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Date: | 16 May 1997 12:42:12 -0700 |
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5/16/97 GEN: H2O Bake out
12:40 PM
Hello everybody:
We are trying to determine if a moisture removal bake is necessary for hand (soldering iron) and/or automated (screen print/vapor phase) multilayer PWB assembly.
If baking is required, then what conditions should be used (time, temp, vacuum, etc.)?
What influence does extended storage under ambient conditions (60%R.H. 70oF) have? Does anyone use a drybox for storage?
Once boards entered the assembly area (and baked - if necessary), how long before a re-bake is required?
We primarily use Type GIN glass/polyimide materials for passive chip SMT. Boards that get assembled within a few days after fabrication would probably NOT require a bake, but we have to allow for extended storage - up to 5 years from date of manufacture.
Thank you in advance for any help
Gino Cochella
(310) 814-3955
TRW Inc.
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