(2)Re: FAB: IPC-HF-318 and Teflon Smear (1 Message)
(Fwd) PCB Material tracking capability (1 Message)
(Fwd) Re[2]: small pcb "V" score (1 Message)
(More) In-House Hand Soldering Training for ISO ... (1 Message)
1997 PCB Deesign Conference Proceedings (1 Message)
50um copper and 2 micron tin-lead (1 Message)
90/10 to 63/37 SnPb Comparison (2 Messages)
Acronyms (2 Messages)
admin Re: Handling spam - From IPC Please no more. (1 Message)
Ask for help on barcode labeling (2 Messages)
ASSEM (2 Messages)
assem : Moisture sensitive components (1 Message)
Assem-Baking components (3 Messages)
ASSEM: SMELF reliability (2 Messages)
assem: Temp hardware (4 Messages)
assy - loctite hardware on pcb assemblies (1 Message)
Assy - solder paste deposition (1 Message)
ASSY - TEST - ESS (1 Message)
ASSY 4X standlupe source found (1 Message)
Assy : Action Pin Header (1 Message)
ASSY : SPC (1 Message)
Assy :Conformal coating (1 Message)
Assy BGA soldering standards (2 Messages)
Assy fluxes (1 Message)
ASSY, solder thieves (1 Message)
ASSY: Clamshell cleaning baskets (2 Messages)
ASSY: Component Prep (4 Messages)
Assy: conformal coating (3 Messages)
ASSY: Dull leads (3 Messages)
ASSY: Flex Circuit Routing (1 Message)
Assy: Intrusive Reflow techniques (5 Messages)
Assy: labels on ICs (4 Messages)
ASSY: LITZ WIRE (2 Messages)
ASSY: MOLE temperature probes (6 Messages)
ASSY: PCB Surface Flatness (2 Messages)
ASSY: Profiling parts. (10 Messages)
ASSY: radial components forming tool (1 Message)
ASSY: Seho Wave Solder Machine (2 Messages)
ASSY: SOLDER ALLOY MELTING POINT (2 Messages)
ASSY: solder choices for Elkonite (3 Messages)
ASSY: Soltec wave soldering machine (1 Message)
ASSY:Au/Ni Coated Boards (7 Messages)
ASSY:JumperStaking (2 Messages)
ASSY:SEHO MWM 3100/3200 Soldering System (1 Message)
Auto T-Stamp Retrofit? (2 Messages)
BGA Specs (1 Message)
Buried Resistance (2 Messages)
Burried Capacitance/Burried Resistance (4 Messages)
Call for Papers IPC National Conference on PWB Solderability (1 Message)
CF-8 (1 Message)
Cleaning & Scrubbing (1 Message)
Cleaning in General (1 Message)
Cleanliness Qualification (1 Message)
component breakage at panel separation station (1 Message)
Component breaking off on Cab Maestro 4M (1 Message)
Component Rated Temperatures (2 Messages)
Conductive Adhesives (4 Messages)
conformal coatings and fuji syringes (1 Message)
Copper plating properties (2 Messages)
COPPER PLATING:Tiny nodules in plated through holes (3 Messages)
Copper Sulphide corrosion (5 Messages)
DES - PCB physical characteristics (3 Messages)
DES-Solder Paste Slump (1 Message)
DES: Current carrying capacity of innerlayer planes (2 Messages)
DES: ICT Access on High-Speed Nets (2 Messages)
DES: Re: Design spec (1 Message)
DES: Surface Mount Components (1 Message)
Design spec (2 Messages)
Design, 1/2 oz CU callout per MIL-P-13949 (3 Messages)
Differential Impedance (2 Messages)
Dimensional Stability (2 Messages)
Disk Drive Loading (2 Messages)
DMS vs. Electroless copper (2 Messages)
Drill Wander (1 Message)
Echo (1 Message)
Electronic system/assembly reliability (5 Messages)
Everrett Charles 9090 Test Fixtures (4 Messages)
FAB (5 Messages)
fab - copper area calculation (2 Messages)
FAB - Scoring PCB panels (7 Messages)
FAB Multiwire (2 Messages)
FAB Prepreg style 2113 (3 Messages)
Fab RE IPC-A-600E Haloing (3 Messages)
Fab re: Haloing (1 Message)
FAB-Heat Sinking Properties of Copper (2 Messages)
Fab: Carbon Ink (1 Message)
FAB: copper checking (2 Messages)
FAB: Drill Wander (6 Messages)
fab: drilling (2 Messages)
FAB: Dross in Solder Joints (2 Messages)
FAB: DST foil (1 Message)
FAB: HASL mask for Gold Contacts (2 Messages)
FAB: IPC-350-D Photoplotting format (2 Messages)
FAB: IPC-HF-318 and Teflon Smear (2 Messages)
Fab: LPI (3 Messages)
FAB: Marking rejected inner layers. (1 Message)
Fab: Mesogenic Imagable Films (1 Message)
FAB: Multiwire (1 Message)
FAB: Nitric Acid Strip (5 Messages)
FAB: Plating maskants (1 Message)
Fab: plating tape alternative (2 Messages)
Fab: Plotter Contacts (1 Message)
FAB: Price structure for Flex Ckts (1 Message)
Fab: Pwb Fabrication Panel Sizes (3 Messages)
Fab: PWB Manufacturing Capability (2 Messages)
Fab: Reject Codes (2 Messages)
FAB: REPLY- Prelamination Cleaning (1 Message)
Fab: Routing (2 Messages)
FAB: small pcb "V" score (1 Message)
FAB: SPC (2 Messages)
fab: Touch-up on plating resist (2 Messages)
Fab: Wanted (1 Message)
FAB:Drill Wander (2 Messages)
FAB:Drill Wander -Reply (2 Messages)
FAB:Epoxy Paste (2 Messages)
FAB:ipc 6012 Interpretation (2 Messages)
FAB:Precleaning (6 Messages)
FAB:Precleaning -Reply (1 Message)
Fab:Re Copper Plating :Tiny Nodules (1 Message)
Ftp and S-Ftp cables (1 Message)
ftp/s-ftp cables specifications and differences (1 Message)
ftp/sftp cables (1 Message)
Fusued SnPb on 50 uml lines and spaces (4 Messages)
FW(wr): ftp/s-ftp cables specifications and differences (1 Message)
FWD>ASSY- What is an HSOP ? (1 Message)
GEN - Mentor Graphics Conversions (2 Messages)
Gen- Durometer Measurement (1 Message)
GEN- H2O Bake out (2 Messages)
GEN--MIME (1 Message)
GEN: Acronyms (1 Message)
GEN: Laminate materials (1 Message)
GEN: Market Growth Indicators (3 Messages)
Gen: Multi-wire (1 Message)
GEN: No subject (1 Message)
GEN: Parts Needed (1 Message)
GEN: Soldering Problem (2 Messages)
GEN: Wanted-Guidebook for PCB -Reply (1 Message)
Gen: Where to post Equipment for sale (1 Message)
Gen:Lead stiffness (1 Message)
General Soldering (2 Messages)
Getek or FR-4? (1 Message)
Gold edge connector (2 Messages)
Guidelines on ordering electronic mfg equipment (2 Messages)
HAL Solder Bath (2 Messages)
Halide Levels (1 Message)
Handling spam (2 Messages)
high current tester (2 Messages)
Immersion Ni/Au (2 Messages)
In-House Hand Soldering Training for ISO ... (2 Messages)
info? (1 Message)
information (1 Message)
Intrusive reflow (3 Messages)
Invitation to cooperate to build a printed circuit board manufacturing Plant in Bangladesh. (1 Message)
IPC A 600 E (1 Message)
IPC A 600 E:vert hasl (5 Messages)
IPC vs. MIL standards (3 Messages)
IPC-6012 (1 Message)
IPC-SM-782 rev A (3 Messages)
IPCchat session announcement (1 Message)
Just for fun, try it (1 Message)
Just for fun, try it!! (10 Messages)
Label Specs (2 Messages)
Labeling of PC Boards - Comments (1 Message)
Labeling of PC Boards - Comments-WE ALSO NEED (1 Message)
LPISM Stripping (7 Messages)
Mentor design info extraction tool (2 Messages)
Message not deliverable (2 Messages)
micro via (3 Messages)
micro via supplier (1 Message)
micro vias (4 Messages)
Microvias (1 Message)
MicroVias supplier wanted (5 Messages)
MISC: Jupiter Standlupe (1 Message)
More 1/2 oz CU (1 Message)
Need Advisor Gold to purchase (1 Message)
Need help on conversion (8 Messages)
Need help on conversion -Reply (3 Messages)
No clean flux for airborn boards (1 Message)
No-clean & High Voltage (1 Message)
NON-CONDUCTIVE TIE BARS... (1 Message)
Non-halogenated fire retardant additives for laminates (1 Message)
North Texas Chapter ~ IPC Designers Council Meeting June 5th (2 Messages)
Numbering of ckts. for traceability. (2 Messages)
Old Plating Lines for disposal. (1 Message)
One,Two and Three lettes (1 Message)
Palladium Specs (2 Messages)
PalPilot (1 Message)
Panel Sizing, pricing program (1 Message)
Panel Sizing, pricing program - Free!(long) (1 Message)
PBGA warpage (assy) (2 Messages)
PCB DESIGN CONFERENCE WEST (1 Message)
PCB Material tracking capability (2 Messages)
PCB quality (2 Messages)
PCB Testing House (3 Messages)
Pd edge connector (1 Message)
Pd edge connectors (3 Messages)
PGA INSERTION Method/ Infor (2 Messages)
PISM/SMOBC (2 Messages)
Plating over Monel (3 Messages)
plating tape alternative (1 Message)
Plating Thickness inside hole walls ; reliability of measurement (1 Message)
Positional tolerancing (1 Message)
Pre-Lamination Cleaning- Avoid it! (1 Message)
Prep Tools (3 Messages)
Problems with Via in Pads (2 Messages)
Process - permanganate desmear (1 Message)
Process: Permanganate Desmear (1 Message)
Published Documents (1 Message)
question (2 Messages)
Question on design software (4 Messages)
Re- Conductive Adhesiv (1 Message)
re-wire wrap (1 Message)
Re; Solderballs (1 Message)
Reliability (1 Message)
Resin Cure (2 Messages)
Resist Strippers (1 Message)
Rework: IPC-R-700D? (1 Message)
Rf interference from No cleans (GEN/ASSY/DES) (3 Messages)
rinse/deburr of small holes (1 Message)
RS-274-X Gerber format (1 Message)
SAI test (1 Message)
Sampling of PWA (2 Messages)
Screen Printing of pattern for DSPTH (2 Messages)
Second Hand MAchineries (2 Messages)
Shear Test and IBM vibration Test for Ball Grid Array (1 Message)
shore/durometer hardness measurements (1 Message)
Silkscreening (4 Messages)
small pcb "V" score (8 Messages)
SMEMA (2 Messages)
smobc alternatives (1 Message)
Sn/Cu intermetallics (1 Message)
Soft Etching (1 Message)
Solder balls (4 Messages)
Solder balls problem (3 Messages)
Solder Paste: Residue (1 Message)
soldermask stripping (1 Message)
Solderpaste Viscometers (2 Messages)
Stencil opening (2 Messages)
Supplier (3 Messages)
Supplier Needed (1 Message)
Surface Mount Devices (6 Messages)
SV: MicroVias supplier wanted (1 Message)
TEST: Flexible Printed Circuits (2 Messages)
thermal epoxy (1 Message)
thickness and tolerances for laminate (1 Message)
Tin Institute (2 Messages)
Tin Whisker (4 Messages)
UL Requirements for Electronic Hardware (2 Messages)
Unidentified subject! (6 Messages)
Unidentified subject! (IMPEDANCE) (1 Message)
visual inspection (1 Message)
Wanted-Guidebook for PCB (3 Messages)
WAVE SOLDER SANDBAGS (6 Messages)
What is ED? (2 Messages)
wire wrap (1 Message)
wire wrap test fixtures. (1 Message)