10 EST

105 lines

New Thread

Copper Sulphide corrosion

Copper Sulphide corrosion

John Loveluck <[log in to unmask]>

Wed, 21 May 1997 14:07:16 -0700

68 lines

RE: Copper sulphide corrosion

Sheila Smith <[log in to unmask]>

Wed, 21 May 1997 10:00:00 -0400 (EDT)

58 lines

Re: Copper Sulphide corrosion

[log in to unmask]

Wed, 21 May 97 09:13:08 -0600

96 lines

Re: Copper Sulphide corrosion

[log in to unmask]

Wed, 21 May 97 09:16:46 -0600

96 lines

New Thread

DES - PCB physical characteristics

DES - PCB physical characteristics

Dr. Jolyon Browne <[log in to unmask]>

Tue, 27 May 1997 10:29:36 -0700

80 lines

Re: DES - PCB physical characteristics

Jerry Cupples <[log in to unmask]>

Tue, 27 May 1997 14:09:29 -0500

124 lines

Re: DES - PCB physical characteristics

[log in to unmask]

Thu, 29 May 1997 16:15:09 -0400 (EDT)

34 lines

New Thread

DES-Solder Paste Slump

DES-Solder Paste Slump

Michele Diehl <[log in to unmask]>

Tue, 20 May 1997 11:01:35 -0400

32 lines

New Thread

DES: Current carrying capacity of innerlayer planes

DES: Current carrying capacity of innerlayer planes

Gagnon, Gerry <[log in to unmask]>

Fri, 16 May 1997 14:39:15 -0400

55 lines

Re: DES: Current carrying capacity of innerlayer planes

[log in to unmask]

Mon, 19 May 97 09:43:15 PST

97 lines

New Thread

DES: ICT Access on High-Speed Nets

DES: ICT Access on High-Speed Nets

[log in to unmask]

Thu, 29 May 97 17:07:40 CST

46 lines

Re: DES: ICT Access on High-Speed Nets

Jeff Seeger <[log in to unmask]>

Thu, 29 May 1997 18:24:38 -0400

79 lines

New Thread

DES: Re: Design spec

DES: Re: Design spec

Mike Buetow <[log in to unmask]>

Tue, 27 May 1997 09:11:53 -0500 (CDT)

73 lines

New Thread

DES: Surface Mount Components

DES: Surface Mount Components

Keith Kraver <[log in to unmask]>

Thu, 29 May 1997 15:13:49 -0400 (EDT)

61 lines

New Thread

Design spec

Design spec

Ed Cosper <[log in to unmask]>

Tue, 27 May 1997 09:11:15 -0500

42 lines

New Thread

Design, 1/2 oz CU callout per MIL-P-13949

RE: Design, 1/2 oz CU callout per MIL-P-13949

Mitch Morey <[log in to unmask]>

Tue, 27 May 1997 15:33:52 -0700

42 lines

Re: Design, 1/2 oz CU callout per MIL-P-13949

[log in to unmask]

Thu, 29 May 1997 16:12:43 -0400 (EDT)

33 lines

New Thread

Differential Impedance

Differential Impedance

Baker,Kelly <[log in to unmask]>

Wed, 21 May 1997 10:59:44 -0400

44 lines

Differential Impedance

Baker,Kelly <[log in to unmask]>

Fri, 23 May 1997 07:22:00 -0400

43 lines

New Thread

Dimensional Stability

Dimensional Stability

[log in to unmask]

Fri, 23 May 1997 14:02:49 -0500 (CDT)

54 lines

RE: Dimensional Stability

[log in to unmask]

Mon, 26 May 1997 12:55:32 +0000

88 lines

New Thread

Disk Drive Loading

Disk Drive Loading

Lee McCuistion <[log in to unmask]>

Wed, 28 May 1997 10:11:33 +0000

55 lines

Re: Disk Drive Loading

[log in to unmask]

Wed, 28 May 1997 14:33:04 -0500

81 lines

New Thread

DMS vs. Electroless copper

DMS vs. Electroless copper

CSS Asia Co., Ltd. <[log in to unmask]>

Wed, 14 May 1997 16:31:34 +0900

52 lines

Re: DMS vs. Electroless copper

Jeff Hardy <[log in to unmask]>

Wed, 14 May 1997 06:35:33 -0400

90 lines

New Thread

Echo

Echo

Doug Jeffery <[log in to unmask]>

Wed, 7 May 1997 04:08:32 -0500 (CDT)

34 lines

New Thread

Electronic system/assembly reliability

Electronic system/assembly reliability

???@???

Thu, 8 May 1997 12:02:14 +0200

46 lines

Re: Electronic system/assembly reliability

Doug McKean <[log in to unmask]>

Thu, 08 May 1997 09:02:56 -0400

85 lines

Re: Electronic system/assembly reliability

bob smith <[log in to unmask]>

Thu, 08 May 97 08:52:09

70 lines

re: Electronic system/assembly reliability

[log in to unmask]

Fri, 9 May 97 10:20 PDT

70 lines

re: Electronic system/assembly reliability

Max Bernhardt <[log in to unmask]>

Fri, 9 May 1997 12:21:00 -0500

117 lines

New Thread

Everrett Charles 9090 Test Fixtures

Everrett Charles 9090 Test Fixtures

Sid Tryzbiak <[log in to unmask]>

Fri, 16 May 1997 18:02:29 -0400

75 lines

Re: Everrett Charles 9090 Test Fixtures

dkorf <[log in to unmask]>

Fri, 16 May 97 17:48:17 PST

124 lines

Re: Everrett Charles 9090 Test Fixtures

Jeff Seeger <[log in to unmask]>

Sun, 18 May 1997 14:10:22 -0400

82 lines

Re: Everrett Charles 9090 Test Fixtures

[log in to unmask]

Mon, 19 May 1997 11:19:26 -0400 (EDT)

44 lines

New Thread

FAB

FAB

Scott B. Westheimer <[log in to unmask]>

Sun, 11 May 1997 07:05:31 +0800

45 lines

Fab

Scott B. Westheimer <[log in to unmask]>

Tue, 13 May 1997 05:10:13 +0800

57 lines

Re: Fab

Jeffery L. Hempton <[log in to unmask]>

Tue, 13 May 1997 07:22:32 -0500

111 lines

FAB

Scott B. Westheimer <[log in to unmask]>

Thu, 15 May 1997 05:08:48 +0800

51 lines

RE: FAB

John Nelson <[log in to unmask]>

Wed, 14 May 1997 07:36:18 -0400

75 lines

New Thread

fab - copper area calculation

fab - copper area calculation

RICK TAORMINO <[log in to unmask]>

Fri, 09 May 1997 06:40:15 -0400

50 lines

Re: fab - copper area calculation

John Parsons <[log in to unmask]>

Fri, 9 May 1997 08:53:43 +0000

91 lines

New Thread

FAB - Scoring PCB panels

FAB - Scoring PCB panels

Ed Gavin <[log in to unmask]>

Fri, 02 May 1997 10:04:10 -0400

42 lines

Re: FAB - Scoring PCB panels

[log in to unmask]

Fri, 2 May 1997 10:41:38 -0700

62 lines

Re: FAB - Scoring PCB panels

Pascal Dornier <[log in to unmask]>

Fri, 02 May 1997 09:19:50 -0700

56 lines

Re: FAB - Scoring PCB panels

Steve Collins <[log in to unmask]>

Fri, 2 May 1997 13:36:33 -0600

91 lines

RE: FAB - Scoring PCB panels

[log in to unmask]

Fri, 02 May 97 16:19:08 EST

67 lines

FAB - Scoring PCB panels

[log in to unmask]

Fri, 2 May 1997 15:44:39 -0500

97 lines

New Thread

Fab Multiwire

Re: Fab Multiwire

Sherman Banks <[log in to unmask]>

02 May 97 08:47:38 PDT

50 lines

RE: FAB Multiwire

Sherman Banks <[log in to unmask]>

02 May 97 10:36:23 PDT

49 lines

New Thread

FAB Prepreg style 2113

Re:FAB Prepreg style 2113

David Taylor <[log in to unmask]>

Wed, 21 May 1997 09:43:34 +1000

46 lines

New Thread

Fab RE IPC-A-600E Haloing

Fab RE IPC-A-600E Haloing

Dave Gardiner <[log in to unmask]>

Tue, 06 May 1997 23:56:16 -0400

47 lines

Re: Fab RE IPC-A-600E Haloing

[log in to unmask]

Wed, 7 May 1997 13:10:53 -0400 (EDT)

56 lines

Re[2]: Fab RE IPC-A-600E Haloing

[log in to unmask]

Fri, 09 May 97 17:52:19 EDT

65 lines

New Thread

Fab re: Haloing

Fab re: Haloing

Dave Gardiner <[log in to unmask]>

Thu, 08 May 1997 08:11:31 -0400

47 lines

New Thread

FAB-Heat Sinking Properties of Copper

FAB-Heat Sinking Properties of Copper

David Taylor <[log in to unmask]>

Wed, 7 May 1997 14:51:24 +1000

68 lines

re: FAB-Heat Sinking Properties of Copper

[log in to unmask]

Thu, 8 May 97 11:13:24 PDT

81 lines

New Thread

Fab: Carbon Ink

Fab: Carbon Ink

Tully, Marti (AZ15) <[log in to unmask]>

16 May 1997 10:14:36 -0500

64 lines

New Thread

FAB: copper checking

FAB: copper checking

Nashua Circuits <[log in to unmask]>

Wed, 07 May 1997 16:40:11 -0400

56 lines

Re: FAB: copper checking

[log in to unmask]

Wed, 7 May 1997 14:42:15 -0800

69 lines

New Thread

FAB: Drill Wander

FAB: Drill Wander

Mark R Ford <[log in to unmask]>

Thu, 1 May 1997 15:27:52 PST

96 lines

Re: FAB: Drill Wander

drilbert <[log in to unmask]>

Thu, 01 May 1997 20:00:15 -0700

117 lines

Re: FAB: Drill Wander

Paul Gould <[log in to unmask]>

Fri, 2 May 1997 07:31:22 +0100

66 lines

Re: FAB: Drill Wander

Mark R Ford <[log in to unmask]>

Thu, 8 May 1997 15:02:34 PST

63 lines

RE: FAB: Drill Wander

Ed Cosper <[log in to unmask]>

Thu, 8 May 1997 15:53:29 -0500

99 lines

Re[2]: FAB: Drill Wander

[log in to unmask]

Fri, 09 May 97 00:05:05 MST

133 lines

New Thread

fab: drilling

fab: drilling

[log in to unmask]

Thu, 29 May 1997 20:10:30 -0400 (EDT)

46 lines

fab: drilling

Jim Herard <[log in to unmask]>

Fri, 30 May 1997 10:28:47 -0400

81 lines

New Thread

FAB: DST foil

FAB: DST foil

Dieter Miese <[log in to unmask]>

Sat, 3 May 1997 12:36:14 -0400

50 lines

New Thread

FAB: HASL mask for Gold Contacts

FAB: HASL mask for Gold Contacts

Paul Gould <[log in to unmask]>

Fri, 23 May 1997 15:19:41 +0100

50 lines

Re: FAB: HASL mask for Gold Contacts

Peter Swanson <[log in to unmask]>

Fri, 23 May 1997 18:29:24 GMT

60 lines

New Thread

FAB: IPC-350-D Photoplotting format

FAB: IPC-350-D Photoplotting format

[log in to unmask]

Thu, 15 May 97 11:32:57 +0200

44 lines

Re: FAB: IPC-350-D Photoplotting format

JoAnn Amerson <[log in to unmask]>

Thu, 15 May 1997 08:52:48 +0000

57 lines

New Thread

FAB: IPC-HF-318 and Teflon Smear

FAB: IPC-HF-318 and Teflon Smear

APeder01 <[log in to unmask]>

Thu, 1 May 1997 17:14:07 -0400

77 lines

Re: FAB: IPC-HF-318 and Teflon Smear

ALAN COCHRANE <[log in to unmask]>

Thu, 01 May 97 18:28:10 PST

107 lines

New Thread

Fab: LPI

Fab: LPI

Joe Lee <[log in to unmask]>

Thu, 8 May 1997 22:33:07 -0700

44 lines

Re: Fab: LPI

[log in to unmask]

Sat, 10 May 1997 17:27:56 -0400 (EDT)

61 lines

Re: Fab: LPI

[log in to unmask]

Mon, 12 May 1997 11:29:18 -0400 (EDT)

83 lines

New Thread

FAB: Marking rejected inner layers.

FAB: Marking rejected inner layers.

Eltek Ltd. - Process Engineering <[log in to unmask]>

Thu, 8 May 1997 12:24:13 +0300 (IDT)

59 lines

New Thread

Fab: Mesogenic Imagable Films

RE: Fab: Mesogenic Imagable Films

Dieter Miese <[log in to unmask]>

Wed, 21 May 1997 18:41:00 -0400

65 lines

New Thread

FAB: Multiwire

FAB: Multiwire

Sherman Banks <[log in to unmask]>

02 May 97 10:17:41 PDT

49 lines

New Thread

FAB: Nitric Acid Strip

FAB: Nitric Acid Strip

[log in to unmask]

Wed, 7 May 1997 19:06:05 -0500

42 lines

FAB: Nitric Acid Strip

[log in to unmask]

Wed, 7 May 1997 19:15:13 -0500

42 lines

Re: FAB: Nitric Acid Strip

Michael Holan <[log in to unmask]>

Thu, 8 May 1997 06:27:18 -0500

85 lines

Re: FAB: Nitric Acid Strip

[log in to unmask]

Fri, 09 May 97 13:47:17 EST

62 lines

Re: FAB: Nitric Acid Strip

[log in to unmask]

Sun, 11 May 1997 05:57:14 -0400 (EDT)

41 lines

New Thread

FAB: Plating maskants

FAB: Plating maskants

Don Browne <[log in to unmask]>

9 May 1997 10:35:33 -0400

49 lines

New Thread

Fab: plating tape alternative

Fab: plating tape alternative

Therese M. Kokocinski <[log in to unmask]>

Fri, 23 May 97 09:58:07 CST

47 lines

Re: Fab: plating tape alternative

Paul Gould <[log in to unmask]>

Sat, 24 May 1997 20:11:16 +0100

66 lines

New Thread

Fab: Plotter Contacts

Fab: Plotter Contacts

Dieter Miese <[log in to unmask]>

Tue, 27 May 1997 22:22:18 -0400

51 lines

New Thread

FAB: Price structure for Flex Ckts

FAB: Price structure for Flex Ckts

Gary Peterson <[log in to unmask]>

Thu, 15 May 1997 13:01:15 -0600

53 lines

New Thread

Fab: Pwb Fabrication Panel Sizes

Fab: Pwb Fabrication Panel Sizes

[log in to unmask]

Thu, 08 May 1997 16:56:47 EDT

58 lines

RE: Fab: Pwb Fabrication Panel Sizes

[log in to unmask]

Fri, 09 May 1997 10:15:21 EDT

121 lines

Re: Fab: Pwb Fabrication Panel Sizes

Paul Gould <[log in to unmask]>

Fri, 9 May 1997 20:49:22 +0100

86 lines

New Thread

Fab: PWB Manufacturing Capability

Fab: PWB Manufacturing Capability

[log in to unmask]

Wed, 14 May 97 14:10:22 PDT

48 lines

Re: Fab: PWB Manufacturing Capability

[log in to unmask]

Wed, 14 May 1997 17:30:58 -0400 (EDT)

42 lines

New Thread

Fab: Reject Codes

Fab: Reject Codes

Todd Rodgers <[log in to unmask]>

Thu, 1 May 1997 22:53:30 -0500

55 lines

Re: Fab: Reject Codes

David Bergman <[log in to unmask]>

Mon, 5 May 1997 11:24:26 -0500 (CDT)

90 lines

New Thread

FAB: REPLY- Prelamination Cleaning

FAB: REPLY- Prelamination Cleaning

[log in to unmask]

Wed, 14 May 1997 16:16:53 -0400 (EDT)

80 lines

New Thread

Fab: Routing

Fab: Routing

Scott B. Westheimer <[log in to unmask]>

Fri, 9 May 1997 04:47:11 +0800

44 lines

Fab: Routing

Scott B. Westheimer <[log in to unmask]>

Thu, 15 May 1997 05:17:57 +0800

45 lines

New Thread

FAB: small pcb "V" score

RE: FAB: small pcb "V" score

[log in to unmask]

Wed, 14 May 97 16:12:26 EST

42 lines

New Thread

FAB: SPC

FAB: SPC

Ed Cosper <[log in to unmask]>

Thu, 8 May 1997 16:39:11 -0500

48 lines

RE: FAB: SPC

Ed Cosper <[log in to unmask]>

Fri, 9 May 1997 11:43:55 -0500

96 lines

New Thread

fab: Touch-up on plating resist

fab: Touch-up on plating resist

donb <[log in to unmask]>

Tue, 27 May 97 14:12:01 EST

46 lines

Re: fab: Touch-up on plating resist

[log in to unmask]

Tue, 27 May 1997 23:37:36 -0400 (EDT)

71 lines

New Thread

Fab: Wanted

Fab: Wanted

Tom Colton <[log in to unmask]>

Thu, 01 May 1997 18:37:07 -0400

44 lines

New Thread

FAB:Drill Wander

FAB:Drill Wander

[log in to unmask]

Thu, 01 May 1997 10:38:00 -0600

41 lines

Re: FAB:Drill Wander

drilbert <[log in to unmask]>

Thu, 01 May 1997 20:01:58 -0700

62 lines

New Thread

FAB:Drill Wander -Reply

FAB:Drill Wander -Reply

George Lubbecke <[log in to unmask]>

Thu, 01 May 1997 15:14:40 -0700

76 lines

Re: FAB:Drill Wander -Reply

drilbert <[log in to unmask]>

Thu, 01 May 1997 19:57:30 -0700

107 lines

New Thread

FAB:Epoxy Paste

FAB:Epoxy Paste

Alfred Kieran Chor <[log in to unmask]>

Mon, 26 May 1997 20:25:04 +0800

42 lines

re: FAB:Epoxy Paste

[log in to unmask]

Wed, 28 May 97 9:08:25 PDT

50 lines

New Thread

FAB:ipc 6012 Interpretation

FAB:ipc 6012 Interpretation

Jim Herard <[log in to unmask]>

Tue, 27 May 1997 15:58:24 -0400

57 lines

Re: FAB:ipc 6012 Interpretation

[log in to unmask]

Tue, 27 May 1997 19:40:26 -0400 (EDT)

52 lines

New Thread

FAB:Precleaning

FAB:Precleaning

[log in to unmask]

Wed, 14 May 1997 14:17:07 +0100

55 lines

Re: FAB:Precleaning

[log in to unmask]

Wed, 14 May 1997 16:10:37 -0400 (EDT)

62 lines

Re: FAB:Precleaning

[log in to unmask]

Wed, 14 May 1997 16:57:03 -0400 (EDT)

38 lines

Re: FAB:Precleaning

[log in to unmask]

Wed, 14 May 1997 17:35:51 -0400 (EDT)

35 lines

Re: FAB:Precleaning

[log in to unmask]

Thu, 15 May 1997 21:49:14 -0400 (EDT)

36 lines

RE: FAB:Precleaning

[log in to unmask]

Thu, 22 May 1997 11:58:44 -0700

61 lines

New Thread

FAB:Precleaning -Reply

FAB:Precleaning -Reply

Ken Bridges <[log in to unmask]>

Thu, 15 May 1997 07:30:19 -0700

81 lines

New Thread

Fab:Re Copper Plating :Tiny Nodules

Fab:Re Copper Plating :Tiny Nodules

[log in to unmask]

Sat, 31 May 97 20:02:54 EST

61 lines

New Thread

Ftp and S-Ftp cables

Ftp and S-Ftp cables

Long Chay Hwan, Tech, CSN <[log in to unmask]>

Thu, 15 May 97 19:29:00 PDT

40 lines

New Thread

ftp/s-ftp cables specifications and differences

ftp/s-ftp cables specifications and differences

Long Chay Hwan, Tech, CSN <[log in to unmask]>

Mon, 19 May 97 08:27:00 PDT

46 lines

New Thread

ftp/sftp cables

ftp/sftp cables

Long Chay Hwan, Tech, CSN <[log in to unmask]>

Thu, 15 May 97 20:49:00 PDT

39 lines

New Thread

Fusued SnPb on 50 uml lines and spaces

Fusued SnPb on 50 uml lines and spaces

[log in to unmask]

Mon, 19 May 1997 11:25:19 -0500

46 lines

Re: Fusued SnPb on 50 uml lines and spaces

Paul Gould <[log in to unmask]>

Mon, 19 May 1997 21:33:33 +0100

68 lines

Re: Fusued SnPb on 50 uml lines and spaces

[log in to unmask]

Tue, 20 May 1997 07:54:22 -0500

101 lines

Re: Fusued SnPb on 50 uml lines and spaces

Paul Gould <[log in to unmask]>

Tue, 20 May 1997 15:21:39 +0100

89 lines

New Thread

FW: Acronyms

FW: Acronyms

William Johnson <[log in to unmask]>

Wed, 14 May 97 21:27:30 UT

81 lines

New Thread

FW: ASSY: Component Prep

FW: ASSY: Component Prep

Art Perez <[log in to unmask]>

Wed, 7 May 1997 06:44:00 -0500

66 lines

FW: ASSY: Component Prep

Stimson, Dwight <[log in to unmask]>

Wed, 7 May 1997 08:54:38 -0400

122 lines

New Thread

FW: Assy: labels on ICs

FW: Assy: labels on ICs

Blanchet,Richard <[log in to unmask]>

Wed, 28 May 1997 08:02:00 -0400 (EDT)

95 lines

New Thread

FW: ASSY: Profiling parts.

FW: ASSY: Profiling parts.

Dhawan, Ashok CA-WINPO2 <[log in to unmask]>

Fri, 30 May 97 19:12:00 GMT

123 lines

New Thread

FW: ASSY:Au/Ni Coated Boards

FW: ASSY:Au/Ni Coated Boards

[log in to unmask]

Thu, 29 May 1997 06:59:52 -0700

98 lines

FW: ASSY:Au/Ni Coated Boards

Paul Terranova <[log in to unmask]>

Thu, 29 May 1997 10:04:33 -0400

97 lines

FW: ASSY:Au/Ni Coated Boards

Ubl, Scott <[log in to unmask]>

Thu, 29 May 97 16:18:00 CDT

119 lines

Re: FW: ASSY:Au/Ni Coated Boards

ddhillma <[log in to unmask]>

Fri, 30 May 97 05:58:02 cst

157 lines

New Thread

FW: component breakage at panel separation station

FW: component breakage at panel separation station

Dhawan, Ashok CA-WINPO2 <[log in to unmask]>

Mon, 05 May 97 11:03:00 GMT

111 lines

New Thread

FW: Conductive Adhesives

FW: Conductive Adhesives

[log in to unmask]

Fri, 02 May 1997 11:37:06 -0700

101 lines

New Thread

FW: Copper Sulphide corrosion

FW: Copper Sulphide corrosion

[log in to unmask]

Thu, 22 May 1997 08:28:43 -0700

119 lines

New Thread

FW: Drill Wander

FW: Drill Wander

William Johnson <[log in to unmask]>

Thu, 1 May 97 20:23:56 UT

74 lines

New Thread

FW: FAB - Scoring PCB panels

FW: FAB - Scoring PCB panels

Dhawan, Ashok CA-WINPO2 <[log in to unmask]>

Mon, 05 May 97 11:03:00 GMT

119 lines

New Thread

FW: FAB: Dross in Solder Joints

FW: FAB: Dross in Solder Joints

[log in to unmask]

Thu, 15 May 1997 10:46:08 -0700

48 lines

Re: FW: FAB: Dross in Solder Joints

ddhillma <[log in to unmask]>

Thu, 15 May 97 13:16:36 cst

101 lines

New Thread

FW: FW(wr): ftp/s-ftp cables specifications and differences

FW: FW(wr): ftp/s-ftp cables specifications and differences

Long Chay Hwan, Tech, CSN <[log in to unmask]>

Mon, 19 May 97 12:52:00 PDT

62 lines

New Thread

Fw: IPC-SM-782 rev A

Fw: IPC-SM-782 rev A

Excalibur Ltd. <[log in to unmask]>

Wed, 21 May 1997 08:10:43 +0200 (IST)

54 lines

New Thread

FW: Just for fun, try it!!

FW: Just for fun, try it!!

Blanchet,Richard <[log in to unmask]>

Wed, 14 May 1997 08:17:00 -0400 (EDT)

72 lines

FW: Just for fun, try it!!

YokeWang Leong <[log in to unmask]>

20 May 97 14:00:15

97 lines

RE: FW: Just for fun, try it!!

Bert Ohlig <[log in to unmask]>

Tue, 20 May 1997 15:28:56 -0700

62 lines

New Thread

FW: Label Specs

FW: Label Specs

Blanchet,Richard <[log in to unmask]>

Thu, 29 May 1997 15:01:00 -0400 (EDT)

85 lines

New Thread

FW: Labeling of PC Boards - Comments-WE ALSO NEED

FW: Labeling of PC Boards - Comments-WE ALSO NEED

Dhawan, Ashok CA-WINPO2 <[log in to unmask]>

Thu, 01 May 97 18:57:00 GMT

82 lines

New Thread

Fw: Message not deliverable

Fw: Message not deliverable

Scott B. Westheimer <[log in to unmask]>

Tue, 13 May 1997 20:09:47 +0800

91 lines

FW: Message not deliverable

Paul Terranova <[log in to unmask]>

Tue, 27 May 1997 09:59:57 -0400

71 lines

New Thread

FW: PCB Testing House

FW: PCB Testing House

Paul Terranova <[log in to unmask]>

Tue, 27 May 1997 09:24:11 -0400

72 lines

New Thread

FW: Question on design software

FW: Question on design software

Ed Cosper <[log in to unmask]>

Thu, 15 May 1997 09:38:23 -0500

53 lines

Re: FW: Question on design software

Neil Diamond <[log in to unmask]>

Thu, 15 May 1997 09:55:01 -0500

75 lines

Re: FW: Question on design software

Wolfgang Schenke <[log in to unmask]>

Thu, 15 May 1997 08:16:08 -0700 (PDT)

87 lines

Re: FW: Question on design software

[log in to unmask]

Thu, 15 May 97 17:05:36 PST

75 lines

New Thread

Fw: Re: GEN: Market Growth Indicators

Fw: Re: GEN: Market Growth Indicators

[log in to unmask]

Thu, 8 May 97 06:01:43 Pacific Daylight Time

118 lines

New Thread

FW: small pcb "V" score

FW: small pcb "V" score

Dhawan, Ashok CA-WINPO2 <[log in to unmask]>

Tue, 20 May 97 18:16:00 GMT

99 lines

New Thread

Fwd: Assy: Intrusive Reflow techniques

Fwd: Assy: Intrusive Reflow techniques

Wedemeyer, Ron <[log in to unmask]>

Thu, 08 May 1997 09:49 WAT

84 lines

New Thread

Fwd: Buried Resistance

Fwd: Buried Resistance

Ohmega Technologies, Inc. <[log in to unmask]>

Mon, 19 May 1997 19:23:40 -0500 (CDT)

78 lines

New Thread

Fwd: FW: Just for fun, try it!!

Fwd: FW: Just for fun, try it!!

Dieter Miese <[log in to unmask]>

Tue, 20 May 1997 07:40:03 -0400

155 lines

New Thread

FWD>ASSY- What is an HSOP ?

FWD>ASSY- What is an HSOP ?

Charles Elliott <[log in to unmask]>

30 May 1997 15:35:44 U

64 lines

New Thread

GEN - Mentor Graphics Conversions

GEN - Mentor Graphics Conversions

Ron Oneal <[log in to unmask]>

Wed, 14 May 1997 10:58:14 -0400

47 lines

Re: GEN - Mentor Graphics Conversions

Mike Wilson <[log in to unmask]>

Thu, 15 May 1997 16:39:23 -0700

71 lines

New Thread

Gen- Durometer Measurement

Gen- Durometer Measurement

Maurice Dore <[log in to unmask]>

Thu, 29 May 1997 14:19:25 GMT

46 lines

New Thread

GEN- H2O Bake out

GEN- H2O Bake out

Gino Cochella <[log in to unmask]>

16 May 1997 12:42:12 -0700

49 lines

Re: GEN- H2O Bake out

[log in to unmask]

Mon, 19 May 97 11:31:13 -0700

108 lines

New Thread

GEN--MIME

GEN--MIME

Bob Lundquist <[log in to unmask]>

Thu, 29 May 97 13:59:00 PDT

56 lines

New Thread

GEN: Acronyms

GEN: Acronyms

John Parsons <[log in to unmask]>

Mon, 12 May 1997 09:57:45 +0000

37 lines

New Thread

GEN: Laminate materials

GEN: Laminate materials

Sheila Smith <[log in to unmask]>

Thu, 15 May 1997 10:02:54 -0400 (EDT)

50 lines

New Thread

GEN: Market Growth Indicators

GEN: Market Growth Indicators

Dieter Miese <[log in to unmask]>

Tue, 6 May 1997 21:46:59 -0400

56 lines

RE: GEN: Market Growth Indicators

Goldman, Patricia J. <[log in to unmask]>

Thu, 08 May 97 08:42:00 PDT

82 lines

New Thread

Gen: Multi-wire

Gen: Multi-wire

Gary Peterson <[log in to unmask]>

Thu, 1 May 1997 10:54:17 -0600

86 lines

New Thread

GEN: No subject

Re: GEN: No subject

[log in to unmask]

06 May 97 07:19:23 EDT

84 lines

New Thread

GEN: Parts Needed

GEN: Parts Needed

Jack Crawford <[log in to unmask]>

Thu, 29 May 1997 14:11:08 -0500

53 lines

New Thread

GEN: Soldering Problem

GEN: Soldering Problem

Denis Meloche <[log in to unmask]>

Mon, 12 May 1997 09:48:21 -0400 (EDT)

52 lines

Re: GEN: Soldering Problem

[log in to unmask]

Mon, 12 May 97 10:13:11 CST

79 lines

New Thread

GEN: Wanted-Guidebook for PCB -Reply

GEN: Wanted-Guidebook for PCB -Reply

ED HARKESS <[log in to unmask]>

Fri, 09 May 1997 08:01:47 -0600

60 lines

New Thread

Gen: Where to post Equipment for sale

Gen: Where to post Equipment for sale

Jeffrey C. Garland <[log in to unmask]>

Thu, 8 May 1997 15:35:34 -0700

43 lines

New Thread

Gen:Lead stiffness

Gen:Lead stiffness

Guenter Grossmann <[log in to unmask]>

Sun, 18 May 1997 15:39:57 +0200

49 lines

New Thread

General Soldering

General Soldering

Valladares, Hector A (FL51) <[log in to unmask]>

Mon, 12 May 1997 10:41:03 -0400

72 lines

Re: General Soldering

ddhillma <[log in to unmask]>

Mon, 12 May 97 16:07:55 cst

106 lines

New Thread

Getek or FR-4?

Getek or FR-4?

[log in to unmask]

Mon, 12 May 1997 16:45:46 -0700

47 lines

New Thread

Gold edge connector

Gold edge connector

Rexcan Circuits <[log in to unmask]>

Thu, 8 May 1997 14:48:39 -0400

47 lines

Re: Gold edge connector

[log in to unmask]

Fri, 9 May 1997 13:44:22 -0400 (EDT)

44 lines

New Thread

Guidelines on ordering electronic mfg equipment

Guidelines on ordering electronic mfg equipment

[log in to unmask]

Thu, 1 May 1997 12:41:13 -0400 (EDT)

40 lines

RE: Guidelines on ordering electronic mfg equipment

Lang, Michael <[log in to unmask]>

Thu, 01 May 97 15:52:00 E

84 lines

New Thread

HAL Solder Bath

HAL Solder Bath

Anil K Singh <[log in to unmask]>

Sun, 18 May 1997 09:22:35 +0530

62 lines

Re: HAL Solder Bath

Paul Gould <[log in to unmask]>

Sun, 18 May 1997 11:56:34 +0100

76 lines

New Thread

Halide Levels

Halide Levels

Denis Meloche <[log in to unmask]>

Mon, 12 May 1997 11:57:19 -0400 (EDT)

42 lines

New Thread

Handling spam

Handling spam

Bob Mesick <[log in to unmask]>

Wed, 14 May 1997 08:15:36 -0700 (PDT)

67 lines

Re: Handling spam

Jeff Seeger <[log in to unmask]>

Wed, 14 May 1997 12:59:17 -0400

69 lines

New Thread

high current tester

high current tester

scott birnbaum <[log in to unmask]>

Mon, 12 May 97 06:31:12 PDT

42 lines

Re: high current tester

jake kelly <[log in to unmask]>

Sat, 17 May 1997 11:50:40 +0100

62 lines

New Thread

Immersion Ni/Au

Immersion Ni/Au

John Gordon <[log in to unmask]>

Tue, 6 May 1997 06:27:04 -0700

48 lines

Re: Immersion Ni/Au

Royce Jones <[log in to unmask]>

Thu, 08 May 1997 21:56:18 -0700

104 lines

New Thread

In-House Hand Soldering Training for ISO ...

In-House Hand Soldering Training for ISO ...

Doug McKean <[log in to unmask]>

Thu, 22 May 1997 10:57:26 -0400

53 lines

Re: In-House Hand Soldering Training for ISO ...

Jack Crawford <[log in to unmask]>

Thu, 22 May 1997 10:35:50 -0500

81 lines

New Thread

info?

info?

[log in to unmask]

2 May 1997 12:14:04 -0400

35 lines

New Thread

information

information

[log in to unmask]

2 May 1997 12:35:51 -0400

38 lines

New Thread

intrusive reflow

intrusive reflow

Gloria Ebert <[log in to unmask]>

Tue, 06 May 1997 07:19:00 -0700

42 lines

Re: intrusive reflow

Johannes Sivula <[log in to unmask]>

Wed, 7 May 1997 14:56:45 +0300

50 lines

RE: Intrusive reflow

Jim Zanolli <[log in to unmask]>

Thu, 08 May 1997 07:24:53 -0400

46 lines

New Thread

Invitation to cooperate to build a printed circuit board manufacturing Plant in Bangladesh.

Invitation to cooperate to build a printed circuit board manufacturing Plant in Bangladesh.

OMNI High Tech Industries Ltd. (OHTIL) <[log in to unmask]>

Mon, 19 May 1997 05:59:54 +0600

333 lines

New Thread

IPC A 600 E

IPC A 600 E

Anil K Singh <[log in to unmask]>

Thu, 22 May 1997 19:11:35 +0530

49 lines

New Thread

IPC A 600 E:vert hasl

IPC A 600 E:vert hasl

Jim Herard <[log in to unmask]>

Thu, 22 May 1997 19:21:12 -0400

78 lines

Re: IPC A 600 E:vert hasl

[log in to unmask]

Fri, 23 May 1997 22:03:02 -0400 (EDT)

42 lines

RE: IPC A 600 E:vert hasl

frp <[log in to unmask]>

Tue, 27 May 1997 17:29:50 +0100

86 lines

Re[3]: IPC A 600 E:vert hasl

ddhillma <[log in to unmask]>

Fri, 30 May 97 06:38:05 cst

124 lines

New Thread

IPC vs. MIL standards

IPC vs. MIL standards

Jack Olson <[log in to unmask]>

Fri, 09 May 1997 14:18:58 -0700

62 lines

Re: IPC vs. MIL standards

David Bergman <[log in to unmask]>

Mon, 12 May 1997 10:45:36 -0500 (CDT)

84 lines

Re: IPC vs. MIL standards

David Bergman <[log in to unmask]>

Mon, 12 May 1997 10:45:36 -0500 (CDT)

90 lines

New Thread

IPC-6012

IPC-6012

Lisa Williams <[log in to unmask]>

Thu, 15 May 1997 12:28:41 -0500 (CDT)

61 lines

New Thread

IPC-SM-782 rev A

IPC-SM-782 rev A

Excalibur Ltd. <[log in to unmask]>

Mon, 19 May 1997 12:11:03 +0200 (IST)

51 lines

Re: IPC-SM-782 rev A

Lisa Williams <[log in to unmask]>

Tue, 27 May 1997 11:22:41 -0500 (CDT)

91 lines

New Thread

IPCchat session announcement

IPCchat session announcement

[log in to unmask]

Mon, 26 May 1997 17:07:25 -0700

63 lines

New Thread

Just for fun, try it

Re[2]: Just for fun, try it

Gloria Ebert <[log in to unmask]>

Wed, 14 May 1997 07:12:00 -0700

103 lines

New Thread

Just for fun, try it!!

Just for fun, try it!!

Lori Jones <[log in to unmask]>

Tue, 13 May 1997 21:45:53 -0700

140 lines

Re: Just for fun, try it!!

[log in to unmask]

Wed, 14 May 1997 08:01:35 +0000

50 lines

Re: Just for fun, try it!!

[log in to unmask]

Wed, 14 May 97 08:21:24 PST

159 lines

Re[2]: Just for fun, try it!!

twoldahl <[log in to unmask]>

Wed, 14 May 97 08:52:55

210 lines

Re: Just for fun, try it!!

Doug McKean <[log in to unmask]>

Wed, 14 May 1997 08:53:55 -0400

81 lines

Re[2]: Just for fun, try it!!

bob smith <[log in to unmask]>

Wed, 14 May 97 08:35:50

73 lines

New Thread

Label Specs

Label Specs

Greg Parke <[log in to unmask]>

Thu, 29 May 1997 14:42:20 -0400

64 lines

New Thread

Labeling of PC Boards - Comments

Labeling of PC Boards - Comments

cbconsul <[log in to unmask]>

Thu, 1 May 1997 13:50:14 -0400 (EDT)

55 lines

New Thread

LPISM Stripping

LPISM Stripping

Anil K Singh <[log in to unmask]>

Sat, 17 May 1997 21:50:57 +0530

46 lines

RE: LPISM Stripping

Bob Oliver, Jr. <[log in to unmask]>

Wed, 28 May 1997 10:31:16 -0500

75 lines

Re[2]: LPISM Stripping

[log in to unmask]

Wed, 28 May 1997 19:12:23 -0500

109 lines

Re[4]: LPISM Stripping

[log in to unmask]

30 May 97 09:29:26 EDT

169 lines

New Thread

Mentor design info extraction tool

Mentor design info extraction tool

Marcel Sansaricq <[log in to unmask]>

Thu, 01 May 1997 15:38:17 -0400

52 lines

Re: Mentor design info extraction tool

Victor Sekishiro <[log in to unmask]>

Thu, 01 May 1997 13:41:22 -0700

72 lines

New Thread

micro via

micro via

Tamir Ben-Shoshan <[log in to unmask]>

Sun, 04 May 97 13:35:34 EST

41 lines

micro via

Tamir Ben-Shoshan <[log in to unmask]>

Sun, 04 May 97 13:29:33 EST

41 lines

micro via

Tamir Ben-Shoshan <[log in to unmask]>

Sun, 04 May 97 13:33:08 EST

41 lines

New Thread

micro via supplier

micro via supplier

[log in to unmask]

Tue, 13 May 1997 07:08:52 EDT

71 lines

New Thread

micro vias

Re: micro vias

[log in to unmask]

Tue, 06 May 97 16:35:20 -0500

83 lines

RE: micro vias

Thomas, Kevin <[log in to unmask]>

Wed, 7 May 1997 10:51:00 -0700

80 lines

Re: micro vias

[log in to unmask]

Fri, 9 May 1997 01:40:11 -0400 (EDT)

33 lines

Re[2]: micro vias

[log in to unmask]

Fri, 09 May 97 17:51:42 EDT

105 lines

New Thread

Microvias

Microvias

[log in to unmask]

Thu, 08 May 97 07:35:03 -0500

49 lines

New Thread

MicroVias supplier wanted

MicroVias supplier wanted

Luc Boschmans <[log in to unmask]>

Mon, 12 May 1997 09:25:15 +0200

53 lines

RE: MicroVias supplier wanted

[log in to unmask]

Mon, 12 May 1997 09:17:41 +0100

54 lines

Re[2]: MicroVias supplier wanted

Tamir Ben-Shoshan <[log in to unmask]>

Tue, 13 May 97 10:13:51 EST

60 lines

Re: MicroVias supplier wanted

Motoyo Wajima <[log in to unmask]>

Fri, 16 May 1997 09:40:06 +0900

84 lines

Re: MicroVias supplier wanted

Ulrich Korndoerfer <[log in to unmask]>

Sat, 17 May 1997 23:48:52 +0200

66 lines

New Thread

MISC: Jupiter Standlupe

MISC: Jupiter Standlupe

Jerry Cupples <[log in to unmask]>

Mon, 12 May 1997 09:28:20 -0500

55 lines

New Thread

More 1/2 oz CU

Re: More 1/2 oz CU

drilbert <[log in to unmask]>

Tue, 27 May 1997 20:28:27 -0700

40 lines

New Thread

Need Advisor Gold to purchase

Need Advisor Gold to purchase

OSCAR <[log in to unmask]>

Mon, 12 May 1997 09:43:27 -0400

65 lines

New Thread

Need help on conversion

Need help on conversion

Ed Cosper <[log in to unmask]>

Mon, 5 May 1997 09:11:03 -0500

40 lines

RE: Need help on conversion

Love, David <[log in to unmask]>

Mon, 05 May 1997 13:52:16 -0700

97 lines

Re[2]: Need help on conversion

Lynch, Lyn <[log in to unmask]>

Mon, 05 May 97 19:19:29

117 lines

Re: Need help on conversion

William T. Taylor <[log in to unmask]>

Tue, 06 May 1997 08:41:00 -0400

59 lines

Re[2]: Need help on conversion

[log in to unmask]

Tue, 6 May 1997 09:05:43 -0500

123 lines

RE: Need help on conversion

Andrew Buonviri <[log in to unmask]>

Tue, 6 May 1997 08:20:21 -0400

135 lines

RE: Need help on conversion

Matthew Weeding <[log in to unmask]>

Tue, 6 May 1997 12:21:39 +1000

147 lines

Re: Need help on conversion

Michael Barmuta <[log in to unmask]>

Tue, 6 May 1997 08:55:26 -0700

74 lines

New Thread

Need help on conversion -Reply

RE: Need help on conversion -Reply

David Anderson <[log in to unmask]>

Tue, 06 May 1997 09:38:52 -0500

76 lines

RE: Need help on conversion -Reply

Lepsche, Thomas G (NM75) <[log in to unmask]>

Tue, 6 May 1997 09:41:57 -0600

117 lines

RE: Need help on conversion -Reply

Andrew Buonviri <[log in to unmask]>

Wed, 7 May 1997 08:28:37 -0400

51 lines

New Thread

No clean flux for airborn boards

No clean flux for airborn boards

Guy keren <[log in to unmask]>

Fri, 9 May 1997 21:30:07 +0300

47 lines

New Thread

No-clean & High Voltage

No-clean & High Voltage

Ron Hollandsworth <[log in to unmask]>

Thu, 08 May 97 14:07:26 -0500

61 lines

New Thread

NON-CONDUCTIVE TIE BARS...

NON-CONDUCTIVE TIE BARS...

Lang, Michael <[log in to unmask]>

Thu, 01 May 97 13:22:00 E

51 lines

New Thread

Non-halogenated fire retardant additives for laminates

Non-halogenated fire retardant additives for laminates

kathy barthman <[log in to unmask]>

Thu, 29 May 1997 08:00:14 -0700

48 lines

New Thread

North Texas Chapter ~ IPC Designers Council Meeting June 5th

North Texas Chapter ~ IPC Designers Council Meeting June 5th

Keith Larson <[log in to unmask]>

Wed, 21 May 1997 13:51:27 -0500

219 lines

North Texas Chapter ~ IPC Designers Council Meeting June 5th

[log in to unmask]

Fri, 30 May 97 17:39:39 CDT

113 lines

New Thread

Numbering of ckts. for traceability.

Numbering of ckts. for traceability.

[log in to unmask]

14 May 97 17:05 GMT+0500

53 lines

Re: Numbering of ckts. for traceability.

[log in to unmask]

Wed, 14 May 1997 17:34:48 -0400 (EDT)

37 lines

New Thread

Old Plating Lines for disposal.

Old Plating Lines for disposal.

Anil K Singh <[log in to unmask]>

Sun, 18 May 1997 08:47:04 +0530

85 lines

New Thread

One,Two and Three lettes

One,Two and Three lettes

KoizumiT <[log in to unmask]>

Fri, 16 May 97 09:16:26 JST

51 lines

New Thread

Palladium Specs

Palladium Specs

mark leasure <[log in to unmask]>

Fri, 16 May 1997 09:22:26 -0700

43 lines

RE: Palladium Specs

Lolmaugh, Scott (AZ15) <[log in to unmask]>

16 May 1997 13:25:21 -0500

78 lines

New Thread

PalPilot

PalPilot

mark leasure <[log in to unmask]>

Thu, 01 May 1997 17:26:06 -0700

44 lines

New Thread

Panel Sizing, pricing program

Panel Sizing, pricing program

Bob Mesick <[log in to unmask]>

Tue, 13 May 1997 21:28:48 -0700 (PDT)

115 lines

New Thread

Panel Sizing, pricing program - Free!(long)

Panel Sizing, pricing program - Free!(long)

Bob Mesick <[log in to unmask]>

Tue, 13 May 1997 20:45:49 -0700 (PDT)

211 lines

New Thread

PBGA warpage (assy)

PBGA warpage (assy)

Geoff Horrocks <[log in to unmask]>

Thu, 22 May 1997 13:16:07 +0000

54 lines

RE: PBGA warpage (assy)

Yuen, Mike <[log in to unmask]>

Thu, 22 May 97 14:00:00 CDT

82 lines

New Thread

PCB DESIGN CONFERENCE WEST

PCB DESIGN CONFERENCE WEST

K.Varadaraj@CADET, India. <[log in to unmask]>

Sat, 24 May 1997 12:43:07 +0530 (IST)

61 lines

New Thread

PCB Material tracking capability

PCB Material tracking capability

???@???

Tue, 13 May 1997 15:55:26 +0000

58 lines

Re: PCB Material tracking capability

[log in to unmask]

Tue, 13 May 1997 08:26:40 -0400 (EDT)

36 lines

New Thread

PCB quality

RE: PCB quality

Poh Kong Hui <[log in to unmask]>

Sat, 3 May 1997 20:22:20 +0800 (SST)

69 lines

RE: PCB quality

R. B. RAJ <[log in to unmask]>

Sat, 3 May 1997 11:55:49 -0400 (EDT)

132 lines

New Thread

PCB Testing House

PCB Testing House

Michael Forrester <[log in to unmask]>

Thu, 22 May 1997 17:24:59 -0400

51 lines

Re: PCB Testing House

[log in to unmask]

Sat, 24 May 1997 18:14:22 -0400 (EDT)

41 lines

New Thread

Pd edge connector

Pd edge connector

Tamir Ben-Shoshan <[log in to unmask]>

(that

40 lines

New Thread

Pd edge connectors

Pd edge connectors

Tamir Ben-Shoshan <[log in to unmask]>

Tue, 13 May 97 08:28:46 EST

41 lines

Re: Pd edge connectors

ddhillma <[log in to unmask]>

Tue, 13 May 97 10:49:05 cst

70 lines

Pd edge connectors

Tamir Ben-Shoshan <[log in to unmask]>

Wed, 14 May 97 11:41:02 EST

41 lines

New Thread

PGA INSERTION Method/ Infor

PGA INSERTION Method/ Infor

Gus Morvillo <[log in to unmask]>

26 May 1997 11:20:03 U

44 lines

Re: PGA INSERTION Method/ Infor

[log in to unmask]

Thu, 29 May 1997 16:00:24 -0400 (EDT)

39 lines

New Thread

PISM/SMOBC

PISM/SMOBC

[log in to unmask]

Wed, 14 May 1997 12:08:12 -0400 (EDT)

34 lines

Re: PISM/SMOBC

[log in to unmask]

Thu, 15 May 1997 02:17:23 -0400 (EDT)

108 lines

New Thread

Plating over Monel

Plating over Monel

[log in to unmask]

Fri, 23 May 97 08:25:31 PST

43 lines

Re: Plating over Monel

ddhillma <[log in to unmask]>

Tue, 27 May 97 08:27:20 cst

74 lines

Re: Plating over Monel

[log in to unmask]

Tue, 27 May 1997 10:57:25 -0400 (EDT)

44 lines

New Thread

plating tape alternative

Re: plating tape alternative

David Taylor <[log in to unmask]>

Tue, 27 May 1997 16:12:39 +1000

52 lines

New Thread

Plating Thickness inside hole walls ; reliability of measurement

Plating Thickness inside hole walls ; reliability of measurement

Anil K Singh <[log in to unmask]>

Thu, 29 May 1997 07:23:29 +0530

52 lines

New Thread

Positional tolerancing

Positional tolerancing

Stephen C Joy <[log in to unmask]>

Tue, 20 May 97 12:00:00 PDT

80 lines

New Thread

Pre-Lamination Cleaning- Avoid it!

Pre-Lamination Cleaning- Avoid it!

[log in to unmask]

Wed, 14 May 97 17:36:34 EDT

57 lines

New Thread

Prep Tools

Prep Tools

Carl Ray <[log in to unmask]>

Wed, 7 May 1997 12:35:28 -0600

52 lines

Re: Prep Tools

Gary Peterson <[log in to unmask]>

Wed, 7 May 1997 11:59:59 -0600

55 lines

Re: Prep Tools

Ploughman, Mark <[log in to unmask]>

Thu, 08 May 97 13:32:52

85 lines

New Thread

Problems with Via in Pads

Problems with Via in Pads

Robert Gordon Furrow <[log in to unmask]>

Thu, 15 May 97 10:00:25 EDT

48 lines

Re: Problems with Via in Pads

dmitchel <[log in to unmask]>

Thu, 15 May 97 08:23:09 PST

69 lines

New Thread

Process - permanganate desmear

Process - permanganate desmear

Duane B. Mahnke <[log in to unmask]>

Sat, 17 May 1997 04:27:00 -0700

95 lines

New Thread

Process: Permanganate Desmear

Process: Permanganate Desmear

Duane B. Mahnke <[log in to unmask]>

Sat, 17 May 1997 03:22:00 -0700

51 lines

New Thread

Published Documents

Published Documents

Baker,Kelly <[log in to unmask]>

Wed, 14 May 1997 13:24:18 -0400

48 lines

New Thread

question

question

Shlomo Gur-Ari <[log in to unmask]>

Wed, 07 May 1997 23:48:42 -0700

53 lines

re: question

Jim Reed <[log in to unmask]>

Wed, 14 May 1997 06:32:28 -0700

87 lines

New Thread

Re- Conductive Adhesiv

Re: Re- Conductive Adhesiv

Charles Elliott <[log in to unmask]>

2 May 1997 17:42:56 -0400

226 lines

New Thread

re-wire wrap

re-wire wrap

[log in to unmask]

Fri, 02 May 1997 09:29:23 EDT

50 lines

New Thread

Re: Design spec

RE: Re: Design spec

Mike Buetow <[log in to unmask]>

Wed, 28 May 1997 09:38:27 -0500 (CDT)

76 lines

New Thread

RE: Design, 1/2 oz CU callout per MIL-P-13949

re: RE: Design, 1/2 oz CU callout per MIL-P-13949

[log in to unmask]

Tue, 27 May 97 16:20:38 PDT

76 lines

New Thread

RE: IPC A 600 E:vert hasl

Re: RE: IPC A 600 E:vert hasl

[log in to unmask]

Thu, 29 May 1997 07:51:57 -0400 (EDT)

87 lines

New Thread

RE: Re:FAB Prepreg style 2113

re: RE: Re:FAB Prepreg style 2113

[log in to unmask]

Mon, 26 May 1997 10:17:23 +0000

93 lines

New Thread

Re:FAB Prepreg style 2113

RE: Re:FAB Prepreg style 2113

[log in to unmask]

Wed, 21 May 1997 8:34:08 +0000

73 lines

New Thread

Re; Solderballs

Re; Solderballs

Ron Hollandsworth <[log in to unmask]>

Mon, 19 May 97 11:21:32 -0500

56 lines

New Thread

Reliability

Reliability

Jim Moffit <[log in to unmask]>

Mon, 19 May 1997 09:50:40 -0500

46 lines

New Thread

Resin Cure

Resin Cure

drilbert <[log in to unmask]>

Sun, 11 May 1997 16:30:42 -0700

38 lines

Re: Resin Cure

[log in to unmask]

Mon, 12 May 1997 17:07:57 -0400 (EDT)

45 lines

New Thread

Resist Strippers

Resist Strippers

[log in to unmask]

Fri, 9 May 1997 16:57:04 -0400 (EDT)

47 lines

New Thread

Rework: IPC-R-700D?

Rework: IPC-R-700D?

[log in to unmask]

Tue, 20 May 97 15:32:13 EST

36 lines

New Thread

Re[2]: LPISM Stripping

Re: Re[2]: LPISM Stripping

[log in to unmask]

Thu, 29 May 1997 09:24:58 -0400 (EDT)

52 lines

Re: Re[2]: LPISM Stripping

annie laberge <[log in to unmask]>

Thu, 29 May 1997 17:01:29 -0400

111 lines

Re: Re[2]: LPISM Stripping

[log in to unmask]

Thu, 29 May 1997 18:24:43 -0400 (EDT)

43 lines

New Thread

Re[2]: small pcb "V" score

Re: Re[2]: small pcb "V" score

[log in to unmask]

Thu, 15 May 1997 08:45:31 -0500

171 lines

New Thread

Rf interference from No cleans (GEN/ASSY/DES)

Re: Rf interference from No cleans (GEN/ASSY/DES)

Phil Bavaro <[log in to unmask]>

Thu, 1 May 1997 12:42:06 -0700

70 lines

Re[2]: Rf interference from No cleans (GEN/ASSY/DES)

Tom Cooper <[log in to unmask]>

Thu, 01 May 97 16:59:42 EST

91 lines

Re: Rf interference from No cleans (GEN/ASSY/DES)

Dwight Mattix <[log in to unmask]>

Fri, 02 May 1997 10:50:23 -0700

88 lines

New Thread

rinse/deburr of small holes

rinse/deburr of small holes

Eltek Ltd. - Process Engineering <[log in to unmask]>

Thu, 8 May 1997 12:24:16 +0300 (IDT)

50 lines

New Thread

RS-274-X Gerber format

RE: RS-274-X Gerber format

Larry Morse <[log in to unmask]>

Wed, 23 Apr 1997 15:01:37 -0800

87 lines

New Thread

SAI test

SAI test

Ed Cosper <[log in to unmask]>

Fri, 23 May 1997 10:57:56 -0500

40 lines

New Thread

Sampling of PWA

Sampling of PWA

Tom Moore <[log in to unmask]>

Tue, 27 May 1997 17:11:44 -0700

50 lines

RE: Sampling of PWA

Darrell Bonzo <[log in to unmask]>

Thu, 29 May 97 7:35

138 lines

New Thread

Screen Printing of pattern for DSPTH

Screen Printing of pattern for DSPTH

Anil K Singh <[log in to unmask]>

Thu, 29 May 1997 07:14:38 +0530

74 lines

Re: Screen Printing of pattern for DSPTH

Paul A Galatis <[log in to unmask]>

Thu, 29 May 1997 10:20:53 -0500

121 lines

New Thread

Second Hand MAchineries

Second Hand MAchineries

K.Varadaraj@CADET, India. <[log in to unmask]>

Sat, 10 May 1997 14:39:00 +0530 (IST)

69 lines

RE: Second Hand MAchineries

Ed Cosper <[log in to unmask]>

Mon, 12 May 1997 09:43:29 -0500

107 lines

New Thread

Shear Test and IBM vibration Test for Ball Grid Array

Shear Test and IBM vibration Test for Ball Grid Array

BRYAN WU <[log in to unmask]>

Tue, 20 May 97 09:52:29

42 lines

New Thread

shore/durometer hardness measurements

RE: shore/durometer hardness measurements

Sheila Smith <[log in to unmask]>

Thu, 29 May 1997 11:18:54 -0400 (EDT)

44 lines

New Thread

SILKSCREENING

SILKSCREENING

[log in to unmask]

Thu, 29 May 1997 07:59:58 -0400 (EDT)

46 lines

Re: SILKSCREENING

sbryan <[log in to unmask]>

Thu, 29 May 97 06:46:30 PST

67 lines

Silkscreening

[log in to unmask]

Thu, 29 May 1997 10:38:48 -0400 (EDT)

46 lines

Re: Silkscreening

[log in to unmask]

Thu, 29 May 1997 15:03:41 -0400 (EDT)

45 lines

New Thread

small pcb "V" score

small pcb "V" score

[log in to unmask]

Tue, 13 May 97 08:22:25 PST

41 lines

RE: small pcb "V" score

Ed Cosper <[log in to unmask]>

Tue, 13 May 1997 08:58:11 -0500

101 lines

Re: small pcb "V" score

Pete Court <[log in to unmask]>

Wed, 14 May 1997 09:31:50 +0100

62 lines

Re[2]: small pcb "V" score

PERARO_DJ <[log in to unmask]>

Wed, 14 May 1997 07:43:23 -0400

88 lines

Re[2]: small pcb "V" score

PERARO_DJ <[log in to unmask]>

Wed, 14 May 1997 08:04:16 -0400

90 lines

Re: small pcb "V" score

Pete Court <[log in to unmask]>

Thu, 15 May 1997 08:50:35 +0100

77 lines

New Thread

SMEMA

SMEMA

[log in to unmask]

Thu, 29 May 97 14:39:14 -0600

43 lines

Re: SMEMA

Johannes Sivula <[log in to unmask]>

Fri, 30 May 1997 08:05:40 +0300

41 lines

New Thread

smobc alternatives

smobc alternatives

[log in to unmask]

Thu, 29 May 1997 10:00:23 -0400

52 lines

New Thread

Sn/Cu intermetallics

Sn/Cu intermetallics

[log in to unmask]

Tue, 13 May 1997 09:37:21 -0400 (EDT)

40 lines

New Thread

Soft Etching

Soft Etching

Bas van Zalk <[log in to unmask]>

Tue, 27 May 1997 14:41:02 +0200

49 lines

New Thread

Solder balls

Solder balls

sam mccorkel <[log in to unmask]>

Wed, 21 May 1997 15:23:53 -0400

44 lines

Re: Solder balls

sbryan <[log in to unmask]>

Thu, 22 May 97 06:05:13 PST

62 lines

Re: Solder balls

[log in to unmask]

Fri, 23 May 1997 06:32:49 -0400 (EDT)

41 lines

RE: Solder balls

D'Auteuil, Gerry <[log in to unmask]>

Fri, 23 May 97 07:31:00 PDT

113 lines

New Thread

Solder balls problem

Solder balls problem

[log in to unmask]

16 May 97 10:59:40 EDT

49 lines

Solder Balls Problem

Kasprzak, Bill (esd) US <[log in to unmask]>

Sat, 17 May 97 07:37:00 PDT

61 lines

Re: Solder balls problem

[log in to unmask]

Mon, 19 May 97 13:27:11 PST

74 lines

New Thread

Solder Paste: Residue

Solder Paste: Residue

Ron Hollandsworth <[log in to unmask]>

Thu, 15 May 97 08:08:27 -0500

58 lines

New Thread

soldermask stripping

soldermask stripping

annie laberge <[log in to unmask]>

Thu, 29 May 1997 17:24:23 -0400

94 lines

New Thread

Solderpaste Viscometers

Solderpaste Viscometers

Greg Parke <[log in to unmask]>

Wed, 21 May 1997 16:33:08 -0400

53 lines

Re: Solderpaste Viscometers

ddhillma <[log in to unmask]>

Thu, 22 May 97 07:43:35 cst

92 lines

New Thread

Stencil opening

Stencil opening

Johannes Sivula <[log in to unmask]>

Mon, 26 May 1997 13:51:09 +0300

62 lines

RE: Stencil opening

JIM ENNIS <[log in to unmask]>

Tue, 27 May 97 07:04:00 PDT

84 lines

New Thread

Supplier

Supplier

[log in to unmask]

Tue, 20 May 1997 09:07:40 -0400 (EDT)

44 lines

re: Supplier

[log in to unmask]

Tue, 20 May 97 9:26:40 EDT

79 lines

Re: Supplier

Robert Welch <[log in to unmask]>

Tue, 20 May 1997 16:35:45 +0000

49 lines

New Thread

Supplier Needed

Supplier Needed

[log in to unmask]

Mon, 12 May 97 11:46:37 CDT

30 lines

New Thread

Surface Mount Devices

Re: Surface Mount Devices

Keith Kraver <[log in to unmask]>

Thu, 29 May 1997 13:59:47 -0400 (EDT)

58 lines

Re: Surface Mount Devices

JoAnn Amerson <[log in to unmask]>

Thu, 29 May 1997 15:33:28 +0000

65 lines

Re: Surface Mount Devices

Keith Kraver <[log in to unmask]>

Thu, 29 May 1997 15:52:00 -0400 (EDT)

74 lines

Re: Surface Mount Devices

[log in to unmask]

Fri, 30 May 1997 10:18:18 -0400 (EDT)

57 lines

Re: Surface Mount Devices

James C. Patten <[log in to unmask]>

Fri, 30 May 97 13:13:51 PDT

56 lines

Re: Surface Mount Devices

[log in to unmask]

Fri, 30 May 1997 17:14:48 -0400 (EDT)

82 lines

New Thread

SV: MicroVias supplier wanted

SV: MicroVias supplier wanted

Lindgren Mats <[log in to unmask]>

Mon, 12 May 1997 11:03:22 +0100

98 lines

New Thread

TEST: Flexible Printed Circuits

TEST: Flexible Printed Circuits

Nelson Calimquim <[log in to unmask]>

Sat, 3 May 1997 11:58:11 -0700

48 lines

Re: TEST: Flexible Printed Circuits

[log in to unmask]

Mon, 05 May 97 08:30:01 EST

70 lines

New Thread

thermal epoxy

thermal epoxy

[log in to unmask]

Tue, 27 May 97 14:40:06 PST

37 lines

New Thread

thickness and tolerances for laminate

thickness and tolerances for laminate

Mira Poberezsky <[log in to unmask]>

Thu, 1 May 97 17:27:07 -0400

45 lines

New Thread

Tin Institute

Tin Institute

[log in to unmask]

Fri, 23 May 1997 07:48:12 -0500

47 lines

Re: Tin Institute

ddhillma <[log in to unmask]>

Fri, 23 May 97 09:07:08 cst

74 lines

New Thread

Tin Whisker

Tin Whisker

[log in to unmask]

Wed, 28 May 1997 14:06:37 -0400 (EDT)

46 lines

Tin Whisker

Jim Herard <[log in to unmask]>

Wed, 28 May 1997 17:53:19 -0400

84 lines

Re: Tin Whisker

[log in to unmask]

Thu, 29 May 1997 16:49:57 -0400 (EDT)

65 lines

Re: Tin Whisker

ddhillma <[log in to unmask]>

Fri, 30 May 97 05:47:17 cst

79 lines

New Thread

UL Requirements for Electronic Hardware

RE: UL Requirements for Electronic Hardware

Ed Cosper <[log in to unmask]>

Wed, 28 May 1997 14:52:31 -0500

89 lines

RE: UL Requirements for Electronic Hardware

John Laur <[log in to unmask]>

Wed, 28 May 1997 15:11:37 -0500

114 lines

New Thread

Unidentified subject!

Unidentified subject!

Harsha Adya <[log in to unmask]>

Sat, 3 May 1997 15:38:25 +0530

52 lines

Unidentified subject!

[log in to unmask]

Sun, 4 May 1997 10:11:21 -0500

49 lines

Unidentified subject!

Tamir Ben-Shoshan <[log in to unmask]>

Sun, 04 May 97 07:47:46 EST

37 lines

Unidentified subject!

Richard Glanz <[log in to unmask]>

Mon, 12 May 1997 22:00:55 -0700

39 lines

Unidentified subject!

Scott B. Westheimer <[log in to unmask]>

Thu, 15 May 1997 05:24:12 +0800

51 lines

Unidentified subject!

Kyle Gulley <[log in to unmask]>

Mon, 19 May 1997 15:33:11 -0700

44 lines

New Thread

Unidentified subject! (IMPEDANCE)

Re: Unidentified subject! (IMPEDANCE)

Andy Burkhardt <[log in to unmask]>

Wed, 21 May 1997 16:02:05 +0100

74 lines

New Thread

visual inspection

visual inspection

[log in to unmask]

Mon, 05 May 97 10:35:29 PST

38 lines

New Thread

Wanted-Guidebook for PCB

Wanted-Guidebook for PCB

KoizumiT <[log in to unmask]>

Fri, 09 May 97 17:24:10 JST

45 lines

re: Wanted-Guidebook for PCB

[log in to unmask]

Fri, 9 May 97 7:21:50 EDT

78 lines

Re: Wanted-Guidebook for PCB

Pratap Singh <[log in to unmask]>

Fri, 09 May 1997 17:15:04 -0700

55 lines

New Thread

WAVE SOLDER SANDBAGS

WAVE SOLDER SANDBAGS

Daryl Muma <[log in to unmask]>

Fri, 16 May 1997 10:36:29 +0000

45 lines

re: WAVE SOLDER SANDBAGS

[log in to unmask]

16 May 97 11:47:31 EDT

61 lines

re: Wave Solder Sandbags

Eholton <[log in to unmask]>

Fri, 16 May 1997 11:27:15 -0500

73 lines

re: Wave Solder Sandbags

[log in to unmask]

16 May 97 14:06:51 EDT

107 lines

Re: WAVE SOLDER SANDBAGS

Peter Swanson <[log in to unmask]>

Mon, 19 May 1997 10:00:24 GMT

70 lines

Re[2]: WAVE SOLDER SANDBAGS

[log in to unmask]

Mon, 19 May 97 11:12:36 PST

84 lines

New Thread

What is ED?

What is ED?

[log in to unmask]

Fri, 30 May 97 11:50:12 MDT

43 lines

Re: What is ED?

[log in to unmask]

Sat, 31 May 1997 11:32:19 -0400 (EDT)

64 lines

New Thread

wire wrap

wire wrap

jake kelly <[log in to unmask]>

Fri, 2 May 1997 11:47:53 +0100

41 lines

New Thread

wire wrap test fixtures.

wire wrap test fixtures.

jake kelly <[log in to unmask]>

Mon, 5 May 1997 10:22:45 +0100

48 lines

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