LISTSERV mailing list manager LISTSERV 16.0

Help for TECHNET Archives


TECHNET Archives

TECHNET Archives


August 2007


View:

Show Author | Hide Author
Show Table of Contents | Hide Table of Contents

 

Table of Contents:

"IT"???? (4 messages)
20 solder cycles? (3 messages)
26 AWG HML Wire (4 messages)
Accessing TechNet e-mails remotely (3 messages)
Alternate to rubber boots (4 messages)
Analysts, look here, nice tool for you (6 messages)
Another request (1 message)
Another Request. (3 messages)
Antw: Re: [TN] Lead-Free Problems? and Tin Lead too! (2 messages)
Antw: [TN] EMMI-question (2 messages)
Antw: [TN] SAC Soldered With SnPb (1 message)
Aqueous batch cleaner foaming (12 messages)
automated response (1 message)
Baking out board moisture (16 messages)
Battery recalls (NTC) (3 messages)
Bill Kasprzak is out of the office. (1 message)
Cleaning RoHS Assemblies (2 messages)
Conformal Coating Under Micro-BGAs (2 messages)
CTE Match for Repair (2 messages)
Darrel Therriault is out of the office until 08/13/2007. (1 message)
DDPak diodes in sticks/tubes (6 messages)
Delamination - can it be repaired? (3 messages)
Dent on BGA Pad (9 messages)
Does encapsulation make a part RoHS compliant? (13 messages)
Drill Rework (11 messages)
Dry Cicruit Low Level Contact Resistance of Immersion Silver (2 messages)
Electronic Assembly Services Ohio (4 messages)
EMMI-question (1 message)
ENIG solderability (1 message)
ES Line (1 message)
Ethics Question (6 messages)
Examples of "toe-down" flat ribbon, L and Gull Wing leads (1 message)
Failed Flex Circuit Assembly (4 messages)
Flux Cleaning (2 messages)
Flying Probe Tester (3 messages)
Force needed to remove SMT reel cover tape (5 messages)
FR-4 CARBONIZE TEMP (4 messages)
Friday NTC - water logged cell phone repair (25 messages)
Friday NTC: cool engineer or coolant engineer? (3 messages)
Friday: are you bored? I've something for you (1 message)
Fw: question regarding IPC standard (11 messages)
Henry Rekers is out of the office. (1 message)
Hole drill-Finish size versus min-max lead diameter, (2 messages)
IPC announces Product Compliance with Environmental Regulations webcast series, in December 2007 (1 message)
IPC Design for Assembly, November 12-13, 2007, Houston, TX (1 message)
IPC Design for Manufacture workshop, August 27-28, 2007, Fredericksburg, VA (1 message)
IPC Materials Declaration Workshop Series 8/07-Philadelphia, PA & 11/07-San Jose, CA (1 message)
IPC Materials Declaration Workshops offered in Boston, MA & San Jose, CA (1 message)
IPC PCB Fabrication "Back to the Basics" Webcast Series - Electroplating Technologies, August 23, 2007 (1 message)
IPC PCB Fabrication "Back to the Basics" webcast series continues in August (8/16, 8/23) (1 message)
IPC PCB Fabrication "Back to the Basics" Webcast Series continues, in August!!! (1 message)
IPC PCB Fabrication "Back to the Basics" Webcast Series in August 2007 (1 message)
IPC webcast: China RoHS: An Updated Roadmap to Achieving Compliance and Assessing Risks , 10/10/07 (1 message)
IPC-6012 questions.. (2 messages)
IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall (9 messages)
IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall Separation (7 messages)
IPC/JEDEC International Conference on Lead Free Electronics, 4 & 5 October 2007, Berlin, Germany (1 message)
IPC_SM-840C (3 messages)
IR Thermometer (7 messages)
Is Brian allowed to boast? (4 messages)
Joel Alexander is out of the office. (1 message)
Join IPC in Sarborough, Ontario, Canada, in August, and get up-to-date on Design (1 message)
Kevin--how to submit your comments (1 message)
Lead Contaminated Toys From China... (1 message)
Lead-Free Problems? (15 messages)
Lead-Free Problems? and Tin Lead too! (2 messages)
Mehmet Emin Yaman işyeri dışında. (1 message)
Microscope camera, solution (3 messages)
Microwave Laminate Material (1 message)
Minimum toe fillet for SOT23-3 land pattern (6 messages)
National Physical Laboratory NPL Industry Defect Database (1 message)
Need help locating a shop that does assembly of flex circuits (1 message)
New IPC webcast series in November: Via Hole Filling Technology & Processes (1 message)
New IPC Webcast Series! Via Hole Filling Technology and Processes November 1 & 8, 2007 (1 message)
Non-aqueous cleaning (5 messages)
NTC - hope you are all safe (4 messages)
NTC - Re: [TN] Hot air and Tin Lead too! (2 messages)
NTC Seeking design information on PWB conductor spacing for high voltage (500-1000 VDC) applications (3 messages)
NTC, off-topic, off-colour, Friday joke (6 messages)
NTC-Friday (1 message)
Odd migration (3 messages)
optics (2 messages)
OSP Processing Recommendations (12 messages)
Pad shape for BGA (3 messages)
Pads removed during BGA Repair (5 messages)
Paint spray booths (1 message)
PCB assembly protection for outdoor working under harsh environmental conditions (6 messages)
PCB marking for shop control. (1 message)
PCB matl properties - water effect (8 messages)
PCB matl properties - water effect NTC (9 messages)
PCB Pad Cratering (2 messages)
PCBA shipping packaging specification/ guidelines (1 message)
PCBA storage conditions (1 message)
Plasma "oxidation" (11 messages)
PLCC Socket Pin damage (3 messages)
Press Fit Connector rework (8 messages)
Problems with Memeory modules and sockets (3 messages)
Problems with Memory modules and sockets (2 messages)
PTH integrity (3 messages)
Request for LF shrinkhole or hot tear failure data (2 messages)
resistor codes (7 messages)
reverse engineering, legit style (9 messages)
Rework question (19 messages)
Rework question--No IPC limitations (3 messages)
RF Board Bow and Twist (1 message)
RoHS Compliance (3 messages)
SAC Soldered With SnPb (9 messages)
Scanning Acoustic Microscope (6 messages)
Seeking design information on PWB conductor spacing for high voltage (500-1000 VDC) applications (5 messages)
Silver PCB finish and reliability (question) (10 messages)
Solder mask as an insulator (8 messages)
Solder mask as an insulator - illustration posted (9 messages)
Solder Mask Solvent? (14 messages)
Soldering pure matte tin plated component leads using Sn63Pb37 solder (2 messages)
Standard for tape and reel part (2 messages)
Standard Improvement Form (2 messages)
Strange crystal growth (9 messages)
Suggestions for Pressing in Pins... (3 messages)
SV: [TN] Analysts, look here, nice tool for you (5 messages)
SV: [TN] Friday NTC - water logged cell phone repair (1 message)
SV: [TN] Is Brian allowed to boast? (1 message)
SV: [TN] Microwave Laminate Material (1 message)
SV: [TN] Odd migration (1 message)
SV: [TN] optics (1 message)
SV: [TN] PCB matl properties - water effect NTC (2 messages)
SV: [TN] Plasma "oxidation" (6 messages)
SV: [TN] Rework question (1 message)
SV: [TN] Solder mask as an insulator - illustration posted (1 message)
SV: [TN] SV: [TN] Analysts, look here, nice tool for you (1 message)
SV: [TN] SV: [TN] PCB matl properties - water effect NTC (4 messages)
SV: [TN] The perils of using Alcohol for cleaning (1 message)
SV: [TN] U/S vs liquids vs temp vs cavity efficiency (2 messages)
SV: [TN] U/S vs liquids vs temp vs cavity efficiensy (2 messages)
SV: [TN] [EN] Is Brian allowed to boast? (1 message)
Tacking potting material (8 messages)
The perils of using Alcohol for cleaning (8 messages)
Thermal Back Plane Termination Devices, IPC-A-610D (2 messages)
Through hole soldering of ENIG finish (1 message)
Transfer Check sheet/list (2 messages)
U/S vs liquids vs temp vs cavity efficiency (2 messages)
U/S vs liquids vs temp vs cavity efficiensy (7 messages)
UV epoxy (2 messages)
VACUM CHAMBER (1 message)
vOID IN Micro BGA (6 messages)
Werner Engelmaier contact info (5 messages)
[EN] Is Brian allowed to boast? (5 messages)
[LF] Request for LF shrinkhole or hot tear failure data (4 messages)

LISTSERV Archives

LISTSERV Archives

TECHNET Home

TECHNET Home

Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

"IT"????

Re: "IT"????

Stadem, Richard D.

Thu, 2 Aug 2007 11:00:11 -0500

129 lines

Re: "IT"????

Jack Olson

Thu, 2 Aug 2007 10:47:23 -0500

89 lines

Re: "IT"????

Dave Dixon

Wed, 1 Aug 2007 12:56:52 -0500

74 lines

Re: "IT"????

Jack Olson

Wed, 1 Aug 2007 09:05:36 -0500

79 lines

New Thread

20 solder cycles?

Re: 20 solder cycles?

Whittaker, Dewey (EHCOE)

Fri, 10 Aug 2007 11:23:51 -0700

66 lines

Re: 20 solder cycles?

Steve Kelly

Fri, 10 Aug 2007 14:19:22 -0400

72 lines

20 solder cycles?

Dan Skweres

Fri, 10 Aug 2007 13:57:55 -0400

37 lines

New Thread

26 AWG HML Wire

Re: 26 AWG HML Wire

<>

Mon, 27 Aug 2007 16:30:29 -0500

192 lines

Re: 26 AWG HML Wire

Hogg, Blair K.

Mon, 27 Aug 2007 07:32:17 -0400

135 lines

Re: 26 AWG HML Wire

Steve Gregory

Fri, 24 Aug 2007 13:29:43 -0500

96 lines

26 AWG HML Wire

Donald Kyle

Fri, 24 Aug 2007 11:08:06 -0500

65 lines

New Thread

Accessing TechNet e-mails remotely

Re: Accessing TechNet e-mails remotely

Hogg, Blair K.

Mon, 13 Aug 2007 11:59:11 -0400

115 lines

Re: Accessing TechNet e-mails remotely

Stadem, Richard D.

Mon, 13 Aug 2007 07:46:56 -0500

103 lines

Accessing TechNet e-mails remotely

Terry Kozlyk

Fri, 10 Aug 2007 21:47:05 -0600

76 lines

New Thread

Alternate to rubber boots

Re: Alternate to rubber boots

Douglas O. Pauls

Fri, 31 Aug 2007 11:21:24 -0500

73 lines

Re: Alternate to rubber boots

Steve Gregory

Fri, 31 Aug 2007 08:51:16 -0500

59 lines

Re: Alternate to rubber boots

Stadem, Richard D.

Fri, 31 Aug 2007 08:50:23 -0500

51 lines

Alternate to rubber boots

Gervascio, Thomas

Fri, 31 Aug 2007 09:36:17 -0400

27 lines

New Thread

Analysts, look here, nice tool for you

Re: Analysts, look here, nice tool for you

Whittaker, Dewey (EHCOE)

Tue, 21 Aug 2007 07:00:26 -0700

87 lines

Re: Analysts, look here, nice tool for you

Hernefjord Ingemar

Tue, 21 Aug 2007 15:53:52 +0200

39 lines

Re: Analysts, look here, nice tool for you

Stadem, Richard D.

Tue, 21 Aug 2007 07:22:03 -0500

59 lines

Re: Analysts, look here, nice tool for you

Werner Engelmaier

Tue, 21 Aug 2007 08:17:02 EDT

34 lines

Re: Analysts, look here, nice tool for you

Randy Bock Sr.

Tue, 21 Aug 2007 06:45:10 -0400

85 lines

Analysts, look here, nice tool for you

Hernefjord Ingemar

Tue, 21 Aug 2007 12:19:46 +0200

27 lines

New Thread

Another request

Another request

Dan Skweres

Tue, 14 Aug 2007 10:42:03 -0400

23 lines

New Thread

Another Request.

Re: Another Request.

Hernefjord Ingemar

Tue, 14 Aug 2007 08:59:40 +0200

66 lines

Re: Another Request.

Chuck Brummer

Mon, 13 Aug 2007 14:46:57 -0700

86 lines

Another Request.

Dan Skweres

Mon, 13 Aug 2007 15:25:02 -0400

36 lines

New Thread

Antw: Re: [TN] Lead-Free Problems? and Tin Lead too!

Re: Antw: Re: [TN] Lead-Free Problems? and Tin Lead too!

Mike Fenner

Wed, 15 Aug 2007 15:46:28 +0100

135 lines

Antw: Re: [TN] Lead-Free Problems? and Tin Lead too!

Guenter Grossmann

Wed, 15 Aug 2007 16:18:16 +0200

94 lines

New Thread

Antw: [TN] EMMI-question

Re: Antw: [TN] EMMI-question

Hernefjord Ingemar

Wed, 22 Aug 2007 09:43:22 +0200

95 lines

Antw: [TN] EMMI-question

Guenter Grossmann

Wed, 22 Aug 2007 09:18:05 +0200

73 lines

New Thread

Antw: [TN] SAC Soldered With SnPb

Antw: [TN] SAC Soldered With SnPb

Guenter Grossmann

Wed, 15 Aug 2007 16:23:49 +0200

73 lines

New Thread

Aqueous batch cleaner foaming

Re: Aqueous batch cleaner foaming

Mike Fenner

Wed, 15 Aug 2007 15:05:21 +0100

103 lines

Re: Aqueous batch cleaner foaming

R Sedlak

Tue, 14 Aug 2007 10:00:28 -0700

52 lines

Re: Aqueous batch cleaner foaming

Stephen Pence

Tue, 14 Aug 2007 11:06:42 -0400

219 lines

Re: Aqueous batch cleaner foaming

Rob Strecker

Tue, 14 Aug 2007 08:29:59 -0600

164 lines

Re: Aqueous batch cleaner foaming

Whittaker, Dewey (EHCOE)

Tue, 14 Aug 2007 06:53:50 -0700

180 lines

Re: Aqueous batch cleaner foaming

R Sedlak

Tue, 14 Aug 2007 02:52:59 -0700

94 lines

Re: Aqueous batch cleaner foaming

Hernefjord Ingemar

Tue, 14 Aug 2007 09:50:14 +0200

148 lines

Re: Aqueous batch cleaner foaming

Brian Ellis

Tue, 14 Aug 2007 10:33:46 +0300

130 lines

Re: Aqueous batch cleaner foaming

Hernefjord Ingemar

Tue, 14 Aug 2007 09:10:46 +0200

101 lines

Re: Aqueous batch cleaner foaming

Brian Ellis

Tue, 14 Aug 2007 10:04:30 +0300

82 lines

Re: Aqueous batch cleaner foaming

R Sedlak

Mon, 13 Aug 2007 16:39:06 -0700

77 lines

Aqueous batch cleaner foaming

Rob Strecker

Mon, 13 Aug 2007 16:11:55 -0600

43 lines

New Thread

automated response

automated response

Vinit Verma

Tue, 28 Aug 2007 23:42:02 +0530

28 lines

New Thread

Baking out board moisture

Re: Baking out board moisture

Larry Dzaugis

Wed, 29 Aug 2007 15:30:06 -0500

31 lines

Re: Baking out board moisture

Whittaker, Dewey (EHCOE)

Wed, 29 Aug 2007 06:35:29 -0700

82 lines

Re: Baking out board moisture

Werner Engelmaier

Wed, 29 Aug 2007 07:23:17 EDT

31 lines

Re: Baking out board moisture

Hernefjord Ingemar

Wed, 29 Aug 2007 08:03:26 +0200

54 lines

Re: Baking out board moisture

Werner Engelmaier

Tue, 28 Aug 2007 18:34:35 EDT

34 lines

Re: Baking out board moisture

Rob Strecker

Tue, 28 Aug 2007 16:10:07 -0600

69 lines

Re: Baking out board moisture

Werner Engelmaier

Tue, 28 Aug 2007 16:22:22 EDT

34 lines

Re: Baking out board moisture

Ted Tontis

Tue, 28 Aug 2007 13:15:45 -0500

104 lines

Re: Baking out board moisture

Hernefjord Ingemar

Tue, 28 Aug 2007 08:47:09 +0200

79 lines

Re: Baking out board moisture

Werner Engelmaier

Fri, 24 Aug 2007 11:52:05 EDT

33 lines

Re: Baking out board moisture

badri

Fri, 24 Aug 2007 15:04:16 +0530

195 lines

Re: Baking out board moisture

Hernefjord Ingemar

Fri, 24 Aug 2007 09:14:31 +0200

151 lines

Re: Baking out board moisture

Fox, Ian

Fri, 24 Aug 2007 07:53:05 +0100

119 lines

Re: Baking out board moisture

Leo Higgins

Thu, 23 Aug 2007 23:11:43 -0700

93 lines

Re: Baking out board moisture

Hernefjord Ingemar

Fri, 24 Aug 2007 08:03:21 +0200

87 lines

Baking out board moisture

Rob Strecker

Thu, 23 Aug 2007 12:03:48 -0600

42 lines

New Thread

Battery recalls (NTC)

Re: Battery recalls (NTC)

Phil Nutting

Wed, 15 Aug 2007 16:17:20 -0400

100 lines

Re: Battery recalls (NTC)

Hogg, Blair K.

Wed, 15 Aug 2007 16:13:38 -0400

70 lines

Battery recalls (NTC)

Tempea, Ioan

Wed, 15 Aug 2007 15:15:07 -0400

33 lines

New Thread

Bill Kasprzak is out of the office.

Bill Kasprzak is out of the office.

Bill Kasprzak

Thu, 30 Aug 2007 01:00:39 -0400

26 lines

New Thread

Cleaning RoHS Assemblies

Re: Cleaning RoHS Assemblies

Brian Ellis

Fri, 24 Aug 2007 09:42:15 +0300

59 lines

Cleaning RoHS Assemblies

Paymon Sani

Thu, 23 Aug 2007 11:11:53 -0400

35 lines

New Thread

Conformal Coating Under Micro-BGAs

Re: Conformal Coating Under Micro-BGAs

John Burke

Fri, 3 Aug 2007 09:32:27 -0700

63 lines

Conformal Coating Under Micro-BGAs

Louis, Edwin @ CSE

Fri, 3 Aug 2007 08:32:04 -0400

25 lines

New Thread

CTE Match for Repair

Re: CTE Match for Repair

Wayne Thayer

Fri, 17 Aug 2007 08:26:24 -0400

60 lines

CTE Match for Repair

Jay Otts

Thu, 16 Aug 2007 19:22:36 -0500

29 lines

New Thread

Darrel Therriault is out of the office until 08/13/2007.

Darrel Therriault is out of the office until 08/13/2007.

Darrel Therriault

Fri, 10 Aug 2007 00:25:42 -0700

24 lines

New Thread

DDPak diodes in sticks/tubes

Re: DDPak diodes in sticks/tubes

Stadem, Richard D.

Thu, 16 Aug 2007 08:39:15 -0500

127 lines

Re: DDPak diodes in sticks/tubes

Davis, Larry

Thu, 16 Aug 2007 06:32:11 -0700

104 lines

Re: DDPak diodes in sticks/tubes

Davis, Larry

Thu, 16 Aug 2007 06:27:49 -0700

123 lines

Re: DDPak diodes in sticks/tubes

Yannick Brisson

Wed, 15 Aug 2007 15:23:34 -0400

76 lines

Re: DDPak diodes in sticks/tubes

Tempea, Ioan

Wed, 15 Aug 2007 15:00:55 -0400

87 lines

DDPak diodes in sticks/tubes

Davis, Larry

Wed, 15 Aug 2007 11:50:13 -0700

43 lines

New Thread

Delamination - can it be repaired?

Re: Delamination - can it be repaired?

Scott Westheimer

Thu, 16 Aug 2007 16:09:42 -0400

65 lines

Re: Delamination - can it be repaired?

Stadem, Richard D.

Thu, 16 Aug 2007 12:44:05 -0500

83 lines

Delamination - can it be repaired?

Bob Perkins

Thu, 16 Aug 2007 10:18:21 -0700

55 lines

New Thread

Dent on BGA Pad

Re: Dent on BGA Pad

Kane, Amol (349)

Tue, 7 Aug 2007 11:27:52 -0400

304 lines

Re: Dent on BGA Pad

Whittaker, Dewey (EHCOE)

Tue, 7 Aug 2007 07:18:07 -0700

269 lines

Re: Dent on BGA Pad

Kevin Glidden

Tue, 7 Aug 2007 10:02:38 -0400

212 lines

Re: Dent on BGA Pad

Victor G. Hernandez

Tue, 7 Aug 2007 08:59:36 -0500

183 lines

Re: Dent on BGA Pad

Kane, Amol (349)

Tue, 7 Aug 2007 09:17:36 -0400

176 lines

Re: Dent on BGA Pad

Kerry McMullen

Tue, 7 Aug 2007 08:44:10 -0400

256 lines

Re: Dent on BGA Pad

Steve Gregory

Tue, 7 Aug 2007 07:26:10 -0500

152 lines

Re: Dent on BGA Pad

Victor G. Hernandez

Tue, 7 Aug 2007 06:44:57 -0500

79 lines

Dent on BGA Pad

Kane, Amol (349)

Tue, 7 Aug 2007 07:42:09 -0400

51 lines

New Thread

Does encapsulation make a part RoHS compliant?

Re: Does encapsulation make a part RoHS compliant?

Ian Hanna

Wed, 15 Aug 2007 14:43:29 -0400

151 lines

Re: Does encapsulation make a part RoHS compliant?

Ryan Grant

Wed, 15 Aug 2007 11:33:32 -0600

282 lines

Re: Does encapsulation make a part RoHS compliant?

John Burke

Wed, 15 Aug 2007 10:17:16 -0700

239 lines

Re: Does encapsulation make a part RoHS compliant?

Phil Nutting

Wed, 15 Aug 2007 13:10:14 -0400

237 lines

Re: Does encapsulation make a part RoHS compliant?

Ryan Grant

Wed, 15 Aug 2007 11:04:07 -0600

206 lines

Re: Does encapsulation make a part RoHS compliant?

Phil Nutting

Wed, 15 Aug 2007 13:02:42 -0400

126 lines

Re: Does encapsulation make a part RoHS compliant?

John Burke

Wed, 15 Aug 2007 09:47:21 -0700

153 lines

Re: Does encapsulation make a part RoHS compliant?

John Burke

Wed, 15 Aug 2007 09:47:21 -0700

93 lines

Re: Does encapsulation make a part RoHS compliant?

Mike Fenner

Wed, 15 Aug 2007 17:14:52 +0100

118 lines

Re: Does encapsulation make a part RoHS compliant?

Lenny Carter

Wed, 15 Aug 2007 12:10:13 -0500

120 lines

Re: Does encapsulation make a part RoHS compliant?

Eric CHRISTISON

Wed, 15 Aug 2007 15:59:37 +0100

81 lines

Re: Does encapsulation make a part RoHS compliant?

Randy Bock Sr.

Wed, 15 Aug 2007 10:56:32 -0400

112 lines

Does encapsulation make a part RoHS compliant?

Phil Nutting

Wed, 15 Aug 2007 10:50:46 -0400

51 lines

New Thread

Drill Rework

Re: Drill Rework

Peter Vigneau

Thu, 16 Aug 2007 11:26:24 -0400

326 lines

Re: Drill Rework

Kerry McMullen

Thu, 16 Aug 2007 08:16:59 -0400

270 lines

Re: Drill Rework

Phil Nutting

Thu, 16 Aug 2007 07:52:57 -0400

224 lines

Re: Drill Rework

Wayne Thayer

Wed, 15 Aug 2007 22:08:43 -0400

237 lines

Re: Drill Rework

Whittaker, Dewey (EHCOE)

Wed, 15 Aug 2007 14:20:47 -0700

198 lines

Re: Drill Rework

Scott Westheimer

Wed, 15 Aug 2007 16:35:15 -0400

47 lines

Re: Drill Rework

Tony Steinke

Wed, 15 Aug 2007 17:27:55 -0400

68 lines

Re: Drill Rework

Stadem, Richard D.

Wed, 15 Aug 2007 13:59:42 -0500

104 lines

Re: Drill Rework

Stadem, Richard D.

Wed, 15 Aug 2007 13:55:18 -0500

82 lines

Re: Drill Rework

Phil Nutting

Wed, 15 Aug 2007 14:33:05 -0400

77 lines

Drill Rework

Kerry McMullen

Wed, 15 Aug 2007 14:27:39 -0400

39 lines

New Thread

Dry Cicruit Low Level Contact Resistance of Immersion Silver

Re: Dry Cicruit Low Level Contact Resistance of Immersion Silver

John Burke

Wed, 8 Aug 2007 12:25:51 -0700

73 lines

Dry Cicruit Low Level Contact Resistance of Immersion Silver

Gerald Gagnon

Wed, 8 Aug 2007 14:56:56 -0400

39 lines

New Thread

Electronic Assembly Services Ohio

Re: Electronic Assembly Services Ohio

Hogg, Blair K.

Tue, 28 Aug 2007 07:35:50 -0400

87 lines

Re: Electronic Assembly Services Ohio

Steve Smith

Mon, 27 Aug 2007 17:54:07 -0400

84 lines

Re: Electronic Assembly Services Ohio

<>

Mon, 27 Aug 2007 16:32:30 -0500

94 lines

Electronic Assembly Services Ohio

Tom Stearns

Mon, 27 Aug 2007 16:51:25 -0400

33 lines

New Thread

EMMI-question

EMMI-question

Hernefjord Ingemar

Wed, 22 Aug 2007 08:19:57 +0200

30 lines

New Thread

ENIG solderability

Re: ENIG solderability

Hogg, Blair K.

Wed, 1 Aug 2007 08:16:19 -0400

140 lines

New Thread

ES Line

ES Line

Greg Triggs

Fri, 31 Aug 2007 10:23:43 -0700

25 lines

New Thread

Ethics Question

Re: Ethics Question

Whittaker, Dewey (EHCOE)

Thu, 9 Aug 2007 11:07:27 -0700

179 lines

Re: Ethics Question

Richard Olsen

Thu, 9 Aug 2007 10:54:31 -0700

134 lines

Re: Ethics Question

Douglas O. Pauls

Thu, 9 Aug 2007 06:43:08 -0500

110 lines

Re: Ethics Question

Bernard Kessler

Wed, 8 Aug 2007 15:23:17 -0700

94 lines

Re: Ethics Question

R Sedlak

Wed, 8 Aug 2007 15:08:26 -0700

60 lines

Ethics Question

Douglas O. Pauls

Wed, 8 Aug 2007 16:44:31 -0500

37 lines

New Thread

Examples of "toe-down" flat ribbon, L and Gull Wing leads

Examples of "toe-down" flat ribbon, L and Gull Wing leads

Joe Macko

Fri, 17 Aug 2007 16:08:36 -0700

39 lines

New Thread

Failed Flex Circuit Assembly

Re: Failed Flex Circuit Assembly

Wayne Thayer

Thu, 9 Aug 2007 09:17:47 -0400

174 lines

Re: Failed Flex Circuit Assembly

Steve Kelly

Thu, 9 Aug 2007 08:41:26 -0400

141 lines

Re: Failed Flex Circuit Assembly

Wayne Thayer

Thu, 9 Aug 2007 00:02:00 -0400

126 lines

Failed Flex Circuit Assembly

Steve Kelly

Wed, 8 Aug 2007 17:05:28 -0400

66 lines

New Thread

Flux Cleaning

Re: Flux Cleaning

Stadem, Richard D.

Tue, 7 Aug 2007 07:54:46 -0500

53 lines

Flux Cleaning

jonathan noquil

Tue, 7 Aug 2007 11:16:13 +0800

29 lines

New Thread

Flying Probe Tester

Re: Flying Probe Tester

Kerry McMullen

Thu, 9 Aug 2007 09:32:29 -0400

102 lines

Re: Flying Probe Tester

Syed Ahmad

Wed, 8 Aug 2007 13:23:23 -0500

80 lines

Flying Probe Tester

Tim Mack

Wed, 8 Aug 2007 11:28:46 -0500

51 lines

New Thread

Force needed to remove SMT reel cover tape

Re: Force needed to remove SMT reel cover tape

mech_eng

Thu, 30 Aug 2007 08:34:49 +0200

107 lines

Re: Force needed to remove SMT reel cover tape

Joel Alexander

Wed, 29 Aug 2007 10:37:14 -0400

115 lines

Re: Force needed to remove SMT reel cover tape

Jerry Dengler

Wed, 29 Aug 2007 07:51:07 -0400

74 lines

Re: Force needed to remove SMT reel cover tape

Guy Ramsey

Wed, 29 Aug 2007 07:29:15 -0400

64 lines

Force needed to remove SMT reel cover tape

Bev Christian

Tue, 28 Aug 2007 17:20:11 -0400

40 lines

New Thread

FR-4 CARBONIZE TEMP

Re: FR-4 CARBONIZE TEMP

Victor G. Hernandez

Wed, 1 Aug 2007 07:33:50 -0500

121 lines

Re: FR-4 CARBONIZE TEMP

Ido Mashall

Wed, 1 Aug 2007 15:22:28 +0300

82 lines

Re: FR-4 CARBONIZE TEMP

Brian Ellis

Wed, 1 Aug 2007 15:08:28 +0300

63 lines

FR-4 CARBONIZE TEMP

Wood, Kenneth

Wed, 1 Aug 2007 07:58:31 -0400

38 lines

New Thread

Friday NTC - water logged cell phone repair

Re: Friday NTC - water logged cell phone repair

Werner Engelmaier

Mon, 13 Aug 2007 16:42:56 EDT

31 lines

Re: Friday NTC - water logged cell phone repair

Stadem, Richard D.

Mon, 13 Aug 2007 13:02:28 -0500

238 lines

Re: Friday NTC - water logged cell phone repair

Whittaker, Dewey (EHCOE)

Mon, 13 Aug 2007 10:56:46 -0700

241 lines

Re: Friday NTC - water logged cell phone repair

John Burke

Mon, 13 Aug 2007 10:50:18 -0700

209 lines

Re: Friday NTC - water logged cell phone repair

John Burke

Mon, 13 Aug 2007 10:37:16 -0700

175 lines

Re: Friday NTC - water logged cell phone repair

Whittaker, Dewey (EHCOE)

Mon, 13 Aug 2007 10:28:11 -0700

228 lines

Re: Friday NTC - water logged cell phone repair

Phil Nutting

Mon, 13 Aug 2007 13:20:52 -0400

202 lines

Re: Friday NTC - water logged cell phone repair

Douglas O. Pauls

Mon, 13 Aug 2007 11:54:21 -0500

191 lines

Re: Friday NTC - water logged cell phone repair

Whittaker, Dewey (EHCOE)

Mon, 13 Aug 2007 08:44:20 -0700

175 lines

Re: Friday NTC - water logged cell phone repair

Gary Crowell

Mon, 13 Aug 2007 09:27:16 -0600

146 lines

Re: Friday NTC - water logged cell phone repair

Whittaker, Dewey (EHCOE)

Fri, 10 Aug 2007 11:21:08 -0700

187 lines

Re: Friday NTC - water logged cell phone repair

Syed Ahmad

Fri, 10 Aug 2007 09:51:44 -0500

191 lines

Re: Friday NTC - water logged cell phone repair

Bev Christian

Fri, 10 Aug 2007 10:08:07 -0400

190 lines

Re: Friday NTC - water logged cell phone repair

Whittaker, Dewey (EHCOE)

Fri, 10 Aug 2007 07:00:31 -0700

151 lines

Re: Friday NTC - water logged cell phone repair

Douglas O. Pauls

Fri, 10 Aug 2007 08:56:28 -0500

121 lines

Re: Friday NTC - water logged cell phone repair

David Tremmel

Fri, 10 Aug 2007 08:53:38 -0500

119 lines

Re: Friday NTC - water logged cell phone repair

Whittaker, Dewey (EHCOE)

Fri, 10 Aug 2007 06:45:28 -0700

77 lines

Re: Friday NTC - water logged cell phone repair

Hogg, Blair K.

Fri, 10 Aug 2007 09:36:34 -0400

89 lines

Re: Friday NTC - water logged cell phone repair

Bev Christian

Fri, 10 Aug 2007 08:48:07 -0400

96 lines

Re: Friday NTC - water logged cell phone repair

Dennis Fritz

Fri, 10 Aug 2007 08:37:14 EDT

41 lines

Re: Friday NTC - water logged cell phone repair

Anil Kher

Fri, 10 Aug 2007 17:39:17 +0530

92 lines

Re: Friday NTC - water logged cell phone repair

Brian Ellis

Fri, 10 Aug 2007 14:27:27 +0300

65 lines

Re: Friday NTC - water logged cell phone repair

Braddock, Iain

Fri, 10 Aug 2007 11:30:36 +0100

165 lines

Re: Friday NTC - water logged cell phone repair

Randy Bock Sr.

Fri, 10 Aug 2007 06:04:05 -0400

105 lines

Friday NTC - water logged cell phone repair

Anil Kher

Fri, 10 Aug 2007 12:51:56 +0530

43 lines

New Thread

Friday NTC: cool engineer or coolant engineer?

Re: Friday NTC: cool engineer or coolant engineer?

Werner Engelmaier

Fri, 24 Aug 2007 11:21:40 EDT

32 lines

Re: Friday NTC: cool engineer or coolant engineer?

Gary Crowell

Fri, 24 Aug 2007 09:07:40 -0600

38 lines

Friday NTC: cool engineer or coolant engineer?

Hernefjord Ingemar

Fri, 24 Aug 2007 12:19:40 +0200

262 lines

New Thread

Friday: are you bored? I've something for you

Friday: are you bored? I've something for you

Hfjord

Fri, 17 Aug 2007 16:42:30 +0200

27 lines

New Thread

Fw: question regarding IPC standard

Re: Fw: question regarding IPC standard

Kevin Glidden

Tue, 28 Aug 2007 08:04:33 -0400

281 lines

Re: Fw: question regarding IPC standard

Stadem, Richard D.

Tue, 28 Aug 2007 06:43:41 -0500

287 lines

Re: Fw: question regarding IPC standard

Cagle, James

Mon, 27 Aug 2007 15:11:08 -0700

298 lines

Re: Fw: question regarding IPC standard

Hogg, Blair K.

Mon, 27 Aug 2007 10:25:13 -0400

259 lines

Re: Fw: question regarding IPC standard

Gerald Bogert

Sun, 26 Aug 2007 15:51:16 -0400

74 lines

Re: Fw: question regarding IPC standard

Bev Christian

Thu, 23 Aug 2007 16:21:45 -0400

220 lines

Re: Fw: question regarding IPC standard

Roberts, Jon

Thu, 23 Aug 2007 15:18:49 -0500

183 lines

Re: Fw: question regarding IPC standard

Graham Naisbitt

Thu, 23 Aug 2007 18:09:05 +0100

145 lines

Re: Fw: question regarding IPC standard

Roger Stoops

Thu, 23 Aug 2007 09:42:17 -0400

75 lines

Re: Fw: question regarding IPC standard

Bev Christian

Thu, 23 Aug 2007 09:23:30 -0400

78 lines

Fw: question regarding IPC standard

Bob Arciolla

Thu, 23 Aug 2007 09:07:43 -0500

28 lines

New Thread

Henry Rekers is out of the office.

Henry Rekers is out of the office.

<>

Fri, 31 Aug 2007 04:00:28 -0700

23 lines

New Thread

Hole drill-Finish size versus min-max lead diameter,

Re: Hole drill-Finish size versus min-max lead diameter,

Whittaker, Dewey (EHCOE)

Mon, 6 Aug 2007 13:28:03 -0700

80 lines

Hole drill-Finish size versus min-max lead diameter,

Victor G. Hernandez

Mon, 6 Aug 2007 13:48:12 -0500

42 lines

New Thread

IPC announces Product Compliance with Environmental Regulations webcast series, in December 2007

IPC announces Product Compliance with Environmental Regulations webcast series, in December 2007

Tina Nerad

Tue, 28 Aug 2007 15:00:12 -0500

99 lines

New Thread

IPC Design for Assembly, November 12-13, 2007, Houston, TX

IPC Design for Assembly, November 12-13, 2007, Houston, TX

Tina Nerad

Fri, 31 Aug 2007 10:00:53 -0500

51 lines

New Thread

IPC Design for Manufacture workshop, August 27-28, 2007, Fredericksburg, VA

IPC Design for Manufacture workshop, August 27-28, 2007, Fredericksburg, VA

Tina Nerad

Thu, 23 Aug 2007 13:48:51 -0500

52 lines

New Thread

IPC Materials Declaration Workshop Series 8/07-Philadelphia, PA & 11/07-San Jose, CA

IPC Materials Declaration Workshop Series 8/07-Philadelphia, PA & 11/07-San Jose, CA

Tina Nerad

Thu, 2 Aug 2007 10:27:02 -0500

61 lines

New Thread

IPC Materials Declaration Workshops offered in Boston, MA & San Jose, CA

IPC Materials Declaration Workshops offered in Boston, MA & San Jose, CA

Tina Nerad

Fri, 24 Aug 2007 08:34:14 -0500

92 lines

New Thread

IPC PCB Fabrication "Back to the Basics" Webcast Series - Electroplating Technologies, August 23, 2007

IPC PCB Fabrication "Back to the Basics" Webcast Series - Electroplating Technologies, August 23, 2007

Tina Nerad

Fri, 17 Aug 2007 14:26:47 -0500

38 lines

New Thread

IPC PCB Fabrication "Back to the Basics" webcast series continues in August (8/16, 8/23)

IPC PCB Fabrication "Back to the Basics" webcast series continues in August (8/16, 8/23)

Tina Nerad

Tue, 14 Aug 2007 10:45:40 -0500

44 lines

New Thread

IPC PCB Fabrication "Back to the Basics" Webcast Series continues, in August!!!

IPC PCB Fabrication "Back to the Basics" Webcast Series continues, in August!!!

Tina Nerad

Thu, 9 Aug 2007 13:51:20 -0500

43 lines

New Thread

IPC PCB Fabrication "Back to the Basics" Webcast Series in August 2007

IPC PCB Fabrication "Back to the Basics" Webcast Series in August 2007

Tina Nerad

Thu, 2 Aug 2007 16:07:43 -0500

40 lines

New Thread

IPC webcast: China RoHS: An Updated Roadmap to Achieving Compliance and Assessing Risks , 10/10/07

IPC webcast: China RoHS: An Updated Roadmap to Achieving Compliance and Assessing Risks , 10/10/07

Tina Nerad

Mon, 20 Aug 2007 15:18:01 -0500

54 lines

New Thread

IPC-6012 questions..

Re: IPC-6012 questions..

Whittaker, Dewey (EHCOE)

Mon, 20 Aug 2007 11:02:40 -0700

100 lines

IPC-6012 questions..

Kevin Glidden

Mon, 20 Aug 2007 13:53:17 -0400

58 lines

New Thread

IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall

Stadem, Richard D.

Thu, 9 Aug 2007 10:01:03 -0500

108 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall

Werner Engelmaier

Thu, 9 Aug 2007 11:07:54 EDT

38 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall

Victor G. Hernandez

Thu, 9 Aug 2007 09:59:18 -0500

62 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall

Werner Engelmaier

Thu, 9 Aug 2007 10:35:25 EDT

31 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall

Victor G. Hernandez

Thu, 9 Aug 2007 09:21:17 -0500

61 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall

weiner, mickey

Thu, 9 Aug 2007 17:05:53 +0300

64 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall

Werner Engelmaier

Thu, 9 Aug 2007 09:46:49 EDT

57 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall

Werner Engelmaier

Thu, 9 Aug 2007 09:43:06 EDT

32 lines

IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall

Victor G. Hernandez

Thu, 9 Aug 2007 08:36:41 -0500

27 lines

New Thread

IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall Separation

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall Separation

Stadem, Richard D.

Thu, 9 Aug 2007 14:36:58 -0500

58 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall Separation

Werner Engelmaier

Thu, 9 Aug 2007 14:36:19 EDT

32 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall Separation

Victor G. Hernandez

Thu, 9 Aug 2007 13:09:33 -0500

126 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall Separation

Whittaker, Dewey (EHCOE)

Thu, 9 Aug 2007 11:04:48 -0700

96 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall Separation

Victor G. Hernandez

Thu, 9 Aug 2007 12:55:07 -0500

67 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall Separation

Werner Engelmaier

Thu, 9 Aug 2007 11:51:05 EDT

34 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall Separation

Victor G. Hernandez

Thu, 9 Aug 2007 10:13:56 -0500

78 lines

New Thread

IPC/JEDEC International Conference on Lead Free Electronics, 4 & 5 October 2007, Berlin, Germany

IPC/JEDEC International Conference on Lead Free Electronics, 4 & 5 October 2007, Berlin, Germany

Tina Nerad

Mon, 13 Aug 2007 13:45:51 -0500

37 lines

New Thread

IPC_SM-840C

Re: IPC_SM-840C

Mumtaz Bora

Thu, 2 Aug 2007 14:56:47 -0700

68 lines

Re: IPC_SM-840C

Black, Paul

Wed, 1 Aug 2007 13:21:10 -0400

76 lines

IPC_SM-840C

Victor G. Hernandez

Wed, 1 Aug 2007 10:58:50 -0500

33 lines

New Thread

IR Thermometer

IR Thermometer

DTremmel

Fri, 31 Aug 2007 09:28:19 -0500

54 lines

Re: IR Thermometer

Dave Simonik

Thu, 30 Aug 2007 07:47:28 -0400

98 lines

Re: IR Thermometer

Reuven Rokah

Thu, 30 Aug 2007 08:49:33 +0300

93 lines

Re: IR Thermometer

Wasan Singhatong

Thu, 30 Aug 2007 10:55:26 +0700

143 lines

Re: IR Thermometer

Hogg, Blair K.

Wed, 29 Aug 2007 22:13:19 -0400

98 lines

Re: IR Thermometer

Wasan Singhatong

Thu, 30 Aug 2007 06:38:44 +0700

106 lines

IR Thermometer

DTremmel

Wed, 29 Aug 2007 15:23:18 -0500

57 lines

New Thread

Is Brian allowed to boast?

Re: Is Brian allowed to boast?

Whittaker, Dewey (EHCOE)

Thu, 9 Aug 2007 07:13:40 -0700

115 lines

Re: Is Brian allowed to boast?

Hernefjord Ingemar

Thu, 9 Aug 2007 08:49:56 +0200

103 lines

Re: Is Brian allowed to boast?

Whittaker, Dewey (EHCOE)

Wed, 8 Aug 2007 07:21:08 -0700

69 lines

Re: Is Brian allowed to boast?

Hernefjord Ingemar

Wed, 8 Aug 2007 08:54:27 +0200

43 lines

New Thread

Joel Alexander is out of the office.

Joel Alexander is out of the office.

Joel Alexander

Thu, 2 Aug 2007 15:37:11 -0400

24 lines

New Thread

Join IPC in Sarborough, Ontario, Canada, in August, and get up-to-date on Design

Join IPC in Sarborough, Ontario, Canada, in August, and get up-to-date on Design

Tina Nerad

Fri, 3 Aug 2007 09:56:57 -0500

74 lines

New Thread

Kevin--how to submit your comments

Kevin--how to submit your comments

Jack Crawford

Wed, 22 Aug 2007 01:16:23 -0500

103 lines

New Thread

Lead Contaminated Toys From China...

Lead Contaminated Toys From China...

Steve Gregory

Thu, 2 Aug 2007 07:39:12 -0500

52 lines

New Thread

Lead-Free Problems?

Re: Lead-Free Problems?

Werner Engelmaier

Mon, 13 Aug 2007 16:59:20 EDT

32 lines

Re: Lead-Free Problems?

Whittaker, Dewey (EHCOE)

Mon, 13 Aug 2007 13:55:25 -0700

62 lines

Re: Lead-Free Problems?

Werner Engelmaier

Mon, 13 Aug 2007 16:51:18 EDT

33 lines

Re: Lead-Free Problems?

Werner Engelmaier

Mon, 13 Aug 2007 16:46:17 EDT

34 lines

Re: Lead-Free Problems?

Stadem, Richard D.

Mon, 13 Aug 2007 15:03:27 -0500

146 lines

Re: Lead-Free Problems?

Whittaker, Dewey (EHCOE)

Mon, 13 Aug 2007 13:00:00 -0700

204 lines

Re: Lead-Free Problems?

Stadem, Richard D.

Mon, 13 Aug 2007 14:45:17 -0500

177 lines

Re: Lead-Free Problems?

Whittaker, Dewey (EHCOE)

Mon, 13 Aug 2007 12:46:52 -0700

123 lines

Re: Lead-Free Problems?

Stadem, Richard D.

Mon, 13 Aug 2007 13:17:17 -0500

96 lines

Re: Lead-Free Problems?

Whittaker, Dewey (EHCOE)

Mon, 13 Aug 2007 11:27:13 -0700

188 lines

Re: Lead-Free Problems?

John Burke

Mon, 13 Aug 2007 11:12:38 -0700

148 lines

Re: Lead-Free Problems?

John Burke

Mon, 13 Aug 2007 11:11:22 -0700

116 lines

Re: Lead-Free Problems?

Bill Kasprzak

Mon, 13 Aug 2007 14:06:20 -0400

117 lines

Re: Lead-Free Problems?

Dale Ritzen

Mon, 13 Aug 2007 12:57:19 -0500

69 lines

Lead-Free Problems?

Bloomquist, Ken

Mon, 13 Aug 2007 10:50:25 -0700

42 lines

New Thread

Lead-Free Problems? and Tin Lead too!

Re: Lead-Free Problems? and Tin Lead too!

David D. Hillman

Wed, 15 Aug 2007 11:22:07 -0500

188 lines

Re: Lead-Free Problems? and Tin Lead too!

Graham Naisbitt

Wed, 15 Aug 2007 11:24:24 +0100

148 lines

New Thread

Mehmet Emin Yaman işyeri dışında.

Mehmet Emin Yaman işyeri dışında.

Mehmet Emin Yaman

Mon, 13 Aug 2007 10:01:30 +0300

43 lines

New Thread

Microscope camera, solution

Re: Microscope camera, solution

Rex Waygood

Thu, 23 Aug 2007 09:44:28 +0100

116 lines

Re: Microscope camera, solution

Steve Gregory

Wed, 22 Aug 2007 07:30:40 -0500

83 lines

Microscope camera, solution

Hernefjord Ingemar

Wed, 22 Aug 2007 10:04:26 +0200

41 lines

New Thread

Microwave Laminate Material

Microwave Laminate Material

Marsico, James

Tue, 7 Aug 2007 14:36:01 -0400

44 lines

New Thread

Minimum toe fillet for SOT23-3 land pattern

Re: Minimum toe fillet for SOT23-3 land pattern

Stadem, Richard D.

Mon, 13 Aug 2007 08:19:00 -0500

113 lines

Re: Minimum toe fillet for SOT23-3 land pattern

P. Langeveld

Fri, 10 Aug 2007 13:10:21 +0200

95 lines

Re: Minimum toe fillet for SOT23-3 land pattern

Stadem, Richard D.

Thu, 9 Aug 2007 13:30:37 -0500

68 lines

Re: Minimum toe fillet for SOT23-3 land pattern

Barry Gallegos

Thu, 9 Aug 2007 11:32:52 -0600

66 lines

Re: Minimum toe fillet for SOT23-3 land pattern

Jones, Evamaria

Thu, 9 Aug 2007 13:01:08 -0400

39 lines

Minimum toe fillet for SOT23-3 land pattern

James Verrette

Thu, 9 Aug 2007 12:53:52 -0400

37 lines

New Thread

National Physical Laboratory NPL Industry Defect Database

National Physical Laboratory NPL Industry Defect Database

Bob Willis

Thu, 23 Aug 2007 17:27:35 +0100

109 lines

New Thread

Need help locating a shop that does assembly of flex circuits

Need help locating a shop that does assembly of flex circuits

Brooks,Bill

Mon, 6 Aug 2007 15:10:38 -0700

28 lines

New Thread

New IPC webcast series in November: Via Hole Filling Technology & Processes

New IPC webcast series in November: Via Hole Filling Technology & Processes

Tina Nerad

Mon, 27 Aug 2007 09:40:04 -0500

108 lines

New Thread

New IPC Webcast Series! Via Hole Filling Technology and Processes November 1 & 8, 2007

New IPC Webcast Series! Via Hole Filling Technology and Processes November 1 & 8, 2007

Michelle Michelotti

Thu, 16 Aug 2007 14:20:39 -0500

84 lines

New Thread

Non-aqueous cleaning

Re: Non-aqueous cleaning

Gervascio, Thomas

Thu, 9 Aug 2007 07:59:51 -0400

82 lines

Re: Non-aqueous cleaning

Bev Christian

Wed, 8 Aug 2007 07:40:44 -0400

113 lines

Re: Non-aqueous cleaning

Brian Ellis

Wed, 8 Aug 2007 09:08:13 +0300

73 lines

Re: Non-aqueous cleaning

Douglas O. Pauls

Tue, 7 Aug 2007 17:02:16 -0500

95 lines

Non-aqueous cleaning

Bev Christian

Tue, 7 Aug 2007 12:18:01 -0400

49 lines

New Thread

NTC - hope you are all safe

Re: NTC - hope you are all safe

Stadem, Richard D.

Thu, 2 Aug 2007 14:42:35 -0500

103 lines

Re: NTC - hope you are all safe

John Burke

Thu, 2 Aug 2007 10:08:03 -0700

126 lines

Re: NTC - hope you are all safe

<>

Thu, 2 Aug 2007 16:50:44 +0000

62 lines

NTC - hope you are all safe

Graham Naisbitt

Thu, 2 Aug 2007 17:44:44 +0100

70 lines

New Thread

NTC - Re: [TN] Hot air and Tin Lead too!

Re: NTC - Re: [TN] Hot air and Tin Lead too!

Eric CHRISTISON

Wed, 15 Aug 2007 14:59:58 +0100

59 lines

NTC - Re: [TN] Hot air and Tin Lead too!

Dennis Fritz

Wed, 15 Aug 2007 09:52:10 EDT

42 lines

New Thread

NTC Seeking design information on PWB conductor spacing for high voltage (500-1000 VDC) applications

Re: NTC Seeking design information on PWB conductor spacing for high voltage (500-1000 VDC) applications

Gerald Bogert

Fri, 17 Aug 2007 17:31:10 -0400

219 lines

Re: NTC Seeking design information on PWB conductor spacing for high voltage (500-1000 VDC) applications

Whittaker, Dewey (EHCOE)

Fri, 17 Aug 2007 08:09:24 -0700

227 lines

Re: NTC Seeking design information on PWB conductor spacing for high voltage (500-1000 VDC) applications

Phil Nutting

Fri, 17 Aug 2007 09:48:52 -0400

195 lines

New Thread

NTC, off-topic, off-colour, Friday joke

Re: NTC, off-topic, off-colour, Friday joke

Hernefjord Ingemar

Fri, 17 Aug 2007 14:52:48 +0200

181 lines

Re: NTC, off-topic, off-colour, Friday joke

Mike Fenner

Fri, 17 Aug 2007 13:24:23 +0100

131 lines

Re: NTC, off-topic, off-colour, Friday joke

Hernefjord Ingemar

Fri, 17 Aug 2007 14:16:26 +0200

114 lines

Re: NTC, off-topic, off-colour, Friday joke

Brian Ellis

Fri, 17 Aug 2007 15:05:17 +0300

94 lines

Re: NTC, off-topic, off-colour, Friday joke

Steve Gregory

Fri, 17 Aug 2007 06:54:56 -0500

79 lines

NTC, off-topic, off-colour, Friday joke

Brian Ellis

Fri, 17 Aug 2007 14:29:59 +0300

42 lines

New Thread

NTC-Friday

NTC-Friday

Whittaker, Dewey (EHCOE)

Fri, 10 Aug 2007 07:59:36 -0700

99 lines

New Thread

Odd migration

Re: Odd migration

Vladimir Igoshev

Thu, 23 Aug 2007 12:23:23 -0400

93 lines

Re: Odd migration

Steve Gregory

Thu, 23 Aug 2007 11:17:15 -0500

62 lines

Odd migration

Hernefjord Ingemar

Thu, 23 Aug 2007 12:44:34 +0200

30 lines

New Thread

optics

Re: optics

Whittaker, Dewey (EHCOE)

Wed, 15 Aug 2007 06:41:39 -0700

53 lines

optics

Jason

Tue, 14 Aug 2007 16:57:17 -0500

25 lines

New Thread

OSP Processing Recommendations

Re: OSP Processing Recommendations

Stadem, Richard D.

Mon, 13 Aug 2007 07:54:34 -0500

276 lines

Re: OSP Processing Recommendations

Stadem, Richard D.

Mon, 13 Aug 2007 07:52:58 -0500

53 lines

Re: OSP Processing Recommendations

Douglas O. Pauls

Mon, 13 Aug 2007 07:11:03 -0500

29 lines

Re: OSP Processing Recommendations

Graham Collins

Mon, 13 Aug 2007 08:02:00 -0400

313 lines

Re: OSP Processing Recommendations

Leland Woodall

Mon, 13 Aug 2007 07:49:59 -0400

255 lines

Re: OSP Processing Recommendations

Aquino Quek

Mon, 13 Aug 2007 14:36:40 +0800

62 lines

Re: OSP Processing Recommendations

John Burke

Fri, 10 Aug 2007 16:00:30 -0700

232 lines

Re: OSP Processing Recommendations

Leland Woodall

Fri, 10 Aug 2007 18:16:12 -0400

201 lines

Re: OSP Processing Recommendations

John Burke

Fri, 10 Aug 2007 15:05:10 -0700

196 lines

Re: OSP Processing Recommendations

Todd, Richard

Fri, 10 Aug 2007 17:56:03 -0400

163 lines

Re: OSP Processing Recommendations

John Burke

Fri, 10 Aug 2007 14:52:04 -0700

65 lines

OSP Processing Recommendations

Leland Woodall

Fri, 10 Aug 2007 17:37:05 -0400

33 lines

New Thread

Pad shape for BGA

Re: Pad shape for BGA

John Burke

Thu, 9 Aug 2007 23:48:08 -0700

66 lines

Re: Pad shape for BGA

Werner Engelmaier

Thu, 9 Aug 2007 21:48:53 EDT

33 lines

Pad shape for BGA

John Burke

Thu, 9 Aug 2007 18:34:15 -0700

39 lines

New Thread

Pads removed during BGA Repair

Re: Pads removed during BGA Repair

Tan, Geok Ang

Wed, 8 Aug 2007 08:57:20 +0800

187 lines

Re: Pads removed during BGA Repair

Stadem, Richard D.

Tue, 7 Aug 2007 16:11:18 -0500

157 lines

Re: Pads removed during BGA Repair

Ray, Carl (GE Indust, GE Fanuc)

Tue, 7 Aug 2007 16:13:50 -0400

90 lines

Re: Pads removed during BGA Repair

Whittaker, Dewey (EHCOE)

Tue, 7 Aug 2007 13:10:10 -0700

62 lines

Pads removed during BGA Repair

Ray, Carl (GE Indust, GE Fanuc)

Tue, 7 Aug 2007 16:00:34 -0400

31 lines

New Thread

Paint spray booths

Paint spray booths

Marsico, James

Tue, 7 Aug 2007 07:12:58 -0400

50 lines

New Thread

PCB assembly protection for outdoor working under harsh environmental conditions

Re: PCB assembly protection for outdoor working under harsh environmental conditions

Hernefjord Ingemar

Tue, 21 Aug 2007 08:05:35 +0200

201 lines

Re: PCB assembly protection for outdoor working under harsh environmental conditions

David Douthit

Mon, 20 Aug 2007 12:48:43 -0700

187 lines

Re: PCB assembly protection for outdoor working under harsh environmental conditions

Hernefjord Ingemar

Mon, 20 Aug 2007 08:49:41 +0200

150 lines

Re: PCB assembly protection for outdoor working under harsh environmental conditions

Reyes, Angel LAM2 4429

Fri, 17 Aug 2007 16:14:32 -0700

104 lines

Re: PCB assembly protection for outdoor working under harsh environmental conditions

Hogg, Blair K.

Fri, 17 Aug 2007 16:00:48 -0400

72 lines

PCB assembly protection for outdoor working under harsh environmental conditions

Reyes, Angel LAM2 4429

Fri, 17 Aug 2007 11:31:43 -0700

223 lines

New Thread

PCB marking for shop control.

PCB marking for shop control.

Miguel Vallejo

Fri, 31 Aug 2007 08:50:30 -0700

47 lines

New Thread

PCB matl properties - water effect

Re: PCB matl properties - water effect

Dennis Fritz

Wed, 29 Aug 2007 10:00:40 EDT

45 lines

Re: PCB matl properties - water effect

Hernefjord Ingemar

Wed, 29 Aug 2007 15:19:41 +0200

142 lines

Re: PCB matl properties - water effect

Bev Christian

Wed, 29 Aug 2007 07:58:05 -0400

117 lines

Re: PCB matl properties - water effect

Hernefjord Ingemar

Wed, 29 Aug 2007 08:22:14 +0200

79 lines

Re: PCB matl properties - water effect

Werner Engelmaier

Tue, 28 Aug 2007 18:30:54 EDT

33 lines

Re: PCB matl properties - water effect

Leo Higgins

Tue, 28 Aug 2007 14:23:17 -0700

149 lines

Re: PCB matl properties - water effect

Bev Christian

Tue, 28 Aug 2007 17:17:06 -0400

93 lines

PCB matl properties - water effect

Leo Higgins

Tue, 28 Aug 2007 14:11:24 -0700

49 lines

New Thread

PCB matl properties - water effect NTC

Re: PCB matl properties - water effect NTC

Leo Higgins

Wed, 29 Aug 2007 12:33:58 -0700

75 lines

Re: PCB matl properties - water effect NTC

Werner Engelmaier

Wed, 29 Aug 2007 14:59:03 EDT

27 lines

Re: PCB matl properties - water effect NTC

John Burke

Wed, 29 Aug 2007 11:42:47 -0700

198 lines

Re: PCB matl properties - water effect NTC

Jim Carlson

Wed, 29 Aug 2007 14:23:36 -0400

171 lines

Re: PCB matl properties - water effect NTC

Whittaker, Dewey (EHCOE)

Wed, 29 Aug 2007 11:14:58 -0700

147 lines

Re: PCB matl properties - water effect NTC

Douglas O. Pauls

Wed, 29 Aug 2007 13:08:18 -0500

110 lines

Re: PCB matl properties - water effect NTC

Bev Christian

Wed, 29 Aug 2007 13:07:01 -0400

91 lines

Re: PCB matl properties - water effect NTC

Guy Ramsey

Wed, 29 Aug 2007 12:45:29 -0400

66 lines

Re: PCB matl properties - water effect NTC

Bev Christian

Wed, 29 Aug 2007 11:07:27 -0400

91 lines

New Thread

PCB Pad Cratering

Re: PCB Pad Cratering

Cheryl Tulkoff

Tue, 14 Aug 2007 08:32:27 -0500

100 lines

PCB Pad Cratering

Anthony Tavano

Tue, 14 Aug 2007 07:37:29 -0500

35 lines

New Thread

PCBA shipping packaging specification/ guidelines

PCBA shipping packaging specification/ guidelines

Tan, Geok Ang

Wed, 8 Aug 2007 17:33:01 +0800

27 lines

New Thread

PCBA storage conditions

PCBA storage conditions

Tan, Geok Ang

Wed, 8 Aug 2007 18:42:06 +0800

29 lines

New Thread

Plasma "oxidation"

Re: Plasma "oxidation"

John Maxwell

Fri, 31 Aug 2007 10:06:55 -0700

251 lines

Re: Plasma "oxidation"

David D. Hillman

Fri, 31 Aug 2007 11:55:16 -0500

242 lines

Re: Plasma "oxidation"

Whittaker, Dewey (EHCOE)

Fri, 31 Aug 2007 08:16:09 -0700

233 lines

Re: Plasma "oxidation"

Eric CHRISTISON

Fri, 31 Aug 2007 15:55:22 +0100

188 lines

Re: Plasma "oxidation"

Gervascio, Thomas

Fri, 31 Aug 2007 10:11:57 -0400

121 lines

Re: Plasma "oxidation"

Whittaker, Dewey (EHCOE)

Fri, 31 Aug 2007 07:00:25 -0700

156 lines

Re: Plasma "oxidation"

Hernefjord Ingemar

Fri, 31 Aug 2007 15:44:37 +0200

136 lines

Re: Plasma "oxidation"

Hernefjord Ingemar

Fri, 31 Aug 2007 14:55:18 +0200

129 lines

Re: Plasma "oxidation"

David D. Hillman

Fri, 31 Aug 2007 07:08:19 -0500

95 lines

Re: Plasma "oxidation"

Bev Christian

Fri, 31 Aug 2007 07:34:28 -0400

94 lines

Plasma "oxidation"

Hernefjord Ingemar

Fri, 31 Aug 2007 10:52:46 +0200

46 lines

New Thread

PLCC Socket Pin damage

Re: PLCC Socket Pin damage

Joel Alexander

Thu, 30 Aug 2007 09:42:47 -0400

111 lines

Re: PLCC Socket Pin damage

Steve Gregory

Thu, 30 Aug 2007 08:07:18 -0500

81 lines

PLCC Socket Pin damage

Joel Alexander

Thu, 30 Aug 2007 08:46:26 -0400

35 lines

New Thread

Press Fit Connector rework

Re: Press Fit Connector rework

Rey Sosa

Thu, 16 Aug 2007 11:20:14 -0700

212 lines

Re: Press Fit Connector rework

Rey Sosa

Thu, 16 Aug 2007 11:14:33 -0700

185 lines

Re: Press Fit Connector rework

Wayne Thayer

Thu, 16 Aug 2007 13:34:11 -0400

148 lines

Re: Press Fit Connector rework

Randy Morrison

Thu, 16 Aug 2007 09:36:32 -0700

75 lines

Re: Press Fit Connector rework

Randy Morrison

Thu, 16 Aug 2007 09:29:52 -0700

104 lines

Re: Press Fit Connector rework

Kerry McMullen

Thu, 16 Aug 2007 12:15:28 -0400

102 lines

Re: Press Fit Connector rework

Whittaker, Dewey (EHCOE)

Thu, 16 Aug 2007 08:52:20 -0700

76 lines

Press Fit Connector rework

Kane, Amol (349)

Thu, 16 Aug 2007 11:45:30 -0400

46 lines

New Thread

Problems with Memeory modules and sockets

Re: Problems with Memeory modules and sockets

Werner Engelmaier

Wed, 1 Aug 2007 10:22:47 EDT

34 lines

Re: Problems with Memeory modules and sockets

McGlaughlin, Jeffrey A

Wed, 1 Aug 2007 06:44:54 -0400

82 lines

Problems with Memeory modules and sockets

Ralph Rottnick

Wed, 1 Aug 2007 04:13:30 -0500

44 lines

New Thread

Problems with Memory modules and sockets

Re: Problems with Memory modules and sockets

Herminia Guevarra

Wed, 1 Aug 2007 07:56:37 -0400

123 lines

Re: Problems with Memory modules and sockets

Victor G. Hernandez

Wed, 1 Aug 2007 06:36:19 -0500

70 lines

New Thread

PTH integrity

Re: PTH integrity

Werner Engelmaier

Mon, 20 Aug 2007 16:05:38 EDT

39 lines

Re: PTH integrity

Werner Engelmaier

Mon, 20 Aug 2007 16:02:02 EDT

28 lines

PTH integrity

Kevin Glidden

Mon, 20 Aug 2007 13:59:17 -0400

46 lines

New Thread

Request for LF shrinkhole or hot tear failure data

Re: Request for LF shrinkhole or hot tear failure data

David D. Hillman

Tue, 14 Aug 2007 15:37:36 -0500

181 lines

Request for LF shrinkhole or hot tear failure data

Jack Crawford

Tue, 14 Aug 2007 14:07:10 -0500

124 lines

New Thread

resistor codes

Re: resistor codes

Haynes, Kim

Tue, 28 Aug 2007 08:11:50 -0500

148 lines

Re: resistor codes

Steve Gregory

Fri, 24 Aug 2007 07:28:25 -0500

124 lines

Re: Resistor codes

David Greig

Thu, 23 Aug 2007 23:51:44 +0100

71 lines

Re: resistor codes

Haynes, Kim

Thu, 23 Aug 2007 17:08:49 -0500

98 lines

Re: resistor codes

Steve Gregory

Thu, 23 Aug 2007 16:16:35 -0500

68 lines

resistor codes

pearl petras

Thu, 23 Aug 2007 13:45:54 -0700

29 lines

Resistor codes

pearl petras

Thu, 23 Aug 2007 13:41:47 -0700

29 lines

New Thread

reverse engineering, legit style

Re: reverse engineering, legit style

<>

Thu, 9 Aug 2007 09:56:36 EDT

30 lines

Re: reverse engineering, legit style

Gary Ferrari

Thu, 9 Aug 2007 09:50:42 -0400

186 lines

Re: reverse engineering, legit style

Wayne Thayer

Thu, 9 Aug 2007 00:09:48 -0400

194 lines

Re: reverse engineering, legit style

<>

Wed, 8 Aug 2007 18:38:10 EDT

32 lines

Re: reverse engineering, legit style

Dave Seymour

Wed, 8 Aug 2007 14:48:39 -0400

136 lines

Re: reverse engineering, legit style

Wolfe, Robert

Wed, 8 Aug 2007 14:40:13 -0400

112 lines

Re: reverse engineering, legit style

Brooks,Bill

Wed, 8 Aug 2007 11:18:41 -0700

143 lines

Re: reverse engineering, legit style

John Burke

Wed, 8 Aug 2007 10:33:02 -0700

97 lines

reverse engineering, legit style

Jeff Seeger

Wed, 8 Aug 2007 12:02:07 -0400

51 lines

New Thread

Rework question

Re: Rework question

Kane, Amol (349)

Thu, 9 Aug 2007 11:48:31 -0400

493 lines

Re: Rework question

Stadem, Richard D.

Thu, 9 Aug 2007 07:51:07 -0500

467 lines

Re: Rework question

Kane, Amol (349)

Wed, 8 Aug 2007 10:57:12 -0400

409 lines

Re: Rework question

David D. Hillman

Wed, 8 Aug 2007 09:44:57 -0500

360 lines

Re: Rework question

John Burke

Tue, 7 Aug 2007 16:14:14 -0700

68 lines

Re: Rework question

Kane, Joseph E (US SSA)

Tue, 7 Aug 2007 18:39:56 -0400

75 lines

Re: Rework question

Douglas O. Pauls

Tue, 7 Aug 2007 17:01:01 -0500

31 lines

Re: Rework question

Sauer, Steve (Xetron)

Tue, 7 Aug 2007 14:42:00 -0400

340 lines

Re: Rework question

Whittaker, Dewey (EHCOE)

Tue, 7 Aug 2007 11:22:09 -0700

302 lines

Re: Rework question

Stadem, Richard D.

Tue, 7 Aug 2007 12:59:19 -0500

263 lines

Re: Rework question

Bev Christian

Tue, 7 Aug 2007 13:08:51 -0400

233 lines

Re: Rework question

John Burke

Tue, 7 Aug 2007 09:54:41 -0700

177 lines

Re: Rework question

Guy Ramsey

Tue, 7 Aug 2007 12:13:44 -0400

162 lines

Re: Rework question

Victor G. Hernandez

Tue, 7 Aug 2007 11:07:47 -0500

147 lines

Re: Rework question

John Burke

Tue, 7 Aug 2007 09:04:08 -0700

141 lines

Re: Rework question

Bev Christian

Tue, 7 Aug 2007 11:52:55 -0400

119 lines

Re: Rework question

Stadem, Richard D.

Tue, 7 Aug 2007 10:30:42 -0500

82 lines

Re: Rework question

Tempea, Ioan

Tue, 7 Aug 2007 10:46:58 -0400

90 lines

Rework question

John Burke

Tue, 7 Aug 2007 07:28:55 -0700

55 lines

New Thread

Rework question--No IPC limitations

Re: Rework question--No IPC limitations

Stadem, Richard D.

Wed, 8 Aug 2007 12:20:13 -0500

215 lines

Re: Rework question--No IPC limitations

John Burke

Wed, 8 Aug 2007 10:56:19 -0700

194 lines

Re: Rework question--No IPC limitations

Jack Crawford

Wed, 8 Aug 2007 10:29:44 -0500

165 lines

New Thread

RF Board Bow and Twist

RF Board Bow and Twist

Syed Ahmad

Wed, 15 Aug 2007 09:25:47 -0500

32 lines

New Thread

RoHS Compliance

Re: RoHS Compliance

Randy Bock Sr.

Tue, 7 Aug 2007 16:22:17 -0400

87 lines

Re: RoHS Compliance

Whittaker, Dewey (EHCOE)

Tue, 7 Aug 2007 11:44:23 -0700

59 lines

RoHS Compliance

Jon McDowell

Tue, 7 Aug 2007 12:25:45 -0600

29 lines

New Thread

SAC Soldered With SnPb

Re: SAC Soldered With SnPb

David D. Hillman

Wed, 15 Aug 2007 09:08:01 -0500

167 lines

Re: SAC Soldered With SnPb

Bloomquist, Ken

Wed, 15 Aug 2007 06:23:45 -0700

121 lines

Re: SAC Soldered With SnPb

David D. Hillman

Wed, 15 Aug 2007 07:25:48 -0500

175 lines

Re: SAC Soldered With SnPb

Hernefjord Ingemar

Wed, 15 Aug 2007 11:14:46 +0200

192 lines

Re: SAC Soldered With SnPb

Lum Wee Mei

Wed, 15 Aug 2007 15:54:06 +0800

163 lines

Re: SAC Soldered With SnPb

Hernefjord Ingemar

Wed, 15 Aug 2007 09:43:26 +0200

132 lines

Re: SAC Soldered With SnPb

Hernefjord Ingemar

Wed, 15 Aug 2007 09:13:45 +0200

122 lines

Re: SAC Soldered With SnPb

Gerald Bogert

Tue, 14 Aug 2007 18:23:16 -0400

82 lines

SAC Soldered With SnPb

Bloomquist, Ken

Tue, 14 Aug 2007 13:51:05 -0700

31 lines

New Thread

Scanning Acoustic Microscope

Re: Scanning Acoustic Microscope

Syed Ahmad

Thu, 9 Aug 2007 10:22:14 -0500

213 lines

Re: Scanning Acoustic Microscope

Syed Ahmad

Thu, 9 Aug 2007 10:23:11 -0500

88 lines

Re: Scanning Acoustic Microscope

Wenger, George M.

Thu, 9 Aug 2007 09:34:00 -0400

78 lines

Re: Scanning Acoustic Microscope

Vladimir Igoshev

Thu, 9 Aug 2007 09:26:22 -0400

67 lines

Re: Scanning Acoustic Microscope

Stadem, Richard D.

Thu, 9 Aug 2007 08:21:47 -0500

64 lines

Scanning Acoustic Microscope

Syed Ahmad

Thu, 9 Aug 2007 07:47:01 -0500

33 lines

New Thread

Seeking design information on PWB conductor spacing for high voltage (500-1000 VDC) applications

Re: Seeking design information on PWB conductor spacing for high voltage (500-1000 VDC) applications

Hernefjord Ingemar

Fri, 17 Aug 2007 15:46:17 +0200

169 lines

Re: Seeking design information on PWB conductor spacing for high voltage (500-1000 VDC) applications

Phil Nutting

Fri, 17 Aug 2007 08:30:06 -0400

160 lines

Re: Seeking design information on PWB conductor spacing for high voltage (500-1000 VDC) applications

- bogert

Fri, 17 Aug 2007 04:53:21 -0400

141 lines

Re: Seeking design information on PWB conductor spacing for high voltage (500-1000 VDC) applications

Hernefjord Ingemar

Fri, 17 Aug 2007 09:06:43 +0200

120 lines

Seeking design information on PWB conductor spacing for high voltage (500-1000 VDC) applications

Gerald Bogert

Thu, 16 Aug 2007 18:24:14 -0400

76 lines

New Thread

Silver PCB finish and reliability (question)

Re: Silver PCB finish and reliability (question)

David D. Hillman

Mon, 13 Aug 2007 06:53:19 -0500

308 lines

Re: Silver PCB finish and reliability (question)

Victor G. Hernandez

Mon, 13 Aug 2007 06:37:26 -0500

179 lines

Re: Silver PCB finish and reliability (question)

Cheryl Tulkoff

Fri, 10 Aug 2007 20:52:27 -0500

205 lines

Re: Silver PCB finish and reliability (question)

Cheryl Tulkoff

Fri, 10 Aug 2007 20:49:06 -0500

252 lines

Re: Silver PCB finish and reliability (question)

Wenger, George M.

Fri, 10 Aug 2007 20:30:54 -0400

103 lines

Re: Silver PCB finish and reliability (question)

Cheryl Tulkoff

Fri, 10 Aug 2007 17:30:27 -0500

120 lines

Re: Silver PCB finish and reliability (question)

John Burke

Fri, 10 Aug 2007 14:50:56 -0700

87 lines

Re: Silver PCB finish and reliability (question)

Wenger, George M.

Fri, 10 Aug 2007 17:31:26 -0400

70 lines

Re: Silver PCB finish and reliability (question)

David D. Hillman

Fri, 10 Aug 2007 16:23:15 -0500

102 lines

Silver PCB finish and reliability (question)

Carl VanWormer

Fri, 10 Aug 2007 14:07:29 -0700

50 lines

New Thread

Solder mask as an insulator

Re: Solder mask as an insulator

Karl Hunsinger

Wed, 15 Aug 2007 14:17:45 -0400

80 lines

Re: Solder mask as an insulator

Phil Nutting

Wed, 15 Aug 2007 13:47:41 -0400

110 lines

Re: Solder mask as an insulator

Eddie Rocha

Wed, 15 Aug 2007 10:15:25 -0700

75 lines

Re: Solder mask as an insulator

Croslin, Robert

Wed, 15 Aug 2007 12:10:12 -0400

120 lines

Re: Solder mask as an insulator

Leo Higgins

Wed, 15 Aug 2007 09:05:02 -0700

97 lines

Re: Solder mask as an insulator

Whittaker, Dewey (EHCOE)

Wed, 15 Aug 2007 08:27:50 -0700

82 lines

Re: Solder mask as an insulator

Stadem, Richard D.

Wed, 15 Aug 2007 10:11:58 -0500

74 lines

Solder mask as an insulator

Phil Nutting

Wed, 15 Aug 2007 10:58:55 -0400

48 lines

New Thread

Solder mask as an insulator - illustration posted

Re: Solder mask as an insulator - illustration posted

Phil Nutting

Mon, 20 Aug 2007 09:16:23 -0400

240 lines

Re: Solder mask as an insulator - illustration posted

Victor G. Hernandez

Mon, 20 Aug 2007 08:05:05 -0500

206 lines

Re: Solder mask as an insulator - illustration posted

Phil Nutting

Mon, 20 Aug 2007 08:42:41 -0400

179 lines

Re: Solder mask as an insulator - illustration posted

Whittaker, Dewey (EHCOE)

Fri, 17 Aug 2007 12:44:02 -0700

143 lines

Re: Solder mask as an insulator - illustration posted

Stadem, Richard D.

Fri, 17 Aug 2007 13:23:49 -0500

188 lines

Re: Solder mask as an insulator - illustration posted

Dave Dixon

Fri, 17 Aug 2007 13:17:16 -0500

53 lines

Re: Solder mask as an insulator - illustration posted

Kerry McMullen

Fri, 17 Aug 2007 14:02:31 -0400

157 lines

Re: Solder mask as an insulator - illustration posted

Craig Cullum

Fri, 17 Aug 2007 09:21:24 -0500

52 lines

Re: Solder mask as an insulator - illustration posted

Phil Nutting

Fri, 17 Aug 2007 08:14:51 -0400

107 lines

New Thread

Solder Mask Solvent?

Re: Solder Mask Solvent?

Wrobel, Clayton

Thu, 30 Aug 2007 07:06:50 -0400

169 lines

Re: Solder Mask Solvent?

Whittaker, Dewey (EHCOE)

Wed, 29 Aug 2007 07:35:54 -0700

149 lines

Re: Solder Mask Solvent?

Stadem, Richard D.

Wed, 29 Aug 2007 06:18:25 -0500

121 lines

Re: Solder Mask Solvent?

Brian Ellis

Wed, 29 Aug 2007 11:33:17 +0300

70 lines

Re: Solder Mask Solvent?

Gary Crowell

Tue, 28 Aug 2007 15:22:08 -0600

77 lines

Re: Solder Mask Solvent?

peter blokhuis

Tue, 28 Aug 2007 14:05:04 -0700

87 lines

Re: Solder Mask Solvent?

Dennis Fritz

Tue, 28 Aug 2007 16:28:22 EDT

55 lines

Re: Solder Mask Solvent?

Tim Mack

Tue, 28 Aug 2007 15:27:04 -0500

105 lines

Re: Solder Mask Solvent?

R Sedlak

Tue, 28 Aug 2007 12:27:38 -0700

68 lines

Re: Solder Mask Solvent?

Genny Gibbard

Tue, 28 Aug 2007 13:22:35 -0600

119 lines

Re: Solder Mask Solvent?

Paul Edwards

Tue, 28 Aug 2007 12:16:47 -0700

94 lines

Re: Solder Mask Solvent?

Jim Henderson

Tue, 28 Aug 2007 15:00:32 -0400

108 lines

Re: Solder Mask Solvent?

Steve Gregory

Tue, 28 Aug 2007 13:45:34 -0500

81 lines

Solder Mask Solvent?

Tim Mack

Tue, 28 Aug 2007 13:25:20 -0500

46 lines

New Thread

Soldering pure matte tin plated component leads using Sn63Pb37 solder

Re: Soldering pure matte tin plated component leads using Sn63Pb37 solder

Richard Kraszewski

Tue, 7 Aug 2007 19:51:53 -0500

90 lines

Soldering pure matte tin plated component leads using Sn63Pb37 solder

- bogert

Tue, 7 Aug 2007 18:44:07 -0400

39 lines

New Thread

Standard for tape and reel part

Re: Standard for tape and reel part

Joel Alexander

Fri, 31 Aug 2007 08:19:27 -0400

81 lines

Standard for tape and reel part

Dan Mauro

Fri, 31 Aug 2007 08:13:07 -0400

34 lines

New Thread

Standard Improvement Form

Re: Standard Improvement Form

Bev Christian

Tue, 21 Aug 2007 11:10:37 -0400

92 lines

Standard Improvement Form

Kevin Glidden

Tue, 21 Aug 2007 11:09:58 -0400

51 lines

New Thread

Strange crystal growth

Re: Strange crystal growth

Victor G. Hernandez

Wed, 8 Aug 2007 09:37:38 -0500

195 lines

Re: Strange crystal growth

Davis, Larry

Wed, 8 Aug 2007 07:13:09 -0700

165 lines

Re: Strange crystal growth

Kane, Joseph E (US SSA)

Mon, 6 Aug 2007 14:42:52 -0400

123 lines

Re: Strange crystal growth

Brian Ellis

Thu, 2 Aug 2007 17:57:28 +0300

56 lines

Re: Strange crystal growth

Ahne Oosterhof

Thu, 2 Aug 2007 07:32:29 -0700

45 lines

Re: Strange crystal growth

Davis, Larry

Wed, 1 Aug 2007 09:48:59 -0700

81 lines

Re: Strange crystal growth

Dennis Fritz

Wed, 1 Aug 2007 12:37:04 EDT

40 lines

Re: Strange crystal growth

Brian Ellis

Wed, 1 Aug 2007 17:44:45 +0300

75 lines

Strange crystal growth

Davis, Larry

Wed, 1 Aug 2007 07:20:03 -0700

56 lines

New Thread

Suggestions for Pressing in Pins...

Re: Suggestions for Pressing in Pins...

Whittaker, Dewey (EHCOE)

Tue, 7 Aug 2007 12:53:00 -0700

127 lines

Re: Suggestions for Pressing in Pins...

Wayne Thayer

Tue, 7 Aug 2007 14:20:12 -0400

101 lines

Suggestions for Pressing in Pins...

Steve Gregory

Tue, 7 Aug 2007 11:09:01 -0500

71 lines

New Thread

SV: [TN] Analysts, look here, nice tool for you

Re: SV: [TN] Analysts, look here, nice tool for you

Stadem, Richard D.

Mon, 27 Aug 2007 09:54:26 -0500

165 lines

Re: SV: [TN] Analysts, look here, nice tool for you

Gervascio, Thomas

Thu, 23 Aug 2007 12:53:17 -0400

154 lines

Re: SV: [TN] Analysts, look here, nice tool for you

Whittaker, Dewey (EHCOE)

Tue, 21 Aug 2007 11:47:54 -0700

161 lines

Re: SV: [TN] Analysts, look here, nice tool for you

Stadem, Richard D.

Tue, 21 Aug 2007 13:42:49 -0500

135 lines

SV: [TN] Analysts, look here, nice tool for you

Hfjord

Tue, 21 Aug 2007 20:16:42 +0200

114 lines

New Thread

SV: [TN] Friday NTC - water logged cell phone repair

SV: [TN] Friday NTC - water logged cell phone repair

Hfjord

Fri, 10 Aug 2007 17:34:56 +0200

178 lines

New Thread

SV: [TN] Is Brian allowed to boast?

SV: [TN] Is Brian allowed to boast?

Hfjord

Thu, 9 Aug 2007 20:00:11 +0200

151 lines

New Thread

SV: [TN] Microwave Laminate Material

SV: [TN] Microwave Laminate Material

Hfjord

Tue, 7 Aug 2007 22:33:06 +0200

103 lines

New Thread

SV: [TN] Odd migration

SV: [TN] Odd migration

Hfjord

Thu, 23 Aug 2007 22:01:04 +0200

121 lines

New Thread

SV: [TN] optics

SV: [TN] optics

Hfjord

Wed, 15 Aug 2007 17:15:22 +0200

80 lines

New Thread

SV: [TN] PCB matl properties - water effect NTC

Re: SV: [TN] PCB matl properties - water effect NTC

Stadem, Richard D.

Wed, 29 Aug 2007 14:40:31 -0500

195 lines

SV: [TN] PCB matl properties - water effect NTC

Hfjord

Wed, 29 Aug 2007 21:14:10 +0200

157 lines

New Thread

SV: [TN] Plasma "oxidation"

Re: SV: [TN] Plasma "oxidation"

Dennis Fritz

Fri, 31 Aug 2007 16:00:46 EDT

40 lines

Re: SV: [TN] Plasma "oxidation"

Upton, Shawn

Fri, 31 Aug 2007 15:25:14 -0400

621 lines

Re: SV: [TN] Plasma "oxidation"

Frederick Miller

Fri, 31 Aug 2007 15:23:32 -0400

665 lines

Re: SV: [TN] Plasma "oxidation"

Wayne Thayer

Fri, 31 Aug 2007 15:09:43 -0400

590 lines

SV: [TN] Plasma "oxidation"

Hfjord

Fri, 31 Aug 2007 20:46:16 +0200

639 lines

SV: [TN] Plasma "oxidation"

Hfjord

Fri, 31 Aug 2007 17:41:06 +0200

239 lines

New Thread

SV: [TN] Rework question

SV: [TN] Rework question

Hfjord

Tue, 7 Aug 2007 21:44:22 +0200

176 lines

New Thread

SV: [TN] Solder mask as an insulator - illustration posted

SV: [TN] Solder mask as an insulator - illustration posted

Hfjord

Fri, 17 Aug 2007 20:42:15 +0200

189 lines

New Thread

SV: [TN] SV: [TN] Analysts, look here, nice tool for you

SV: [TN] SV: [TN] Analysts, look here, nice tool for you

Hfjord

Tue, 21 Aug 2007 20:53:47 +0200

160 lines

New Thread

SV: [TN] SV: [TN] PCB matl properties - water effect NTC

Re: SV: [TN] SV: [TN] PCB matl properties - water effect NTC

Hernefjord Ingemar

Thu, 30 Aug 2007 08:02:26 +0200

264 lines

Re: SV: [TN] SV: [TN] PCB matl properties - water effect NTC

John Burke

Wed, 29 Aug 2007 16:24:56 -0700

295 lines

Re: SV: [TN] SV: [TN] PCB matl properties - water effect NTC

Whittaker, Dewey (EHCOE)

Wed, 29 Aug 2007 13:26:48 -0700

260 lines

SV: [TN] SV: [TN] PCB matl properties - water effect NTC

Hfjord

Wed, 29 Aug 2007 22:09:11 +0200

229 lines

New Thread

SV: [TN] The perils of using Alcohol for cleaning

SV: [TN] The perils of using Alcohol for cleaning

Hfjord

Wed, 29 Aug 2007 21:07:37 +0200

177 lines

New Thread

SV: [TN] U/S vs liquids vs temp vs cavity efficiency

Re: SV: [TN] U/S vs liquids vs temp vs cavity efficiency

Stadem, Richard D.

Thu, 30 Aug 2007 15:46:41 -0500

246 lines

SV: [TN] U/S vs liquids vs temp vs cavity efficiency

Hfjord

Thu, 30 Aug 2007 22:27:08 +0200

261 lines

New Thread

SV: [TN] U/S vs liquids vs temp vs cavity efficiensy

SV: [TN] U/S vs liquids vs temp vs cavity efficiensy

Hfjord

Thu, 23 Aug 2007 22:33:46 +0200

222 lines

SV: [TN] U/S vs liquids vs temp vs cavity efficiensy

Hfjord

Thu, 23 Aug 2007 17:26:51 +0200

221 lines

New Thread

SV: [TN] [EN] Is Brian allowed to boast?

SV: [TN] [EN] Is Brian allowed to boast?

Hfjord

Thu, 2 Aug 2007 16:56:27 +0200

178 lines

New Thread

Tacking potting material

Re: Tacking potting material

Stadem, Richard D.

Wed, 15 Aug 2007 08:04:46 -0500

105 lines

Re: Tacking potting material

Hernefjord Ingemar

Wed, 15 Aug 2007 08:28:02 +0200

83 lines

Re: Tacking potting material

Gerald Bogert

Tue, 14 Aug 2007 18:28:49 -0400

57 lines

Re: Tacking potting material

Richard Kraszewski

Tue, 14 Aug 2007 14:46:45 -0500

66 lines

Re: Tacking potting material

Louis, Edwin @ CSE

Tue, 14 Aug 2007 15:42:37 -0400

52 lines

Re: Tacking potting material

Whittaker, Dewey (EHCOE)

Tue, 14 Aug 2007 12:24:03 -0700

55 lines

Re: Tacking potting material

Douglas O. Pauls

Tue, 14 Aug 2007 14:17:11 -0500

87 lines

Tacking potting material

<>

Tue, 14 Aug 2007 14:05:19 -0500

49 lines

New Thread

The perils of using Alcohol for cleaning

Re: The perils of using Alcohol for cleaning

Phil Nutting

Thu, 30 Aug 2007 07:57:21 -0400

129 lines

Re: The perils of using Alcohol for cleaning

<>

Thu, 30 Aug 2007 00:08:14 EDT

68 lines

Re: The perils of using Alcohol for cleaning

Bill Kunkle

Wed, 29 Aug 2007 12:40:36 -0500

138 lines

Re: The perils of using Alcohol for cleaning

Mike Fenner

Wed, 29 Aug 2007 12:37:30 +0100

110 lines

Re: The perils of using Alcohol for cleaning

Brian Ellis

Wed, 29 Aug 2007 14:22:27 +0300

130 lines

Re: The perils of using Alcohol for cleaning

Hernefjord Ingemar

Wed, 29 Aug 2007 12:26:54 +0200

115 lines

Re: The perils of using Alcohol for cleaning

Brian Ellis

Wed, 29 Aug 2007 11:54:26 +0300

73 lines

The perils of using Alcohol for cleaning

Phil Nutting

Tue, 28 Aug 2007 09:11:37 -0400

34 lines

New Thread

Thermal Back Plane Termination Devices, IPC-A-610D

Re: Thermal Back Plane Termination Devices, IPC-A-610D

Bev Christian

Thu, 23 Aug 2007 09:05:31 -0400

76 lines

Thermal Back Plane Termination Devices, IPC-A-610D

Victor G. Hernandez

Thu, 23 Aug 2007 07:15:49 -0500

30 lines

New Thread

Through hole soldering of ENIG finish

Through hole soldering of ENIG finish

Kathy Bergman

Thu, 9 Aug 2007 16:08:16 -0700

44 lines

New Thread

Transfer Check sheet/list

Re: Transfer Check sheet/list

Phil Nutting

Tue, 28 Aug 2007 14:10:33 -0400

68 lines

Transfer Check sheet/list

Dan Mauro

Tue, 28 Aug 2007 11:38:30 -0400

35 lines

New Thread

U/S vs liquids vs temp vs cavity efficiency

Re: U/S vs liquids vs temp vs cavity efficiency

Blomberg, Rainer (FL51)

Thu, 30 Aug 2007 14:49:59 -0500

196 lines

Re: U/S vs liquids vs temp vs cavity efficiency

Hernefjord Ingemar

Thu, 23 Aug 2007 16:25:06 +0200

149 lines

New Thread

U/S vs liquids vs temp vs cavity efficiensy

Re: U/S vs liquids vs temp vs cavity efficiensy

Whittaker, Dewey (EHCOE)

Thu, 23 Aug 2007 09:36:15 -0700

248 lines

Re: U/S vs liquids vs temp vs cavity efficiensy

Brian Ellis

Thu, 23 Aug 2007 18:08:17 +0300

212 lines

Re: U/S vs liquids vs temp vs cavity efficiensy

Whittaker, Dewey (EHCOE)

Thu, 23 Aug 2007 07:46:42 -0700

186 lines

Re: U/S vs liquids vs temp vs cavity efficiensy

Bev Christian

Thu, 23 Aug 2007 10:41:36 -0400

144 lines

Re: U/S vs liquids vs temp vs cavity efficiensy

Brian Ellis

Thu, 23 Aug 2007 16:52:02 +0300

110 lines

Re: U/S vs liquids vs temp vs cavity efficiensy

Bev Christian

Thu, 23 Aug 2007 09:17:04 -0400

86 lines

U/S vs liquids vs temp vs cavity efficiensy

Hernefjord Ingemar

Thu, 23 Aug 2007 10:50:27 +0200

37 lines

New Thread

UV epoxy

Re: UV epoxy

Peter Swanson

Wed, 29 Aug 2007 13:56:32 +0100

99 lines

UV epoxy

Genny Gibbard

Tue, 28 Aug 2007 11:06:03 -0600

38 lines

New Thread

VACUM CHAMBER

VACUM CHAMBER

al shirazi

Wed, 29 Aug 2007 09:28:51 -0700

77 lines

New Thread

vOID IN Micro BGA

Re: vOID IN Micro BGA

Dwight Mattix

Fri, 31 Aug 2007 15:45:25 -0700

176 lines

Re: void IN Micro BGA

John Burke

Fri, 31 Aug 2007 14:36:03 -0700

142 lines

Re: vOID IN Micro BGA

Bev Christian

Fri, 31 Aug 2007 13:14:16 -0400

152 lines

Re: vOID IN Micro BGA

Joe Macko

Fri, 31 Aug 2007 09:52:43 -0700

107 lines

Re: vOID IN Micro BGA

Vladimir Igoshev

Fri, 31 Aug 2007 12:04:23 -0400

69 lines

vOID IN Micro BGA

shankar rao

Fri, 31 Aug 2007 16:48:44 +0100

34 lines

New Thread

Werner Engelmaier contact info

Re: Werner Engelmaier contact info

John Burke

Fri, 31 Aug 2007 14:37:18 -0700

116 lines

Re: Werner Engelmaier contact info

Werner Engelmaier

Fri, 31 Aug 2007 15:11:12 -0400

71 lines

Re: Werner Engelmaier contact info

Kevin Glidden

Fri, 31 Aug 2007 14:23:53 -0400

118 lines

Re: Werner Engelmaier contact info

Bev Christian

Fri, 31 Aug 2007 14:12:40 -0400

88 lines

Werner Engelmaier contact info

Kevin Glidden

Fri, 31 Aug 2007 14:06:51 -0400

33 lines

New Thread

[EN] Is Brian allowed to boast?

Re: [EN] Is Brian allowed to boast?

Steve Gregory

Thu, 2 Aug 2007 07:04:09 -0500

64 lines

Re: [EN] Is Brian allowed to boast?

Mike Fenner

Thu, 2 Aug 2007 11:23:48 +0100

116 lines

Re: [EN] Is Brian allowed to boast?

Randy Bock Sr.

Wed, 1 Aug 2007 16:17:20 -0400

176 lines

Re: [EN] Is Brian allowed to boast?

Whittaker, Dewey (EHCOE)

Wed, 1 Aug 2007 12:38:20 -0700

119 lines

Re: [EN] Is Brian allowed to boast?

John Burke

Wed, 1 Aug 2007 11:29:11 -0700

85 lines

New Thread

[LF] Request for LF shrinkhole or hot tear failure data

Re: [LF] Request for LF shrinkhole or hot tear failure data

Stadem, Richard D.

Tue, 21 Aug 2007 16:16:22 -0500

420 lines

Re: [LF] Request for LF shrinkhole or hot tear failure data

Roberts, Jon

Tue, 21 Aug 2007 15:03:38 -0500

376 lines

Re: [LF] Request for LF shrinkhole or hot tear failure data

Stadem, Richard D.

Mon, 20 Aug 2007 06:51:49 -0500

228 lines

Re: [LF] Request for LF shrinkhole or hot tear failure data

Whittaker, Dewey (EHCOE)

Fri, 17 Aug 2007 13:39:59 -0700

173 lines

Advanced Options


Options

Log In

Log In

Get Password

Get Password


Search Archives

Search Archives


Subscribe or Unsubscribe

Subscribe or Unsubscribe


Archives

November 2017
October 2017
September 2017
August 2017
July 2017
June 2017
May 2017
April 2017
March 2017
February 2017
January 2017
December 2016
November 2016
October 2016
September 2016
August 2016
July 2016
June 2016
May 2016
April 2016
March 2016
February 2016
January 2016
December 2015
November 2015
October 2015
September 2015
August 2015
July 2015
June 2015
May 2015
April 2015
March 2015
February 2015
January 2015
December 2014
November 2014
October 2014
September 2014
August 2014
July 2014
June 2014
May 2014
April 2014
March 2014
February 2014
January 2014
December 2013
November 2013
October 2013
September 2013
August 2013
July 2013
June 2013
May 2013
April 2013
March 2013
February 2013
January 2013
December 2012
November 2012
October 2012
September 2012
August 2012
July 2012
June 2012
May 2012
April 2012
March 2012
February 2012
January 2012
December 2011
November 2011
October 2011
September 2011
August 2011
July 2011
June 2011
May 2011
April 2011
March 2011
February 2011
January 2011
December 2010
November 2010
October 2010
September 2010
August 2010
July 2010
June 2010
May 2010
April 2010
March 2010
February 2010
January 2010
December 2009
November 2009
October 2009
September 2009
August 2009
July 2009
June 2009
May 2009
April 2009
March 2009
February 2009
January 2009
December 2008
November 2008
October 2008
September 2008
August 2008
July 2008
June 2008
May 2008
April 2008
March 2008
February 2008
January 2008
December 2007
November 2007
October 2007
September 2007
August 2007
July 2007
June 2007
May 2007
April 2007
March 2007
February 2007
January 2007
December 2006
November 2006
October 2006
September 2006
August 2006
July 2006
June 2006
May 2006
April 2006
March 2006
February 2006
January 2006
December 2005
November 2005
October 2005
September 2005
August 2005
July 2005
June 2005
May 2005
April 2005
March 2005
February 2005
January 2005
December 2004
November 2004
October 2004
September 2004
August 2004
July 2004
June 2004
May 2004
April 2004
March 2004
February 2004
January 2004
December 2003
November 2003
October 2003
September 2003
August 2003
July 2003
June 2003
May 2003
April 2003
March 2003
February 2003
January 2003
December 2002
November 2002
October 2002
September 2002
August 2002
July 2002
June 2002
May 2002
April 2002
March 2002
February 2002
January 2002
December 2001
November 2001
October 2001
September 2001
August 2001
July 2001
June 2001
May 2001
April 2001
March 2001
February 2001
January 2001
December 2000
November 2000
October 2000
September 2000
August 2000
July 2000
June 2000
May 2000
April 2000
March 2000
February 2000
January 2000
December 1999
November 1999
October 1999
September 1999
August 1999
July 1999
June 1999
May 1999
April 1999
March 1999
February 1999
January 1999
December 1998
November 1998
October 1998
September 1998
August 1998
July 1998
June 1998
May 1998
April 1998
March 1998
February 1998
January 1998
December 1997
November 1997
October 1997
September 1997
August 1997
July 1997
June 1997
May 1997
April 1997
March 1997
February 1997
January 1997
1996
1995

ATOM RSS1 RSS2



LISTSERV.IPC.ORG

CataList Email List Search Powered by the LISTSERV Email List Manager