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August 2007


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Table of Contents:

"IT"???? (4 messages)
20 solder cycles? (3 messages)
26 AWG HML Wire (4 messages)
Accessing TechNet e-mails remotely (3 messages)
Alternate to rubber boots (4 messages)
Analysts, look here, nice tool for you (6 messages)
Another request (1 message)
Another Request. (3 messages)
Antw: Re: [TN] Lead-Free Problems? and Tin Lead too! (2 messages)
Antw: [TN] EMMI-question (2 messages)
Antw: [TN] SAC Soldered With SnPb (1 message)
Aqueous batch cleaner foaming (12 messages)
automated response (1 message)
Baking out board moisture (16 messages)
Battery recalls (NTC) (3 messages)
Bill Kasprzak is out of the office. (1 message)
Cleaning RoHS Assemblies (2 messages)
Conformal Coating Under Micro-BGAs (2 messages)
CTE Match for Repair (2 messages)
Darrel Therriault is out of the office until 08/13/2007. (1 message)
DDPak diodes in sticks/tubes (6 messages)
Delamination - can it be repaired? (3 messages)
Dent on BGA Pad (9 messages)
Does encapsulation make a part RoHS compliant? (13 messages)
Drill Rework (11 messages)
Dry Cicruit Low Level Contact Resistance of Immersion Silver (2 messages)
Electronic Assembly Services Ohio (4 messages)
EMMI-question (1 message)
ENIG solderability (1 message)
ES Line (1 message)
Ethics Question (6 messages)
Examples of "toe-down" flat ribbon, L and Gull Wing leads (1 message)
Failed Flex Circuit Assembly (4 messages)
Flux Cleaning (2 messages)
Flying Probe Tester (3 messages)
Force needed to remove SMT reel cover tape (5 messages)
FR-4 CARBONIZE TEMP (4 messages)
Friday NTC - water logged cell phone repair (25 messages)
Friday NTC: cool engineer or coolant engineer? (3 messages)
Friday: are you bored? I've something for you (1 message)
Fw: question regarding IPC standard (11 messages)
Henry Rekers is out of the office. (1 message)
Hole drill-Finish size versus min-max lead diameter, (2 messages)
IPC announces Product Compliance with Environmental Regulations webcast series, in December 2007 (1 message)
IPC Design for Assembly, November 12-13, 2007, Houston, TX (1 message)
IPC Design for Manufacture workshop, August 27-28, 2007, Fredericksburg, VA (1 message)
IPC Materials Declaration Workshop Series 8/07-Philadelphia, PA & 11/07-San Jose, CA (1 message)
IPC Materials Declaration Workshops offered in Boston, MA & San Jose, CA (1 message)
IPC PCB Fabrication "Back to the Basics" Webcast Series - Electroplating Technologies, August 23, 2007 (1 message)
IPC PCB Fabrication "Back to the Basics" webcast series continues in August (8/16, 8/23) (1 message)
IPC PCB Fabrication "Back to the Basics" Webcast Series continues, in August!!! (1 message)
IPC PCB Fabrication "Back to the Basics" Webcast Series in August 2007 (1 message)
IPC webcast: China RoHS: An Updated Roadmap to Achieving Compliance and Assessing Risks , 10/10/07 (1 message)
IPC-6012 questions.. (2 messages)
IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall (9 messages)
IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall Separation (7 messages)
IPC/JEDEC International Conference on Lead Free Electronics, 4 & 5 October 2007, Berlin, Germany (1 message)
IPC_SM-840C (3 messages)
IR Thermometer (7 messages)
Is Brian allowed to boast? (4 messages)
Joel Alexander is out of the office. (1 message)
Join IPC in Sarborough, Ontario, Canada, in August, and get up-to-date on Design (1 message)
Kevin--how to submit your comments (1 message)
Lead Contaminated Toys From China... (1 message)
Lead-Free Problems? (15 messages)
Lead-Free Problems? and Tin Lead too! (2 messages)
Mehmet Emin Yaman işyeri dışında. (1 message)
Microscope camera, solution (3 messages)
Microwave Laminate Material (1 message)
Minimum toe fillet for SOT23-3 land pattern (6 messages)
National Physical Laboratory NPL Industry Defect Database (1 message)
Need help locating a shop that does assembly of flex circuits (1 message)
New IPC webcast series in November: Via Hole Filling Technology & Processes (1 message)
New IPC Webcast Series! Via Hole Filling Technology and Processes November 1 & 8, 2007 (1 message)
Non-aqueous cleaning (5 messages)
NTC - hope you are all safe (4 messages)
NTC - Re: [TN] Hot air and Tin Lead too! (2 messages)
NTC Seeking design information on PWB conductor spacing for high voltage (500-1000 VDC) applications (3 messages)
NTC, off-topic, off-colour, Friday joke (6 messages)
NTC-Friday (1 message)
Odd migration (3 messages)
optics (2 messages)
OSP Processing Recommendations (12 messages)
Pad shape for BGA (3 messages)
Pads removed during BGA Repair (5 messages)
Paint spray booths (1 message)
PCB assembly protection for outdoor working under harsh environmental conditions (6 messages)
PCB marking for shop control. (1 message)
PCB matl properties - water effect (8 messages)
PCB matl properties - water effect NTC (9 messages)
PCB Pad Cratering (2 messages)
PCBA shipping packaging specification/ guidelines (1 message)
PCBA storage conditions (1 message)
Plasma "oxidation" (11 messages)
PLCC Socket Pin damage (3 messages)
Press Fit Connector rework (8 messages)
Problems with Memeory modules and sockets (3 messages)
Problems with Memory modules and sockets (2 messages)
PTH integrity (3 messages)
Request for LF shrinkhole or hot tear failure data (2 messages)
Resistor codes (7 messages)
reverse engineering, legit style (9 messages)
Rework question (19 messages)
Rework question--No IPC limitations (3 messages)
RF Board Bow and Twist (1 message)
RoHS Compliance (3 messages)
SAC Soldered With SnPb (9 messages)
Scanning Acoustic Microscope (6 messages)
Seeking design information on PWB conductor spacing for high voltage (500-1000 VDC) applications (5 messages)
Silver PCB finish and reliability (question) (10 messages)
Solder mask as an insulator (8 messages)
Solder mask as an insulator - illustration posted (9 messages)
Solder Mask Solvent? (14 messages)
Soldering pure matte tin plated component leads using Sn63Pb37 solder (2 messages)
Standard for tape and reel part (2 messages)
Standard Improvement Form (2 messages)
Strange crystal growth (9 messages)
Suggestions for Pressing in Pins... (3 messages)
SV: [TN] Analysts, look here, nice tool for you (5 messages)
SV: [TN] Friday NTC - water logged cell phone repair (1 message)
SV: [TN] Is Brian allowed to boast? (1 message)
SV: [TN] Microwave Laminate Material (1 message)
SV: [TN] Odd migration (1 message)
SV: [TN] optics (1 message)
SV: [TN] PCB matl properties - water effect NTC (2 messages)
SV: [TN] Plasma "oxidation" (6 messages)
SV: [TN] Rework question (1 message)
SV: [TN] Solder mask as an insulator - illustration posted (1 message)
SV: [TN] SV: [TN] Analysts, look here, nice tool for you (1 message)
SV: [TN] SV: [TN] PCB matl properties - water effect NTC (4 messages)
SV: [TN] The perils of using Alcohol for cleaning (1 message)
SV: [TN] U/S vs liquids vs temp vs cavity efficiency (2 messages)
SV: [TN] U/S vs liquids vs temp vs cavity efficiensy (2 messages)
SV: [TN] [EN] Is Brian allowed to boast? (1 message)
Tacking potting material (8 messages)
The perils of using Alcohol for cleaning (8 messages)
Thermal Back Plane Termination Devices, IPC-A-610D (2 messages)
Through hole soldering of ENIG finish (1 message)
Transfer Check sheet/list (2 messages)
U/S vs liquids vs temp vs cavity efficiency (2 messages)
U/S vs liquids vs temp vs cavity efficiensy (7 messages)
UV epoxy (2 messages)
VACUM CHAMBER (1 message)
vOID IN Micro BGA (6 messages)
Werner Engelmaier contact info (5 messages)
[EN] Is Brian allowed to boast? (5 messages)
[LF] Request for LF shrinkhole or hot tear failure data (4 messages)

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Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

"IT"????

Re: "IT"????

Jack Olson <[log in to unmask]>

Wed, 1 Aug 2007 09:05:36 -0500

79 lines

Re: "IT"????

Dave Dixon <[log in to unmask]>

Wed, 1 Aug 2007 12:56:52 -0500

74 lines

Re: "IT"????

Jack Olson <[log in to unmask]>

Thu, 2 Aug 2007 10:47:23 -0500

89 lines

Re: "IT"????

Stadem, Richard D. <[log in to unmask]>

Thu, 2 Aug 2007 11:00:11 -0500

129 lines

New Thread

20 solder cycles?

20 solder cycles?

Dan Skweres <[log in to unmask]>

Fri, 10 Aug 2007 13:57:55 -0400

37 lines

Re: 20 solder cycles?

Steve Kelly <[log in to unmask]>

Fri, 10 Aug 2007 14:19:22 -0400

72 lines

Re: 20 solder cycles?

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Fri, 10 Aug 2007 11:23:51 -0700

66 lines

New Thread

26 AWG HML Wire

26 AWG HML Wire

Donald Kyle <[log in to unmask]>

Fri, 24 Aug 2007 11:08:06 -0500

65 lines

Re: 26 AWG HML Wire

Steve Gregory <[log in to unmask]>

Fri, 24 Aug 2007 13:29:43 -0500

96 lines

Re: 26 AWG HML Wire

Hogg, Blair K. <[log in to unmask]>

Mon, 27 Aug 2007 07:32:17 -0400

135 lines

Re: 26 AWG HML Wire

[log in to unmask]

Mon, 27 Aug 2007 16:30:29 -0500

192 lines

New Thread

Accessing TechNet e-mails remotely

Accessing TechNet e-mails remotely

Terry Kozlyk <[log in to unmask]>

Fri, 10 Aug 2007 21:47:05 -0600

76 lines

Re: Accessing TechNet e-mails remotely

Stadem, Richard D. <[log in to unmask]>

Mon, 13 Aug 2007 07:46:56 -0500

103 lines

Re: Accessing TechNet e-mails remotely

Hogg, Blair K. <[log in to unmask]>

Mon, 13 Aug 2007 11:59:11 -0400

115 lines

New Thread

Alternate to rubber boots

Alternate to rubber boots

Gervascio, Thomas <[log in to unmask]>

Fri, 31 Aug 2007 09:36:17 -0400

27 lines

Re: Alternate to rubber boots

Stadem, Richard D. <[log in to unmask]>

Fri, 31 Aug 2007 08:50:23 -0500

51 lines

Re: Alternate to rubber boots

Steve Gregory <[log in to unmask]>

Fri, 31 Aug 2007 08:51:16 -0500

59 lines

Re: Alternate to rubber boots

Douglas O. Pauls <[log in to unmask]>

Fri, 31 Aug 2007 11:21:24 -0500

73 lines

New Thread

Analysts, look here, nice tool for you

Analysts, look here, nice tool for you

Hernefjord Ingemar <[log in to unmask]>

Tue, 21 Aug 2007 12:19:46 +0200

27 lines

Re: Analysts, look here, nice tool for you

Randy Bock Sr. <[log in to unmask]>

Tue, 21 Aug 2007 06:45:10 -0400

85 lines

Re: Analysts, look here, nice tool for you

Werner Engelmaier <[log in to unmask]>

Tue, 21 Aug 2007 08:17:02 EDT

34 lines

Re: Analysts, look here, nice tool for you

Stadem, Richard D. <[log in to unmask]>

Tue, 21 Aug 2007 07:22:03 -0500

59 lines

Re: Analysts, look here, nice tool for you

Hernefjord Ingemar <[log in to unmask]>

Tue, 21 Aug 2007 15:53:52 +0200

39 lines

Re: Analysts, look here, nice tool for you

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Tue, 21 Aug 2007 07:00:26 -0700

87 lines

New Thread

Another request

Another request

Dan Skweres <[log in to unmask]>

Tue, 14 Aug 2007 10:42:03 -0400

23 lines

New Thread

Another Request.

Another Request.

Dan Skweres <[log in to unmask]>

Mon, 13 Aug 2007 15:25:02 -0400

36 lines

Re: Another Request.

Chuck Brummer <[log in to unmask]>

Mon, 13 Aug 2007 14:46:57 -0700

86 lines

Re: Another Request.

Hernefjord Ingemar <[log in to unmask]>

Tue, 14 Aug 2007 08:59:40 +0200

66 lines

New Thread

Antw: Re: [TN] Lead-Free Problems? and Tin Lead too!

Antw: Re: [TN] Lead-Free Problems? and Tin Lead too!

Guenter Grossmann <[log in to unmask]>

Wed, 15 Aug 2007 16:18:16 +0200

94 lines

Re: Antw: Re: [TN] Lead-Free Problems? and Tin Lead too!

Mike Fenner <[log in to unmask]>

Wed, 15 Aug 2007 15:46:28 +0100

135 lines

New Thread

Antw: [TN] EMMI-question

Antw: [TN] EMMI-question

Guenter Grossmann <[log in to unmask]>

Wed, 22 Aug 2007 09:18:05 +0200

73 lines

Re: Antw: [TN] EMMI-question

Hernefjord Ingemar <[log in to unmask]>

Wed, 22 Aug 2007 09:43:22 +0200

95 lines

New Thread

Antw: [TN] SAC Soldered With SnPb

Antw: [TN] SAC Soldered With SnPb

Guenter Grossmann <[log in to unmask]>

Wed, 15 Aug 2007 16:23:49 +0200

73 lines

New Thread

Aqueous batch cleaner foaming

Aqueous batch cleaner foaming

Rob Strecker <[log in to unmask]>

Mon, 13 Aug 2007 16:11:55 -0600

43 lines

Re: Aqueous batch cleaner foaming

R Sedlak <[log in to unmask]>

Mon, 13 Aug 2007 16:39:06 -0700

77 lines

Re: Aqueous batch cleaner foaming

Brian Ellis <[log in to unmask]>

Tue, 14 Aug 2007 10:04:30 +0300

82 lines

Re: Aqueous batch cleaner foaming

Hernefjord Ingemar <[log in to unmask]>

Tue, 14 Aug 2007 09:10:46 +0200

101 lines

Re: Aqueous batch cleaner foaming

Brian Ellis <[log in to unmask]>

Tue, 14 Aug 2007 10:33:46 +0300

130 lines

Re: Aqueous batch cleaner foaming

Hernefjord Ingemar <[log in to unmask]>

Tue, 14 Aug 2007 09:50:14 +0200

148 lines

Re: Aqueous batch cleaner foaming

R Sedlak <[log in to unmask]>

Tue, 14 Aug 2007 02:52:59 -0700

94 lines

Re: Aqueous batch cleaner foaming

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Tue, 14 Aug 2007 06:53:50 -0700

180 lines

Re: Aqueous batch cleaner foaming

Rob Strecker <[log in to unmask]>

Tue, 14 Aug 2007 08:29:59 -0600

164 lines

Re: Aqueous batch cleaner foaming

Stephen Pence <[log in to unmask]>

Tue, 14 Aug 2007 11:06:42 -0400

219 lines

Re: Aqueous batch cleaner foaming

R Sedlak <[log in to unmask]>

Tue, 14 Aug 2007 10:00:28 -0700

52 lines

Re: Aqueous batch cleaner foaming

Mike Fenner <[log in to unmask]>

Wed, 15 Aug 2007 15:05:21 +0100

103 lines

New Thread

automated response

automated response

Vinit Verma <[log in to unmask]>

Tue, 28 Aug 2007 23:42:02 +0530

28 lines

New Thread

Baking out board moisture

Baking out board moisture

Rob Strecker <[log in to unmask]>

Thu, 23 Aug 2007 12:03:48 -0600

42 lines

Re: Baking out board moisture

Hernefjord Ingemar <[log in to unmask]>

Fri, 24 Aug 2007 08:03:21 +0200

87 lines

Re: Baking out board moisture

Leo Higgins <[log in to unmask]>

Thu, 23 Aug 2007 23:11:43 -0700

93 lines

Re: Baking out board moisture

Fox, Ian <[log in to unmask]>

Fri, 24 Aug 2007 07:53:05 +0100

119 lines

Re: Baking out board moisture

Hernefjord Ingemar <[log in to unmask]>

Fri, 24 Aug 2007 09:14:31 +0200

151 lines

Re: Baking out board moisture

badri <[log in to unmask]>

Fri, 24 Aug 2007 15:04:16 +0530

195 lines

Re: Baking out board moisture

Werner Engelmaier <[log in to unmask]>

Fri, 24 Aug 2007 11:52:05 EDT

33 lines

Re: Baking out board moisture

Hernefjord Ingemar <[log in to unmask]>

Tue, 28 Aug 2007 08:47:09 +0200

79 lines

Re: Baking out board moisture

Ted Tontis <[log in to unmask]>

Tue, 28 Aug 2007 13:15:45 -0500

104 lines

Re: Baking out board moisture

Werner Engelmaier <[log in to unmask]>

Tue, 28 Aug 2007 16:22:22 EDT

34 lines

Re: Baking out board moisture

Rob Strecker <[log in to unmask]>

Tue, 28 Aug 2007 16:10:07 -0600

69 lines

Re: Baking out board moisture

Werner Engelmaier <[log in to unmask]>

Tue, 28 Aug 2007 18:34:35 EDT

34 lines

Re: Baking out board moisture

Hernefjord Ingemar <[log in to unmask]>

Wed, 29 Aug 2007 08:03:26 +0200

54 lines

Re: Baking out board moisture

Werner Engelmaier <[log in to unmask]>

Wed, 29 Aug 2007 07:23:17 EDT

31 lines

Re: Baking out board moisture

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Wed, 29 Aug 2007 06:35:29 -0700

82 lines

Re: Baking out board moisture

Larry Dzaugis <[log in to unmask]>

Wed, 29 Aug 2007 15:30:06 -0500

31 lines

New Thread

Battery recalls (NTC)

Battery recalls (NTC)

Tempea, Ioan <[log in to unmask]>

Wed, 15 Aug 2007 15:15:07 -0400

33 lines

Re: Battery recalls (NTC)

Hogg, Blair K. <[log in to unmask]>

Wed, 15 Aug 2007 16:13:38 -0400

70 lines

Re: Battery recalls (NTC)

Phil Nutting <[log in to unmask]>

Wed, 15 Aug 2007 16:17:20 -0400

100 lines

New Thread

Bill Kasprzak is out of the office.

Bill Kasprzak is out of the office.

Bill Kasprzak <[log in to unmask]>

Thu, 30 Aug 2007 01:00:39 -0400

26 lines

New Thread

Cleaning RoHS Assemblies

Cleaning RoHS Assemblies

Paymon Sani <[log in to unmask]>

Thu, 23 Aug 2007 11:11:53 -0400

35 lines

Re: Cleaning RoHS Assemblies

Brian Ellis <[log in to unmask]>

Fri, 24 Aug 2007 09:42:15 +0300

59 lines

New Thread

Conformal Coating Under Micro-BGAs

Conformal Coating Under Micro-BGAs

Louis, Edwin @ CSE <[log in to unmask]>

Fri, 3 Aug 2007 08:32:04 -0400

25 lines

Re: Conformal Coating Under Micro-BGAs

John Burke <[log in to unmask]>

Fri, 3 Aug 2007 09:32:27 -0700

63 lines

New Thread

CTE Match for Repair

CTE Match for Repair

Jay Otts <[log in to unmask]>

Thu, 16 Aug 2007 19:22:36 -0500

29 lines

Re: CTE Match for Repair

Wayne Thayer <[log in to unmask]>

Fri, 17 Aug 2007 08:26:24 -0400

60 lines

New Thread

Darrel Therriault is out of the office until 08/13/2007.

Darrel Therriault is out of the office until 08/13/2007.

Darrel Therriault <[log in to unmask]>

Fri, 10 Aug 2007 00:25:42 -0700

24 lines

New Thread

DDPak diodes in sticks/tubes

DDPak diodes in sticks/tubes

Davis, Larry <[log in to unmask]>

Wed, 15 Aug 2007 11:50:13 -0700

43 lines

Re: DDPak diodes in sticks/tubes

Tempea, Ioan <[log in to unmask]>

Wed, 15 Aug 2007 15:00:55 -0400

87 lines

Re: DDPak diodes in sticks/tubes

Yannick Brisson <[log in to unmask]>

Wed, 15 Aug 2007 15:23:34 -0400

76 lines

Re: DDPak diodes in sticks/tubes

Davis, Larry <[log in to unmask]>

Thu, 16 Aug 2007 06:27:49 -0700

123 lines

Re: DDPak diodes in sticks/tubes

Davis, Larry <[log in to unmask]>

Thu, 16 Aug 2007 06:32:11 -0700

104 lines

Re: DDPak diodes in sticks/tubes

Stadem, Richard D. <[log in to unmask]>

Thu, 16 Aug 2007 08:39:15 -0500

127 lines

New Thread

Delamination - can it be repaired?

Delamination - can it be repaired?

Bob Perkins <[log in to unmask]>

Thu, 16 Aug 2007 10:18:21 -0700

55 lines

Re: Delamination - can it be repaired?

Stadem, Richard D. <[log in to unmask]>

Thu, 16 Aug 2007 12:44:05 -0500

83 lines

Re: Delamination - can it be repaired?

Scott Westheimer <[log in to unmask]>

Thu, 16 Aug 2007 16:09:42 -0400

65 lines

New Thread

Dent on BGA Pad

Dent on BGA Pad

Kane, Amol (349) <[log in to unmask]>

Tue, 7 Aug 2007 07:42:09 -0400

51 lines

Re: Dent on BGA Pad

Victor G. Hernandez <[log in to unmask]>

Tue, 7 Aug 2007 06:44:57 -0500

79 lines

Re: Dent on BGA Pad

Steve Gregory <[log in to unmask]>

Tue, 7 Aug 2007 07:26:10 -0500

152 lines

Re: Dent on BGA Pad

Kerry McMullen <[log in to unmask]>

Tue, 7 Aug 2007 08:44:10 -0400

256 lines

Re: Dent on BGA Pad

Kane, Amol (349) <[log in to unmask]>

Tue, 7 Aug 2007 09:17:36 -0400

176 lines

Re: Dent on BGA Pad

Victor G. Hernandez <[log in to unmask]>

Tue, 7 Aug 2007 08:59:36 -0500

183 lines

Re: Dent on BGA Pad

Kevin Glidden <[log in to unmask]>

Tue, 7 Aug 2007 10:02:38 -0400

212 lines

Re: Dent on BGA Pad

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Tue, 7 Aug 2007 07:18:07 -0700

269 lines

Re: Dent on BGA Pad

Kane, Amol (349) <[log in to unmask]>

Tue, 7 Aug 2007 11:27:52 -0400

304 lines

New Thread

Does encapsulation make a part RoHS compliant?

Does encapsulation make a part RoHS compliant?

Phil Nutting <[log in to unmask]>

Wed, 15 Aug 2007 10:50:46 -0400

51 lines

Re: Does encapsulation make a part RoHS compliant?

Randy Bock Sr. <[log in to unmask]>

Wed, 15 Aug 2007 10:56:32 -0400

112 lines

Re: Does encapsulation make a part RoHS compliant?

Eric CHRISTISON <[log in to unmask]>

Wed, 15 Aug 2007 15:59:37 +0100

81 lines

Re: Does encapsulation make a part RoHS compliant?

Lenny Carter <[log in to unmask]>

Wed, 15 Aug 2007 12:10:13 -0500

120 lines

Re: Does encapsulation make a part RoHS compliant?

Mike Fenner <[log in to unmask]>

Wed, 15 Aug 2007 17:14:52 +0100

118 lines

Re: Does encapsulation make a part RoHS compliant?

John Burke <[log in to unmask]>

Wed, 15 Aug 2007 09:47:21 -0700

93 lines

Re: Does encapsulation make a part RoHS compliant?

John Burke <[log in to unmask]>

Wed, 15 Aug 2007 09:47:21 -0700

153 lines

Re: Does encapsulation make a part RoHS compliant?

Phil Nutting <[log in to unmask]>

Wed, 15 Aug 2007 13:02:42 -0400

126 lines

Re: Does encapsulation make a part RoHS compliant?

Ryan Grant <[log in to unmask]>

Wed, 15 Aug 2007 11:04:07 -0600

206 lines

Re: Does encapsulation make a part RoHS compliant?

Phil Nutting <[log in to unmask]>

Wed, 15 Aug 2007 13:10:14 -0400

237 lines

Re: Does encapsulation make a part RoHS compliant?

John Burke <[log in to unmask]>

Wed, 15 Aug 2007 10:17:16 -0700

239 lines

Re: Does encapsulation make a part RoHS compliant?

Ryan Grant <[log in to unmask]>

Wed, 15 Aug 2007 11:33:32 -0600

282 lines

Re: Does encapsulation make a part RoHS compliant?

Ian Hanna <[log in to unmask]>

Wed, 15 Aug 2007 14:43:29 -0400

151 lines

New Thread

Drill Rework

Drill Rework

Kerry McMullen <[log in to unmask]>

Wed, 15 Aug 2007 14:27:39 -0400

39 lines

Re: Drill Rework

Phil Nutting <[log in to unmask]>

Wed, 15 Aug 2007 14:33:05 -0400

77 lines

Re: Drill Rework

Stadem, Richard D. <[log in to unmask]>

Wed, 15 Aug 2007 13:55:18 -0500

82 lines

Re: Drill Rework

Stadem, Richard D. <[log in to unmask]>

Wed, 15 Aug 2007 13:59:42 -0500

104 lines

Re: Drill Rework

Tony Steinke <[log in to unmask]>

Wed, 15 Aug 2007 17:27:55 -0400

68 lines

Re: Drill Rework

Scott Westheimer <[log in to unmask]>

Wed, 15 Aug 2007 16:35:15 -0400

47 lines

Re: Drill Rework

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Wed, 15 Aug 2007 14:20:47 -0700

198 lines

Re: Drill Rework

Wayne Thayer <[log in to unmask]>

Wed, 15 Aug 2007 22:08:43 -0400

237 lines

Re: Drill Rework

Phil Nutting <[log in to unmask]>

Thu, 16 Aug 2007 07:52:57 -0400

224 lines

Re: Drill Rework

Kerry McMullen <[log in to unmask]>

Thu, 16 Aug 2007 08:16:59 -0400

270 lines

Re: Drill Rework

Peter Vigneau <[log in to unmask]>

Thu, 16 Aug 2007 11:26:24 -0400

326 lines

New Thread

Dry Cicruit Low Level Contact Resistance of Immersion Silver

Dry Cicruit Low Level Contact Resistance of Immersion Silver

Gerald Gagnon <[log in to unmask]>

Wed, 8 Aug 2007 14:56:56 -0400

39 lines

Re: Dry Cicruit Low Level Contact Resistance of Immersion Silver

John Burke <[log in to unmask]>

Wed, 8 Aug 2007 12:25:51 -0700

73 lines

New Thread

Electronic Assembly Services Ohio

Electronic Assembly Services Ohio

Tom Stearns <[log in to unmask]>

Mon, 27 Aug 2007 16:51:25 -0400

33 lines

Re: Electronic Assembly Services Ohio

[log in to unmask]

Mon, 27 Aug 2007 16:32:30 -0500

94 lines

Re: Electronic Assembly Services Ohio

Steve Smith <[log in to unmask]>

Mon, 27 Aug 2007 17:54:07 -0400

84 lines

Re: Electronic Assembly Services Ohio

Hogg, Blair K. <[log in to unmask]>

Tue, 28 Aug 2007 07:35:50 -0400

87 lines

New Thread

EMMI-question

EMMI-question

Hernefjord Ingemar <[log in to unmask]>

Wed, 22 Aug 2007 08:19:57 +0200

30 lines

New Thread

ENIG solderability

Re: ENIG solderability

Hogg, Blair K. <[log in to unmask]>

Wed, 1 Aug 2007 08:16:19 -0400

140 lines

New Thread

ES Line

ES Line

Greg Triggs <[log in to unmask]>

Fri, 31 Aug 2007 10:23:43 -0700

25 lines

New Thread

Ethics Question

Ethics Question

Douglas O. Pauls <[log in to unmask]>

Wed, 8 Aug 2007 16:44:31 -0500

37 lines

Re: Ethics Question

R Sedlak <[log in to unmask]>

Wed, 8 Aug 2007 15:08:26 -0700

60 lines

Re: Ethics Question

Bernard Kessler <[log in to unmask]>

Wed, 8 Aug 2007 15:23:17 -0700

94 lines

Re: Ethics Question

Douglas O. Pauls <[log in to unmask]>

Thu, 9 Aug 2007 06:43:08 -0500

110 lines

Re: Ethics Question

Richard Olsen <[log in to unmask]>

Thu, 9 Aug 2007 10:54:31 -0700

134 lines

Re: Ethics Question

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Thu, 9 Aug 2007 11:07:27 -0700

179 lines

New Thread

Examples of "toe-down" flat ribbon, L and Gull Wing leads

Examples of "toe-down" flat ribbon, L and Gull Wing leads

Joe Macko <[log in to unmask]>

Fri, 17 Aug 2007 16:08:36 -0700

39 lines

New Thread

Failed Flex Circuit Assembly

Failed Flex Circuit Assembly

Steve Kelly <[log in to unmask]>

Wed, 8 Aug 2007 17:05:28 -0400

66 lines

Re: Failed Flex Circuit Assembly

Wayne Thayer <[log in to unmask]>

Thu, 9 Aug 2007 00:02:00 -0400

126 lines

Re: Failed Flex Circuit Assembly

Steve Kelly <[log in to unmask]>

Thu, 9 Aug 2007 08:41:26 -0400

141 lines

Re: Failed Flex Circuit Assembly

Wayne Thayer <[log in to unmask]>

Thu, 9 Aug 2007 09:17:47 -0400

174 lines

New Thread

Flux Cleaning

Flux Cleaning

jonathan noquil <[log in to unmask]>

Tue, 7 Aug 2007 11:16:13 +0800

29 lines

Re: Flux Cleaning

Stadem, Richard D. <[log in to unmask]>

Tue, 7 Aug 2007 07:54:46 -0500

53 lines

New Thread

Flying Probe Tester

Flying Probe Tester

Tim Mack <[log in to unmask]>

Wed, 8 Aug 2007 11:28:46 -0500

51 lines

Re: Flying Probe Tester

Syed Ahmad <[log in to unmask]>

Wed, 8 Aug 2007 13:23:23 -0500

80 lines

Re: Flying Probe Tester

Kerry McMullen <[log in to unmask]>

Thu, 9 Aug 2007 09:32:29 -0400

102 lines

New Thread

Force needed to remove SMT reel cover tape

Force needed to remove SMT reel cover tape

Bev Christian <[log in to unmask]>

Tue, 28 Aug 2007 17:20:11 -0400

40 lines

Re: Force needed to remove SMT reel cover tape

Guy Ramsey <[log in to unmask]>

Wed, 29 Aug 2007 07:29:15 -0400

64 lines

Re: Force needed to remove SMT reel cover tape

Jerry Dengler <[log in to unmask]>

Wed, 29 Aug 2007 07:51:07 -0400

74 lines

Re: Force needed to remove SMT reel cover tape

Joel Alexander <[log in to unmask]>

Wed, 29 Aug 2007 10:37:14 -0400

115 lines

Re: Force needed to remove SMT reel cover tape

mech_eng <[log in to unmask]>

Thu, 30 Aug 2007 08:34:49 +0200

107 lines

New Thread

FR-4 CARBONIZE TEMP

FR-4 CARBONIZE TEMP

Wood, Kenneth <[log in to unmask]>

Wed, 1 Aug 2007 07:58:31 -0400

38 lines

Re: FR-4 CARBONIZE TEMP

Brian Ellis <[log in to unmask]>

Wed, 1 Aug 2007 15:08:28 +0300

63 lines

Re: FR-4 CARBONIZE TEMP

Ido Mashall <[log in to unmask]>

Wed, 1 Aug 2007 15:22:28 +0300

82 lines

Re: FR-4 CARBONIZE TEMP

Victor G. Hernandez <[log in to unmask]>

Wed, 1 Aug 2007 07:33:50 -0500

121 lines

New Thread

Friday NTC - water logged cell phone repair

Friday NTC - water logged cell phone repair

Anil Kher <[log in to unmask]>

Fri, 10 Aug 2007 12:51:56 +0530

43 lines

Re: Friday NTC - water logged cell phone repair

Randy Bock Sr. <[log in to unmask]>

Fri, 10 Aug 2007 06:04:05 -0400

105 lines

Re: Friday NTC - water logged cell phone repair

Braddock, Iain <[log in to unmask]>

Fri, 10 Aug 2007 11:30:36 +0100

165 lines

Re: Friday NTC - water logged cell phone repair

Brian Ellis <[log in to unmask]>

Fri, 10 Aug 2007 14:27:27 +0300

65 lines

Re: Friday NTC - water logged cell phone repair

Anil Kher <[log in to unmask]>

Fri, 10 Aug 2007 17:39:17 +0530

92 lines

Re: Friday NTC - water logged cell phone repair

Dennis Fritz <[log in to unmask]>

Fri, 10 Aug 2007 08:37:14 EDT

41 lines

Re: Friday NTC - water logged cell phone repair

Bev Christian <[log in to unmask]>

Fri, 10 Aug 2007 08:48:07 -0400

96 lines

Re: Friday NTC - water logged cell phone repair

Hogg, Blair K. <[log in to unmask]>

Fri, 10 Aug 2007 09:36:34 -0400

89 lines

Re: Friday NTC - water logged cell phone repair

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Fri, 10 Aug 2007 06:45:28 -0700

77 lines

Re: Friday NTC - water logged cell phone repair

David Tremmel <[log in to unmask]>

Fri, 10 Aug 2007 08:53:38 -0500

119 lines

Re: Friday NTC - water logged cell phone repair

Douglas O. Pauls <[log in to unmask]>

Fri, 10 Aug 2007 08:56:28 -0500

121 lines

Re: Friday NTC - water logged cell phone repair

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Fri, 10 Aug 2007 07:00:31 -0700

151 lines

Re: Friday NTC - water logged cell phone repair

Bev Christian <[log in to unmask]>

Fri, 10 Aug 2007 10:08:07 -0400

190 lines

Re: Friday NTC - water logged cell phone repair

Syed Ahmad <[log in to unmask]>

Fri, 10 Aug 2007 09:51:44 -0500

191 lines

Re: Friday NTC - water logged cell phone repair

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Fri, 10 Aug 2007 11:21:08 -0700

187 lines

Re: Friday NTC - water logged cell phone repair

Gary Crowell <[log in to unmask]>

Mon, 13 Aug 2007 09:27:16 -0600

146 lines

Re: Friday NTC - water logged cell phone repair

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Mon, 13 Aug 2007 08:44:20 -0700

175 lines

Re: Friday NTC - water logged cell phone repair

Douglas O. Pauls <[log in to unmask]>

Mon, 13 Aug 2007 11:54:21 -0500

191 lines

Re: Friday NTC - water logged cell phone repair

Phil Nutting <[log in to unmask]>

Mon, 13 Aug 2007 13:20:52 -0400

202 lines

Re: Friday NTC - water logged cell phone repair

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Mon, 13 Aug 2007 10:28:11 -0700

228 lines

Re: Friday NTC - water logged cell phone repair

John Burke <[log in to unmask]>

Mon, 13 Aug 2007 10:37:16 -0700

175 lines

Re: Friday NTC - water logged cell phone repair

John Burke <[log in to unmask]>

Mon, 13 Aug 2007 10:50:18 -0700

209 lines

Re: Friday NTC - water logged cell phone repair

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Mon, 13 Aug 2007 10:56:46 -0700

241 lines

Re: Friday NTC - water logged cell phone repair

Stadem, Richard D. <[log in to unmask]>

Mon, 13 Aug 2007 13:02:28 -0500

238 lines

Re: Friday NTC - water logged cell phone repair

Werner Engelmaier <[log in to unmask]>

Mon, 13 Aug 2007 16:42:56 EDT

31 lines

New Thread

Friday NTC: cool engineer or coolant engineer?

Friday NTC: cool engineer or coolant engineer?

Hernefjord Ingemar <[log in to unmask]>

Fri, 24 Aug 2007 12:19:40 +0200

262 lines

Re: Friday NTC: cool engineer or coolant engineer?

Gary Crowell <[log in to unmask]>

Fri, 24 Aug 2007 09:07:40 -0600

38 lines

Re: Friday NTC: cool engineer or coolant engineer?

Werner Engelmaier <[log in to unmask]>

Fri, 24 Aug 2007 11:21:40 EDT

32 lines

New Thread

Friday: are you bored? I've something for you

Friday: are you bored? I've something for you

Hfjord <[log in to unmask]>

Fri, 17 Aug 2007 16:42:30 +0200

27 lines

New Thread

Fw: question regarding IPC standard

Fw: question regarding IPC standard

Bob Arciolla <[log in to unmask]>

Thu, 23 Aug 2007 09:07:43 -0500

28 lines

Re: Fw: question regarding IPC standard

Bev Christian <[log in to unmask]>

Thu, 23 Aug 2007 09:23:30 -0400

78 lines

Re: Fw: question regarding IPC standard

Roger Stoops <[log in to unmask]>

Thu, 23 Aug 2007 09:42:17 -0400

75 lines

Re: Fw: question regarding IPC standard

Graham Naisbitt <[log in to unmask]>

Thu, 23 Aug 2007 18:09:05 +0100

145 lines

Re: Fw: question regarding IPC standard

Roberts, Jon <[log in to unmask]>

Thu, 23 Aug 2007 15:18:49 -0500

183 lines

Re: Fw: question regarding IPC standard

Bev Christian <[log in to unmask]>

Thu, 23 Aug 2007 16:21:45 -0400

220 lines

Re: Fw: question regarding IPC standard

Gerald Bogert <[log in to unmask]>

Sun, 26 Aug 2007 15:51:16 -0400

74 lines

Re: Fw: question regarding IPC standard

Hogg, Blair K. <[log in to unmask]>

Mon, 27 Aug 2007 10:25:13 -0400

259 lines

Re: Fw: question regarding IPC standard

Cagle, James <[log in to unmask]>

Mon, 27 Aug 2007 15:11:08 -0700

298 lines

Re: Fw: question regarding IPC standard

Stadem, Richard D. <[log in to unmask]>

Tue, 28 Aug 2007 06:43:41 -0500

287 lines

Re: Fw: question regarding IPC standard

Kevin Glidden <[log in to unmask]>

Tue, 28 Aug 2007 08:04:33 -0400

281 lines

New Thread

Henry Rekers is out of the office.

Henry Rekers is out of the office.

[log in to unmask]

Fri, 31 Aug 2007 04:00:28 -0700

23 lines

New Thread

Hole drill-Finish size versus min-max lead diameter,

Hole drill-Finish size versus min-max lead diameter,

Victor G. Hernandez <[log in to unmask]>

Mon, 6 Aug 2007 13:48:12 -0500

42 lines

Re: Hole drill-Finish size versus min-max lead diameter,

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Mon, 6 Aug 2007 13:28:03 -0700

80 lines

New Thread

IPC announces Product Compliance with Environmental Regulations webcast series, in December 2007

IPC announces Product Compliance with Environmental Regulations webcast series, in December 2007

Tina Nerad <[log in to unmask]>

Tue, 28 Aug 2007 15:00:12 -0500

99 lines

New Thread

IPC Design for Assembly, November 12-13, 2007, Houston, TX

IPC Design for Assembly, November 12-13, 2007, Houston, TX

Tina Nerad <[log in to unmask]>

Fri, 31 Aug 2007 10:00:53 -0500

51 lines

New Thread

IPC Design for Manufacture workshop, August 27-28, 2007, Fredericksburg, VA

IPC Design for Manufacture workshop, August 27-28, 2007, Fredericksburg, VA

Tina Nerad <[log in to unmask]>

Thu, 23 Aug 2007 13:48:51 -0500

52 lines

New Thread

IPC Materials Declaration Workshop Series 8/07-Philadelphia, PA & 11/07-San Jose, CA

IPC Materials Declaration Workshop Series 8/07-Philadelphia, PA & 11/07-San Jose, CA

Tina Nerad <[log in to unmask]>

Thu, 2 Aug 2007 10:27:02 -0500

61 lines

New Thread

IPC Materials Declaration Workshops offered in Boston, MA & San Jose, CA

IPC Materials Declaration Workshops offered in Boston, MA & San Jose, CA

Tina Nerad <[log in to unmask]>

Fri, 24 Aug 2007 08:34:14 -0500

92 lines

New Thread

IPC PCB Fabrication "Back to the Basics" Webcast Series - Electroplating Technologies, August 23, 2007

IPC PCB Fabrication "Back to the Basics" Webcast Series - Electroplating Technologies, August 23, 2007

Tina Nerad <[log in to unmask]>

Fri, 17 Aug 2007 14:26:47 -0500

38 lines

New Thread

IPC PCB Fabrication "Back to the Basics" webcast series continues in August (8/16, 8/23)

IPC PCB Fabrication "Back to the Basics" webcast series continues in August (8/16, 8/23)

Tina Nerad <[log in to unmask]>

Tue, 14 Aug 2007 10:45:40 -0500

44 lines

New Thread

IPC PCB Fabrication "Back to the Basics" Webcast Series continues, in August!!!

IPC PCB Fabrication "Back to the Basics" Webcast Series continues, in August!!!

Tina Nerad <[log in to unmask]>

Thu, 9 Aug 2007 13:51:20 -0500

43 lines

New Thread

IPC PCB Fabrication "Back to the Basics" Webcast Series in August 2007

IPC PCB Fabrication "Back to the Basics" Webcast Series in August 2007

Tina Nerad <[log in to unmask]>

Thu, 2 Aug 2007 16:07:43 -0500

40 lines

New Thread

IPC webcast: China RoHS: An Updated Roadmap to Achieving Compliance and Assessing Risks , 10/10/07

IPC webcast: China RoHS: An Updated Roadmap to Achieving Compliance and Assessing Risks , 10/10/07

Tina Nerad <[log in to unmask]>

Mon, 20 Aug 2007 15:18:01 -0500

54 lines

New Thread

IPC-6012 questions..

IPC-6012 questions..

Kevin Glidden <[log in to unmask]>

Mon, 20 Aug 2007 13:53:17 -0400

58 lines

Re: IPC-6012 questions..

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Mon, 20 Aug 2007 11:02:40 -0700

100 lines

New Thread

IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall

IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall

Victor G. Hernandez <[log in to unmask]>

Thu, 9 Aug 2007 08:36:41 -0500

27 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall

Werner Engelmaier <[log in to unmask]>

Thu, 9 Aug 2007 09:43:06 EDT

32 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall

Werner Engelmaier <[log in to unmask]>

Thu, 9 Aug 2007 09:46:49 EDT

57 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall

weiner, mickey <[log in to unmask]>

Thu, 9 Aug 2007 17:05:53 +0300

64 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall

Victor G. Hernandez <[log in to unmask]>

Thu, 9 Aug 2007 09:21:17 -0500

61 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall

Werner Engelmaier <[log in to unmask]>

Thu, 9 Aug 2007 10:35:25 EDT

31 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall

Victor G. Hernandez <[log in to unmask]>

Thu, 9 Aug 2007 09:59:18 -0500

62 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall

Werner Engelmaier <[log in to unmask]>

Thu, 9 Aug 2007 11:07:54 EDT

38 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall

Stadem, Richard D. <[log in to unmask]>

Thu, 9 Aug 2007 10:01:03 -0500

108 lines

New Thread

IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall Separation

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall Separation

Victor G. Hernandez <[log in to unmask]>

Thu, 9 Aug 2007 10:13:56 -0500

78 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall Separation

Werner Engelmaier <[log in to unmask]>

Thu, 9 Aug 2007 11:51:05 EDT

34 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall Separation

Victor G. Hernandez <[log in to unmask]>

Thu, 9 Aug 2007 12:55:07 -0500

67 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall Separation

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Thu, 9 Aug 2007 11:04:48 -0700

96 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall Separation

Victor G. Hernandez <[log in to unmask]>

Thu, 9 Aug 2007 13:09:33 -0500

126 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall Separation

Werner Engelmaier <[log in to unmask]>

Thu, 9 Aug 2007 14:36:19 EDT

32 lines

Re: IPC-A-600F, Sec 4.2.6, Core Bond to Plated-Through-Hole Wall Separation

Stadem, Richard D. <[log in to unmask]>

Thu, 9 Aug 2007 14:36:58 -0500

58 lines

New Thread

IPC/JEDEC International Conference on Lead Free Electronics, 4 & 5 October 2007, Berlin, Germany

IPC/JEDEC International Conference on Lead Free Electronics, 4 & 5 October 2007, Berlin, Germany

Tina Nerad <[log in to unmask]>

Mon, 13 Aug 2007 13:45:51 -0500

37 lines

New Thread

IPC_SM-840C

IPC_SM-840C

Victor G. Hernandez <[log in to unmask]>

Wed, 1 Aug 2007 10:58:50 -0500

33 lines

Re: IPC_SM-840C

Black, Paul <[log in to unmask]>

Wed, 1 Aug 2007 13:21:10 -0400

76 lines

Re: IPC_SM-840C

Mumtaz Bora <[log in to unmask]>

Thu, 2 Aug 2007 14:56:47 -0700

68 lines

New Thread

IR Thermometer

IR Thermometer

DTremmel <[log in to unmask]>

Wed, 29 Aug 2007 15:23:18 -0500

57 lines

Re: IR Thermometer

Wasan Singhatong <[log in to unmask]>

Thu, 30 Aug 2007 06:38:44 +0700

106 lines

Re: IR Thermometer

Hogg, Blair K. <[log in to unmask]>

Wed, 29 Aug 2007 22:13:19 -0400

98 lines

Re: IR Thermometer

Wasan Singhatong <[log in to unmask]>

Thu, 30 Aug 2007 10:55:26 +0700

143 lines

Re: IR Thermometer

Reuven Rokah <[log in to unmask]>

Thu, 30 Aug 2007 08:49:33 +0300

93 lines

Re: IR Thermometer

Dave Simonik <[log in to unmask]>

Thu, 30 Aug 2007 07:47:28 -0400

98 lines

IR Thermometer

DTremmel <[log in to unmask]>

Fri, 31 Aug 2007 09:28:19 -0500

54 lines

New Thread

Is Brian allowed to boast?

Re: Is Brian allowed to boast?

Hernefjord Ingemar <[log in to unmask]>

Wed, 8 Aug 2007 08:54:27 +0200

43 lines

Re: Is Brian allowed to boast?

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Wed, 8 Aug 2007 07:21:08 -0700

69 lines

Re: Is Brian allowed to boast?

Hernefjord Ingemar <[log in to unmask]>

Thu, 9 Aug 2007 08:49:56 +0200

103 lines

Re: Is Brian allowed to boast?

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Thu, 9 Aug 2007 07:13:40 -0700

115 lines

New Thread

Joel Alexander is out of the office.

Joel Alexander is out of the office.

Joel Alexander <[log in to unmask]>

Thu, 2 Aug 2007 15:37:11 -0400

24 lines

New Thread

Join IPC in Sarborough, Ontario, Canada, in August, and get up-to-date on Design

Join IPC in Sarborough, Ontario, Canada, in August, and get up-to-date on Design

Tina Nerad <[log in to unmask]>

Fri, 3 Aug 2007 09:56:57 -0500

74 lines

New Thread

Kevin--how to submit your comments

Kevin--how to submit your comments

Jack Crawford <[log in to unmask]>

Wed, 22 Aug 2007 01:16:23 -0500

103 lines

New Thread

Lead Contaminated Toys From China...

Lead Contaminated Toys From China...

Steve Gregory <[log in to unmask]>

Thu, 2 Aug 2007 07:39:12 -0500

52 lines

New Thread

Lead-Free Problems?

Lead-Free Problems?

Bloomquist, Ken <[log in to unmask]>

Mon, 13 Aug 2007 10:50:25 -0700

42 lines

Re: Lead-Free Problems?

Dale Ritzen <[log in to unmask]>

Mon, 13 Aug 2007 12:57:19 -0500

69 lines

Re: Lead-Free Problems?

Bill Kasprzak <[log in to unmask]>

Mon, 13 Aug 2007 14:06:20 -0400

117 lines

Re: Lead-Free Problems?

John Burke <[log in to unmask]>

Mon, 13 Aug 2007 11:11:22 -0700

116 lines

Re: Lead-Free Problems?

John Burke <[log in to unmask]>

Mon, 13 Aug 2007 11:12:38 -0700

148 lines

Re: Lead-Free Problems?

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Mon, 13 Aug 2007 11:27:13 -0700

188 lines

Re: Lead-Free Problems?

Stadem, Richard D. <[log in to unmask]>

Mon, 13 Aug 2007 13:17:17 -0500

96 lines

Re: Lead-Free Problems?

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Mon, 13 Aug 2007 12:46:52 -0700

123 lines

Re: Lead-Free Problems?

Stadem, Richard D. <[log in to unmask]>

Mon, 13 Aug 2007 14:45:17 -0500

177 lines

Re: Lead-Free Problems?

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Mon, 13 Aug 2007 13:00:00 -0700

204 lines

Re: Lead-Free Problems?

Stadem, Richard D. <[log in to unmask]>

Mon, 13 Aug 2007 15:03:27 -0500

146 lines

Re: Lead-Free Problems?

Werner Engelmaier <[log in to unmask]>

Mon, 13 Aug 2007 16:46:17 EDT

34 lines

Re: Lead-Free Problems?

Werner Engelmaier <[log in to unmask]>

Mon, 13 Aug 2007 16:51:18 EDT

33 lines

Re: Lead-Free Problems?

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Mon, 13 Aug 2007 13:55:25 -0700

62 lines

Re: Lead-Free Problems?

Werner Engelmaier <[log in to unmask]>

Mon, 13 Aug 2007 16:59:20 EDT

32 lines

New Thread

Lead-Free Problems? and Tin Lead too!

Re: Lead-Free Problems? and Tin Lead too!

Graham Naisbitt <[log in to unmask]>

Wed, 15 Aug 2007 11:24:24 +0100

148 lines

Re: Lead-Free Problems? and Tin Lead too!

David D. Hillman <[log in to unmask]>

Wed, 15 Aug 2007 11:22:07 -0500

188 lines

New Thread

Mehmet Emin Yaman işyeri dışında.

Mehmet Emin Yaman işyeri dışında.

Mehmet Emin Yaman <[log in to unmask]>

Mon, 13 Aug 2007 10:01:30 +0300

43 lines

New Thread

Microscope camera, solution

Microscope camera, solution

Hernefjord Ingemar <[log in to unmask]>

Wed, 22 Aug 2007 10:04:26 +0200

41 lines

Re: Microscope camera, solution

Steve Gregory <[log in to unmask]>

Wed, 22 Aug 2007 07:30:40 -0500

83 lines

Re: Microscope camera, solution

Rex Waygood <[log in to unmask]>

Thu, 23 Aug 2007 09:44:28 +0100

116 lines

New Thread

Microwave Laminate Material

Microwave Laminate Material

Marsico, James <[log in to unmask]>

Tue, 7 Aug 2007 14:36:01 -0400

44 lines

New Thread

Minimum toe fillet for SOT23-3 land pattern

Minimum toe fillet for SOT23-3 land pattern

James Verrette <[log in to unmask]>

Thu, 9 Aug 2007 12:53:52 -0400

37 lines

Re: Minimum toe fillet for SOT23-3 land pattern

Jones, Evamaria <[log in to unmask]>

Thu, 9 Aug 2007 13:01:08 -0400

39 lines

Re: Minimum toe fillet for SOT23-3 land pattern

Barry Gallegos <[log in to unmask]>

Thu, 9 Aug 2007 11:32:52 -0600

66 lines

Re: Minimum toe fillet for SOT23-3 land pattern

Stadem, Richard D. <[log in to unmask]>

Thu, 9 Aug 2007 13:30:37 -0500

68 lines

Re: Minimum toe fillet for SOT23-3 land pattern

P. Langeveld <[log in to unmask]>

Fri, 10 Aug 2007 13:10:21 +0200

95 lines

Re: Minimum toe fillet for SOT23-3 land pattern

Stadem, Richard D. <[log in to unmask]>

Mon, 13 Aug 2007 08:19:00 -0500

113 lines

New Thread

National Physical Laboratory NPL Industry Defect Database

National Physical Laboratory NPL Industry Defect Database

Bob Willis <[log in to unmask]>

Thu, 23 Aug 2007 17:27:35 +0100

109 lines

New Thread

Need help locating a shop that does assembly of flex circuits

Need help locating a shop that does assembly of flex circuits

Brooks,Bill <[log in to unmask]>

Mon, 6 Aug 2007 15:10:38 -0700

28 lines

New Thread

New IPC webcast series in November: Via Hole Filling Technology & Processes

New IPC webcast series in November: Via Hole Filling Technology & Processes

Tina Nerad <[log in to unmask]>

Mon, 27 Aug 2007 09:40:04 -0500

108 lines

New Thread

New IPC Webcast Series! Via Hole Filling Technology and Processes November 1 & 8, 2007

New IPC Webcast Series! Via Hole Filling Technology and Processes November 1 & 8, 2007

Michelle Michelotti <[log in to unmask]>

Thu, 16 Aug 2007 14:20:39 -0500

84 lines

New Thread

Non-aqueous cleaning

Non-aqueous cleaning

Bev Christian <[log in to unmask]>

Tue, 7 Aug 2007 12:18:01 -0400

49 lines

Re: Non-aqueous cleaning

Douglas O. Pauls <[log in to unmask]>

Tue, 7 Aug 2007 17:02:16 -0500

95 lines

Re: Non-aqueous cleaning

Brian Ellis <[log in to unmask]>

Wed, 8 Aug 2007 09:08:13 +0300

73 lines

Re: Non-aqueous cleaning

Bev Christian <[log in to unmask]>

Wed, 8 Aug 2007 07:40:44 -0400

113 lines

Re: Non-aqueous cleaning

Gervascio, Thomas <[log in to unmask]>

Thu, 9 Aug 2007 07:59:51 -0400

82 lines

New Thread

NTC - hope you are all safe

NTC - hope you are all safe

Graham Naisbitt <[log in to unmask]>

Thu, 2 Aug 2007 17:44:44 +0100

70 lines

Re: NTC - hope you are all safe

[log in to unmask]

Thu, 2 Aug 2007 16:50:44 +0000

62 lines

Re: NTC - hope you are all safe

John Burke <[log in to unmask]>

Thu, 2 Aug 2007 10:08:03 -0700

126 lines

Re: NTC - hope you are all safe

Stadem, Richard D. <[log in to unmask]>

Thu, 2 Aug 2007 14:42:35 -0500

103 lines

New Thread

NTC - Re: [TN] Hot air and Tin Lead too!

NTC - Re: [TN] Hot air and Tin Lead too!

Dennis Fritz <[log in to unmask]>

Wed, 15 Aug 2007 09:52:10 EDT

42 lines

Re: NTC - Re: [TN] Hot air and Tin Lead too!

Eric CHRISTISON <[log in to unmask]>

Wed, 15 Aug 2007 14:59:58 +0100

59 lines

New Thread

NTC Seeking design information on PWB conductor spacing for high voltage (500-1000 VDC) applications

Re: NTC Seeking design information on PWB conductor spacing for high voltage (500-1000 VDC) applications

Phil Nutting <[log in to unmask]>

Fri, 17 Aug 2007 09:48:52 -0400

195 lines

Re: NTC Seeking design information on PWB conductor spacing for high voltage (500-1000 VDC) applications

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Fri, 17 Aug 2007 08:09:24 -0700

227 lines

Re: NTC Seeking design information on PWB conductor spacing for high voltage (500-1000 VDC) applications

Gerald Bogert <[log in to unmask]>

Fri, 17 Aug 2007 17:31:10 -0400

219 lines

New Thread

NTC, off-topic, off-colour, Friday joke

NTC, off-topic, off-colour, Friday joke

Brian Ellis <[log in to unmask]>

Fri, 17 Aug 2007 14:29:59 +0300

42 lines

Re: NTC, off-topic, off-colour, Friday joke

Steve Gregory <[log in to unmask]>

Fri, 17 Aug 2007 06:54:56 -0500

79 lines

Re: NTC, off-topic, off-colour, Friday joke

Brian Ellis <[log in to unmask]>

Fri, 17 Aug 2007 15:05:17 +0300

94 lines

Re: NTC, off-topic, off-colour, Friday joke

Hernefjord Ingemar <[log in to unmask]>

Fri, 17 Aug 2007 14:16:26 +0200

114 lines

Re: NTC, off-topic, off-colour, Friday joke

Mike Fenner <[log in to unmask]>

Fri, 17 Aug 2007 13:24:23 +0100

131 lines

Re: NTC, off-topic, off-colour, Friday joke

Hernefjord Ingemar <[log in to unmask]>

Fri, 17 Aug 2007 14:52:48 +0200

181 lines

New Thread

NTC-Friday

NTC-Friday

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Fri, 10 Aug 2007 07:59:36 -0700

99 lines

New Thread

Odd migration

Odd migration

Hernefjord Ingemar <[log in to unmask]>

Thu, 23 Aug 2007 12:44:34 +0200

30 lines

Re: Odd migration

Steve Gregory <[log in to unmask]>

Thu, 23 Aug 2007 11:17:15 -0500

62 lines

Re: Odd migration

Vladimir Igoshev <[log in to unmask]>

Thu, 23 Aug 2007 12:23:23 -0400

93 lines

New Thread

optics

optics

Jason <[log in to unmask]>

Tue, 14 Aug 2007 16:57:17 -0500

25 lines

Re: optics

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Wed, 15 Aug 2007 06:41:39 -0700

53 lines

New Thread

OSP Processing Recommendations

OSP Processing Recommendations

Leland Woodall <[log in to unmask]>

Fri, 10 Aug 2007 17:37:05 -0400

33 lines

Re: OSP Processing Recommendations

John Burke <[log in to unmask]>

Fri, 10 Aug 2007 14:52:04 -0700

65 lines

Re: OSP Processing Recommendations

Todd, Richard <[log in to unmask]>

Fri, 10 Aug 2007 17:56:03 -0400

163 lines

Re: OSP Processing Recommendations

John Burke <[log in to unmask]>

Fri, 10 Aug 2007 15:05:10 -0700

196 lines

Re: OSP Processing Recommendations

Leland Woodall <[log in to unmask]>

Fri, 10 Aug 2007 18:16:12 -0400

201 lines

Re: OSP Processing Recommendations

John Burke <[log in to unmask]>

Fri, 10 Aug 2007 16:00:30 -0700

232 lines

Re: OSP Processing Recommendations

Aquino Quek <[log in to unmask]>

Mon, 13 Aug 2007 14:36:40 +0800

62 lines

Re: OSP Processing Recommendations

Leland Woodall <[log in to unmask]>

Mon, 13 Aug 2007 07:49:59 -0400

255 lines

Re: OSP Processing Recommendations

Graham Collins <[log in to unmask]>

Mon, 13 Aug 2007 08:02:00 -0400

313 lines

Re: OSP Processing Recommendations

Douglas O. Pauls <[log in to unmask]>

Mon, 13 Aug 2007 07:11:03 -0500

29 lines

Re: OSP Processing Recommendations

Stadem, Richard D. <[log in to unmask]>

Mon, 13 Aug 2007 07:52:58 -0500

53 lines

Re: OSP Processing Recommendations

Stadem, Richard D. <[log in to unmask]>

Mon, 13 Aug 2007 07:54:34 -0500

276 lines

New Thread

Pad shape for BGA

Pad shape for BGA

John Burke <[log in to unmask]>

Thu, 9 Aug 2007 18:34:15 -0700

39 lines

Re: Pad shape for BGA

Werner Engelmaier <[log in to unmask]>

Thu, 9 Aug 2007 21:48:53 EDT

33 lines

Re: Pad shape for BGA

John Burke <[log in to unmask]>

Thu, 9 Aug 2007 23:48:08 -0700

66 lines

New Thread

Pads removed during BGA Repair

Pads removed during BGA Repair

Ray, Carl (GE Indust, GE Fanuc) <[log in to unmask]>

Tue, 7 Aug 2007 16:00:34 -0400

31 lines

Re: Pads removed during BGA Repair

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Tue, 7 Aug 2007 13:10:10 -0700

62 lines

Re: Pads removed during BGA Repair

Ray, Carl (GE Indust, GE Fanuc) <[log in to unmask]>

Tue, 7 Aug 2007 16:13:50 -0400

90 lines

Re: Pads removed during BGA Repair

Stadem, Richard D. <[log in to unmask]>

Tue, 7 Aug 2007 16:11:18 -0500

157 lines

Re: Pads removed during BGA Repair

Tan, Geok Ang <[log in to unmask]>

Wed, 8 Aug 2007 08:57:20 +0800

187 lines

New Thread

Paint spray booths

Paint spray booths

Marsico, James <[log in to unmask]>

Tue, 7 Aug 2007 07:12:58 -0400

50 lines

New Thread

PCB assembly protection for outdoor working under harsh environmental conditions

PCB assembly protection for outdoor working under harsh environmental conditions

Reyes, Angel LAM2 4429 <[log in to unmask]>

Fri, 17 Aug 2007 11:31:43 -0700

223 lines

Re: PCB assembly protection for outdoor working under harsh environmental conditions

Hogg, Blair K. <[log in to unmask]>

Fri, 17 Aug 2007 16:00:48 -0400

72 lines

Re: PCB assembly protection for outdoor working under harsh environmental conditions

Reyes, Angel LAM2 4429 <[log in to unmask]>

Fri, 17 Aug 2007 16:14:32 -0700

104 lines

Re: PCB assembly protection for outdoor working under harsh environmental conditions

Hernefjord Ingemar <[log in to unmask]>

Mon, 20 Aug 2007 08:49:41 +0200

150 lines

Re: PCB assembly protection for outdoor working under harsh environmental conditions

David Douthit <[log in to unmask]>

Mon, 20 Aug 2007 12:48:43 -0700

187 lines

Re: PCB assembly protection for outdoor working under harsh environmental conditions

Hernefjord Ingemar <[log in to unmask]>

Tue, 21 Aug 2007 08:05:35 +0200

201 lines

New Thread

PCB marking for shop control.

PCB marking for shop control.

Miguel Vallejo <[log in to unmask]>

Fri, 31 Aug 2007 08:50:30 -0700

47 lines

New Thread

PCB matl properties - water effect

PCB matl properties - water effect

Leo Higgins <[log in to unmask]>

Tue, 28 Aug 2007 14:11:24 -0700

49 lines

Re: PCB matl properties - water effect

Bev Christian <[log in to unmask]>

Tue, 28 Aug 2007 17:17:06 -0400

93 lines

Re: PCB matl properties - water effect

Leo Higgins <[log in to unmask]>

Tue, 28 Aug 2007 14:23:17 -0700

149 lines

Re: PCB matl properties - water effect

Werner Engelmaier <[log in to unmask]>

Tue, 28 Aug 2007 18:30:54 EDT

33 lines

Re: PCB matl properties - water effect

Hernefjord Ingemar <[log in to unmask]>

Wed, 29 Aug 2007 08:22:14 +0200

79 lines

Re: PCB matl properties - water effect

Bev Christian <[log in to unmask]>

Wed, 29 Aug 2007 07:58:05 -0400

117 lines

Re: PCB matl properties - water effect

Hernefjord Ingemar <[log in to unmask]>

Wed, 29 Aug 2007 15:19:41 +0200

142 lines

Re: PCB matl properties - water effect

Dennis Fritz <[log in to unmask]>

Wed, 29 Aug 2007 10:00:40 EDT

45 lines

New Thread

PCB matl properties - water effect NTC

Re: PCB matl properties - water effect NTC

Bev Christian <[log in to unmask]>

Wed, 29 Aug 2007 11:07:27 -0400

91 lines

Re: PCB matl properties - water effect NTC

Guy Ramsey <[log in to unmask]>

Wed, 29 Aug 2007 12:45:29 -0400

66 lines

Re: PCB matl properties - water effect NTC

Bev Christian <[log in to unmask]>

Wed, 29 Aug 2007 13:07:01 -0400

91 lines

Re: PCB matl properties - water effect NTC

Douglas O. Pauls <[log in to unmask]>

Wed, 29 Aug 2007 13:08:18 -0500

110 lines

Re: PCB matl properties - water effect NTC

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Wed, 29 Aug 2007 11:14:58 -0700

147 lines

Re: PCB matl properties - water effect NTC

Jim Carlson <[log in to unmask]>

Wed, 29 Aug 2007 14:23:36 -0400

171 lines

Re: PCB matl properties - water effect NTC

John Burke <[log in to unmask]>

Wed, 29 Aug 2007 11:42:47 -0700

198 lines

Re: PCB matl properties - water effect NTC

Werner Engelmaier <[log in to unmask]>

Wed, 29 Aug 2007 14:59:03 EDT

27 lines

Re: PCB matl properties - water effect NTC

Leo Higgins <[log in to unmask]>

Wed, 29 Aug 2007 12:33:58 -0700

75 lines

New Thread

PCB Pad Cratering

PCB Pad Cratering

Anthony Tavano <[log in to unmask]>

Tue, 14 Aug 2007 07:37:29 -0500

35 lines

Re: PCB Pad Cratering

Cheryl Tulkoff <[log in to unmask]>

Tue, 14 Aug 2007 08:32:27 -0500

100 lines

New Thread

PCBA shipping packaging specification/ guidelines

PCBA shipping packaging specification/ guidelines

Tan, Geok Ang <[log in to unmask]>

Wed, 8 Aug 2007 17:33:01 +0800

27 lines

New Thread

PCBA storage conditions

PCBA storage conditions

Tan, Geok Ang <[log in to unmask]>

Wed, 8 Aug 2007 18:42:06 +0800

29 lines

New Thread

Plasma "oxidation"

Plasma "oxidation"

Hernefjord Ingemar <[log in to unmask]>

Fri, 31 Aug 2007 10:52:46 +0200

46 lines

Re: Plasma "oxidation"

Bev Christian <[log in to unmask]>

Fri, 31 Aug 2007 07:34:28 -0400

94 lines

Re: Plasma "oxidation"

David D. Hillman <[log in to unmask]>

Fri, 31 Aug 2007 07:08:19 -0500

95 lines

Re: Plasma "oxidation"

Hernefjord Ingemar <[log in to unmask]>

Fri, 31 Aug 2007 14:55:18 +0200

129 lines

Re: Plasma "oxidation"

Hernefjord Ingemar <[log in to unmask]>

Fri, 31 Aug 2007 15:44:37 +0200

136 lines

Re: Plasma "oxidation"

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Fri, 31 Aug 2007 07:00:25 -0700

156 lines

Re: Plasma "oxidation"

Gervascio, Thomas <[log in to unmask]>

Fri, 31 Aug 2007 10:11:57 -0400

121 lines

Re: Plasma "oxidation"

Eric CHRISTISON <[log in to unmask]>

Fri, 31 Aug 2007 15:55:22 +0100

188 lines

Re: Plasma "oxidation"

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Fri, 31 Aug 2007 08:16:09 -0700

233 lines

Re: Plasma "oxidation"

David D. Hillman <[log in to unmask]>

Fri, 31 Aug 2007 11:55:16 -0500

242 lines

Re: Plasma "oxidation"

John Maxwell <[log in to unmask]>

Fri, 31 Aug 2007 10:06:55 -0700

251 lines

New Thread

PLCC Socket Pin damage

PLCC Socket Pin damage

Joel Alexander <[log in to unmask]>

Thu, 30 Aug 2007 08:46:26 -0400

35 lines

Re: PLCC Socket Pin damage

Steve Gregory <[log in to unmask]>

Thu, 30 Aug 2007 08:07:18 -0500

81 lines

Re: PLCC Socket Pin damage

Joel Alexander <[log in to unmask]>

Thu, 30 Aug 2007 09:42:47 -0400

111 lines

New Thread

Press Fit Connector rework

Press Fit Connector rework

Kane, Amol (349) <[log in to unmask]>

Thu, 16 Aug 2007 11:45:30 -0400

46 lines

Re: Press Fit Connector rework

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Thu, 16 Aug 2007 08:52:20 -0700

76 lines

Re: Press Fit Connector rework

Kerry McMullen <[log in to unmask]>

Thu, 16 Aug 2007 12:15:28 -0400

102 lines

Re: Press Fit Connector rework

Randy Morrison <[log in to unmask]>

Thu, 16 Aug 2007 09:29:52 -0700

104 lines

Re: Press Fit Connector rework

Randy Morrison <[log in to unmask]>

Thu, 16 Aug 2007 09:36:32 -0700

75 lines

Re: Press Fit Connector rework

Wayne Thayer <[log in to unmask]>

Thu, 16 Aug 2007 13:34:11 -0400

148 lines

Re: Press Fit Connector rework

Rey Sosa <[log in to unmask]>

Thu, 16 Aug 2007 11:14:33 -0700

185 lines

Re: Press Fit Connector rework

Rey Sosa <[log in to unmask]>

Thu, 16 Aug 2007 11:20:14 -0700

212 lines

New Thread

Problems with Memeory modules and sockets

Problems with Memeory modules and sockets

Ralph Rottnick <[log in to unmask]>

Wed, 1 Aug 2007 04:13:30 -0500

44 lines

Re: Problems with Memeory modules and sockets

McGlaughlin, Jeffrey A <[log in to unmask]>

Wed, 1 Aug 2007 06:44:54 -0400

82 lines

Re: Problems with Memeory modules and sockets

Werner Engelmaier <[log in to unmask]>

Wed, 1 Aug 2007 10:22:47 EDT

34 lines

New Thread

Problems with Memory modules and sockets

Re: Problems with Memory modules and sockets

Victor G. Hernandez <[log in to unmask]>

Wed, 1 Aug 2007 06:36:19 -0500

70 lines

Re: Problems with Memory modules and sockets

Herminia Guevarra <[log in to unmask]>

Wed, 1 Aug 2007 07:56:37 -0400

123 lines

New Thread

PTH integrity

PTH integrity

Kevin Glidden <[log in to unmask]>

Mon, 20 Aug 2007 13:59:17 -0400

46 lines

Re: PTH integrity

Werner Engelmaier <[log in to unmask]>

Mon, 20 Aug 2007 16:02:02 EDT

28 lines

Re: PTH integrity

Werner Engelmaier <[log in to unmask]>

Mon, 20 Aug 2007 16:05:38 EDT

39 lines

New Thread

Request for LF shrinkhole or hot tear failure data

Request for LF shrinkhole or hot tear failure data

Jack Crawford <[log in to unmask]>

Tue, 14 Aug 2007 14:07:10 -0500

124 lines

Re: Request for LF shrinkhole or hot tear failure data

David D. Hillman <[log in to unmask]>

Tue, 14 Aug 2007 15:37:36 -0500

181 lines

New Thread

Resistor codes

Resistor codes

pearl petras <[log in to unmask]>

Thu, 23 Aug 2007 13:41:47 -0700

29 lines

resistor codes

pearl petras <[log in to unmask]>

Thu, 23 Aug 2007 13:45:54 -0700

29 lines

Re: resistor codes

Steve Gregory <[log in to unmask]>

Thu, 23 Aug 2007 16:16:35 -0500

68 lines

Re: resistor codes

Haynes, Kim <[log in to unmask]>

Thu, 23 Aug 2007 17:08:49 -0500

98 lines

Re: Resistor codes

David Greig <[log in to unmask]>

Thu, 23 Aug 2007 23:51:44 +0100

71 lines

Re: resistor codes

Steve Gregory <[log in to unmask]>

Fri, 24 Aug 2007 07:28:25 -0500

124 lines

Re: resistor codes

Haynes, Kim <[log in to unmask]>

Tue, 28 Aug 2007 08:11:50 -0500

148 lines

New Thread

reverse engineering, legit style

reverse engineering, legit style

Jeff Seeger <[log in to unmask]>

Wed, 8 Aug 2007 12:02:07 -0400

51 lines

Re: reverse engineering, legit style

John Burke <[log in to unmask]>

Wed, 8 Aug 2007 10:33:02 -0700

97 lines

Re: reverse engineering, legit style

Brooks,Bill <[log in to unmask]>

Wed, 8 Aug 2007 11:18:41 -0700

143 lines

Re: reverse engineering, legit style

Wolfe, Robert <[log in to unmask]>

Wed, 8 Aug 2007 14:40:13 -0400

112 lines

Re: reverse engineering, legit style

Dave Seymour <[log in to unmask]>

Wed, 8 Aug 2007 14:48:39 -0400

136 lines

Re: reverse engineering, legit style

[log in to unmask]

Wed, 8 Aug 2007 18:38:10 EDT

32 lines

Re: reverse engineering, legit style

Wayne Thayer <[log in to unmask]>

Thu, 9 Aug 2007 00:09:48 -0400

194 lines

Re: reverse engineering, legit style

Gary Ferrari <[log in to unmask]>

Thu, 9 Aug 2007 09:50:42 -0400

186 lines

Re: reverse engineering, legit style

[log in to unmask]

Thu, 9 Aug 2007 09:56:36 EDT

30 lines

New Thread

Rework question

Rework question

John Burke <[log in to unmask]>

Tue, 7 Aug 2007 07:28:55 -0700

55 lines

Re: Rework question

Tempea, Ioan <[log in to unmask]>

Tue, 7 Aug 2007 10:46:58 -0400

90 lines

Re: Rework question

Stadem, Richard D. <[log in to unmask]>

Tue, 7 Aug 2007 10:30:42 -0500

82 lines

Re: Rework question

Bev Christian <[log in to unmask]>

Tue, 7 Aug 2007 11:52:55 -0400

119 lines

Re: Rework question

John Burke <[log in to unmask]>

Tue, 7 Aug 2007 09:04:08 -0700

141 lines

Re: Rework question

Victor G. Hernandez <[log in to unmask]>

Tue, 7 Aug 2007 11:07:47 -0500

147 lines

Re: Rework question

Guy Ramsey <[log in to unmask]>

Tue, 7 Aug 2007 12:13:44 -0400

162 lines

Re: Rework question

John Burke <[log in to unmask]>

Tue, 7 Aug 2007 09:54:41 -0700

177 lines

Re: Rework question

Bev Christian <[log in to unmask]>

Tue, 7 Aug 2007 13:08:51 -0400

233 lines

Re: Rework question

Stadem, Richard D. <[log in to unmask]>

Tue, 7 Aug 2007 12:59:19 -0500

263 lines

Re: Rework question

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Tue, 7 Aug 2007 11:22:09 -0700

302 lines

Re: Rework question

Sauer, Steve (Xetron) <[log in to unmask]>

Tue, 7 Aug 2007 14:42:00 -0400

340 lines

Re: Rework question

Douglas O. Pauls <[log in to unmask]>

Tue, 7 Aug 2007 17:01:01 -0500

31 lines

Re: Rework question

Kane, Joseph E (US SSA) <[log in to unmask]>

Tue, 7 Aug 2007 18:39:56 -0400

75 lines

Re: Rework question

John Burke <[log in to unmask]>

Tue, 7 Aug 2007 16:14:14 -0700

68 lines

Re: Rework question

David D. Hillman <[log in to unmask]>

Wed, 8 Aug 2007 09:44:57 -0500

360 lines

Re: Rework question

Kane, Amol (349) <[log in to unmask]>

Wed, 8 Aug 2007 10:57:12 -0400

409 lines

Re: Rework question

Stadem, Richard D. <[log in to unmask]>

Thu, 9 Aug 2007 07:51:07 -0500

467 lines

Re: Rework question

Kane, Amol (349) <[log in to unmask]>

Thu, 9 Aug 2007 11:48:31 -0400

493 lines

New Thread

Rework question--No IPC limitations

Re: Rework question--No IPC limitations

Jack Crawford <[log in to unmask]>

Wed, 8 Aug 2007 10:29:44 -0500

165 lines

Re: Rework question--No IPC limitations

John Burke <[log in to unmask]>

Wed, 8 Aug 2007 10:56:19 -0700

194 lines

Re: Rework question--No IPC limitations

Stadem, Richard D. <[log in to unmask]>

Wed, 8 Aug 2007 12:20:13 -0500

215 lines

New Thread

RF Board Bow and Twist

RF Board Bow and Twist

Syed Ahmad <[log in to unmask]>

Wed, 15 Aug 2007 09:25:47 -0500

32 lines

New Thread

RoHS Compliance

RoHS Compliance

Jon McDowell <[log in to unmask]>

Tue, 7 Aug 2007 12:25:45 -0600

29 lines

Re: RoHS Compliance

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Tue, 7 Aug 2007 11:44:23 -0700

59 lines

Re: RoHS Compliance

Randy Bock Sr. <[log in to unmask]>

Tue, 7 Aug 2007 16:22:17 -0400

87 lines

New Thread

SAC Soldered With SnPb

SAC Soldered With SnPb

Bloomquist, Ken <[log in to unmask]>

Tue, 14 Aug 2007 13:51:05 -0700

31 lines

Re: SAC Soldered With SnPb

Gerald Bogert <[log in to unmask]>

Tue, 14 Aug 2007 18:23:16 -0400

82 lines

Re: SAC Soldered With SnPb

Hernefjord Ingemar <[log in to unmask]>

Wed, 15 Aug 2007 09:13:45 +0200

122 lines

Re: SAC Soldered With SnPb

Hernefjord Ingemar <[log in to unmask]>

Wed, 15 Aug 2007 09:43:26 +0200

132 lines

Re: SAC Soldered With SnPb

Lum Wee Mei <[log in to unmask]>

Wed, 15 Aug 2007 15:54:06 +0800

163 lines

Re: SAC Soldered With SnPb

Hernefjord Ingemar <[log in to unmask]>

Wed, 15 Aug 2007 11:14:46 +0200

192 lines

Re: SAC Soldered With SnPb

David D. Hillman <[log in to unmask]>

Wed, 15 Aug 2007 07:25:48 -0500

175 lines

Re: SAC Soldered With SnPb

Bloomquist, Ken <[log in to unmask]>

Wed, 15 Aug 2007 06:23:45 -0700

121 lines

Re: SAC Soldered With SnPb

David D. Hillman <[log in to unmask]>

Wed, 15 Aug 2007 09:08:01 -0500

167 lines

New Thread

Scanning Acoustic Microscope

Scanning Acoustic Microscope

Syed Ahmad <[log in to unmask]>

Thu, 9 Aug 2007 07:47:01 -0500

33 lines

Re: Scanning Acoustic Microscope

Stadem, Richard D. <[log in to unmask]>

Thu, 9 Aug 2007 08:21:47 -0500

64 lines

Re: Scanning Acoustic Microscope

Vladimir Igoshev <[log in to unmask]>

Thu, 9 Aug 2007 09:26:22 -0400

67 lines

Re: Scanning Acoustic Microscope

Wenger, George M. <[log in to unmask]>

Thu, 9 Aug 2007 09:34:00 -0400

78 lines

Re: Scanning Acoustic Microscope

Syed Ahmad <[log in to unmask]>

Thu, 9 Aug 2007 10:23:11 -0500

88 lines

Re: Scanning Acoustic Microscope

Syed Ahmad <[log in to unmask]>

Thu, 9 Aug 2007 10:22:14 -0500

213 lines

New Thread

Seeking design information on PWB conductor spacing for high voltage (500-1000 VDC) applications

Seeking design information on PWB conductor spacing for high voltage (500-1000 VDC) applications

Gerald Bogert <[log in to unmask]>

Thu, 16 Aug 2007 18:24:14 -0400

76 lines

Re: Seeking design information on PWB conductor spacing for high voltage (500-1000 VDC) applications

Hernefjord Ingemar <[log in to unmask]>

Fri, 17 Aug 2007 09:06:43 +0200

120 lines

Re: Seeking design information on PWB conductor spacing for high voltage (500-1000 VDC) applications

- bogert <[log in to unmask]>

Fri, 17 Aug 2007 04:53:21 -0400

141 lines

Re: Seeking design information on PWB conductor spacing for high voltage (500-1000 VDC) applications

Phil Nutting <[log in to unmask]>

Fri, 17 Aug 2007 08:30:06 -0400

160 lines

Re: Seeking design information on PWB conductor spacing for high voltage (500-1000 VDC) applications

Hernefjord Ingemar <[log in to unmask]>

Fri, 17 Aug 2007 15:46:17 +0200

169 lines

New Thread

Silver PCB finish and reliability (question)

Silver PCB finish and reliability (question)

Carl VanWormer <[log in to unmask]>

Fri, 10 Aug 2007 14:07:29 -0700

50 lines

Re: Silver PCB finish and reliability (question)

David D. Hillman <[log in to unmask]>

Fri, 10 Aug 2007 16:23:15 -0500

102 lines

Re: Silver PCB finish and reliability (question)

Wenger, George M. <[log in to unmask]>

Fri, 10 Aug 2007 17:31:26 -0400

70 lines

Re: Silver PCB finish and reliability (question)

John Burke <[log in to unmask]>

Fri, 10 Aug 2007 14:50:56 -0700

87 lines

Re: Silver PCB finish and reliability (question)

Cheryl Tulkoff <[log in to unmask]>

Fri, 10 Aug 2007 17:30:27 -0500

120 lines

Re: Silver PCB finish and reliability (question)

Wenger, George M. <[log in to unmask]>

Fri, 10 Aug 2007 20:30:54 -0400

103 lines

Re: Silver PCB finish and reliability (question)

Cheryl Tulkoff <[log in to unmask]>

Fri, 10 Aug 2007 20:49:06 -0500

252 lines

Re: Silver PCB finish and reliability (question)

Cheryl Tulkoff <[log in to unmask]>

Fri, 10 Aug 2007 20:52:27 -0500

205 lines

Re: Silver PCB finish and reliability (question)

Victor G. Hernandez <[log in to unmask]>

Mon, 13 Aug 2007 06:37:26 -0500

179 lines

Re: Silver PCB finish and reliability (question)

David D. Hillman <[log in to unmask]>

Mon, 13 Aug 2007 06:53:19 -0500

308 lines

New Thread

Solder mask as an insulator

Solder mask as an insulator

Phil Nutting <[log in to unmask]>

Wed, 15 Aug 2007 10:58:55 -0400

48 lines

Re: Solder mask as an insulator

Stadem, Richard D. <[log in to unmask]>

Wed, 15 Aug 2007 10:11:58 -0500

74 lines

Re: Solder mask as an insulator

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Wed, 15 Aug 2007 08:27:50 -0700

82 lines

Re: Solder mask as an insulator

Leo Higgins <[log in to unmask]>

Wed, 15 Aug 2007 09:05:02 -0700

97 lines

Re: Solder mask as an insulator

Croslin, Robert <[log in to unmask]>

Wed, 15 Aug 2007 12:10:12 -0400

120 lines

Re: Solder mask as an insulator

Eddie Rocha <[log in to unmask]>

Wed, 15 Aug 2007 10:15:25 -0700

75 lines

Re: Solder mask as an insulator

Phil Nutting <[log in to unmask]>

Wed, 15 Aug 2007 13:47:41 -0400

110 lines

Re: Solder mask as an insulator

Karl Hunsinger <[log in to unmask]>

Wed, 15 Aug 2007 14:17:45 -0400

80 lines

New Thread

Solder mask as an insulator - illustration posted

Re: Solder mask as an insulator - illustration posted

Phil Nutting <[log in to unmask]>

Fri, 17 Aug 2007 08:14:51 -0400

107 lines

Re: Solder mask as an insulator - illustration posted

Craig Cullum <[log in to unmask]>

Fri, 17 Aug 2007 09:21:24 -0500

52 lines

Re: Solder mask as an insulator - illustration posted

Kerry McMullen <[log in to unmask]>

Fri, 17 Aug 2007 14:02:31 -0400

157 lines

Re: Solder mask as an insulator - illustration posted

Dave Dixon <[log in to unmask]>

Fri, 17 Aug 2007 13:17:16 -0500

53 lines

Re: Solder mask as an insulator - illustration posted

Stadem, Richard D. <[log in to unmask]>

Fri, 17 Aug 2007 13:23:49 -0500

188 lines

Re: Solder mask as an insulator - illustration posted

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Fri, 17 Aug 2007 12:44:02 -0700

143 lines

Re: Solder mask as an insulator - illustration posted

Phil Nutting <[log in to unmask]>

Mon, 20 Aug 2007 08:42:41 -0400

179 lines

Re: Solder mask as an insulator - illustration posted

Victor G. Hernandez <[log in to unmask]>

Mon, 20 Aug 2007 08:05:05 -0500

206 lines

Re: Solder mask as an insulator - illustration posted

Phil Nutting <[log in to unmask]>

Mon, 20 Aug 2007 09:16:23 -0400

240 lines

New Thread

Solder Mask Solvent?

Solder Mask Solvent?

Tim Mack <[log in to unmask]>

Tue, 28 Aug 2007 13:25:20 -0500

46 lines

Re: Solder Mask Solvent?

Steve Gregory <[log in to unmask]>

Tue, 28 Aug 2007 13:45:34 -0500

81 lines

Re: Solder Mask Solvent?

Jim Henderson <[log in to unmask]>

Tue, 28 Aug 2007 15:00:32 -0400

108 lines

Re: Solder Mask Solvent?

Paul Edwards <[log in to unmask]>

Tue, 28 Aug 2007 12:16:47 -0700

94 lines

Re: Solder Mask Solvent?

Genny Gibbard <[log in to unmask]>

Tue, 28 Aug 2007 13:22:35 -0600

119 lines

Re: Solder Mask Solvent?

R Sedlak <[log in to unmask]>

Tue, 28 Aug 2007 12:27:38 -0700

68 lines

Re: Solder Mask Solvent?

Tim Mack <[log in to unmask]>

Tue, 28 Aug 2007 15:27:04 -0500

105 lines

Re: Solder Mask Solvent?

Dennis Fritz <[log in to unmask]>

Tue, 28 Aug 2007 16:28:22 EDT

55 lines

Re: Solder Mask Solvent?

peter blokhuis <[log in to unmask]>

Tue, 28 Aug 2007 14:05:04 -0700

87 lines

Re: Solder Mask Solvent?

Gary Crowell <[log in to unmask]>

Tue, 28 Aug 2007 15:22:08 -0600

77 lines

Re: Solder Mask Solvent?

Brian Ellis <[log in to unmask]>

Wed, 29 Aug 2007 11:33:17 +0300

70 lines

Re: Solder Mask Solvent?

Stadem, Richard D. <[log in to unmask]>

Wed, 29 Aug 2007 06:18:25 -0500

121 lines

Re: Solder Mask Solvent?

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Wed, 29 Aug 2007 07:35:54 -0700

149 lines

Re: Solder Mask Solvent?

Wrobel, Clayton <[log in to unmask]>

Thu, 30 Aug 2007 07:06:50 -0400

169 lines

New Thread

Soldering pure matte tin plated component leads using Sn63Pb37 solder

Soldering pure matte tin plated component leads using Sn63Pb37 solder

- bogert <[log in to unmask]>

Tue, 7 Aug 2007 18:44:07 -0400

39 lines

Re: Soldering pure matte tin plated component leads using Sn63Pb37 solder

Richard Kraszewski <[log in to unmask]>

Tue, 7 Aug 2007 19:51:53 -0500

90 lines

New Thread

Standard for tape and reel part

Standard for tape and reel part

Dan Mauro <[log in to unmask]>

Fri, 31 Aug 2007 08:13:07 -0400

34 lines

Re: Standard for tape and reel part

Joel Alexander <[log in to unmask]>

Fri, 31 Aug 2007 08:19:27 -0400

81 lines

New Thread

Standard Improvement Form

Standard Improvement Form

Kevin Glidden <[log in to unmask]>

Tue, 21 Aug 2007 11:09:58 -0400

51 lines

Re: Standard Improvement Form

Bev Christian <[log in to unmask]>

Tue, 21 Aug 2007 11:10:37 -0400

92 lines

New Thread

Strange crystal growth

Strange crystal growth

Davis, Larry <[log in to unmask]>

Wed, 1 Aug 2007 07:20:03 -0700

56 lines

Re: Strange crystal growth

Brian Ellis <[log in to unmask]>

Wed, 1 Aug 2007 17:44:45 +0300

75 lines

Re: Strange crystal growth

Dennis Fritz <[log in to unmask]>

Wed, 1 Aug 2007 12:37:04 EDT

40 lines

Re: Strange crystal growth

Davis, Larry <[log in to unmask]>

Wed, 1 Aug 2007 09:48:59 -0700

81 lines

Re: Strange crystal growth

Ahne Oosterhof <[log in to unmask]>

Thu, 2 Aug 2007 07:32:29 -0700

45 lines

Re: Strange crystal growth

Brian Ellis <[log in to unmask]>

Thu, 2 Aug 2007 17:57:28 +0300

56 lines

Re: Strange crystal growth

Kane, Joseph E (US SSA) <[log in to unmask]>

Mon, 6 Aug 2007 14:42:52 -0400

123 lines

Re: Strange crystal growth

Davis, Larry <[log in to unmask]>

Wed, 8 Aug 2007 07:13:09 -0700

165 lines

Re: Strange crystal growth

Victor G. Hernandez <[log in to unmask]>

Wed, 8 Aug 2007 09:37:38 -0500

195 lines

New Thread

Suggestions for Pressing in Pins...

Suggestions for Pressing in Pins...

Steve Gregory <[log in to unmask]>

Tue, 7 Aug 2007 11:09:01 -0500

71 lines

Re: Suggestions for Pressing in Pins...

Wayne Thayer <[log in to unmask]>

Tue, 7 Aug 2007 14:20:12 -0400

101 lines

Re: Suggestions for Pressing in Pins...

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Tue, 7 Aug 2007 12:53:00 -0700

127 lines

New Thread

SV: [TN] Analysts, look here, nice tool for you

SV: [TN] Analysts, look here, nice tool for you

Hfjord <[log in to unmask]>

Tue, 21 Aug 2007 20:16:42 +0200

114 lines

Re: SV: [TN] Analysts, look here, nice tool for you

Stadem, Richard D. <[log in to unmask]>

Tue, 21 Aug 2007 13:42:49 -0500

135 lines

Re: SV: [TN] Analysts, look here, nice tool for you

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Tue, 21 Aug 2007 11:47:54 -0700

161 lines

Re: SV: [TN] Analysts, look here, nice tool for you

Gervascio, Thomas <[log in to unmask]>

Thu, 23 Aug 2007 12:53:17 -0400

154 lines

Re: SV: [TN] Analysts, look here, nice tool for you

Stadem, Richard D. <[log in to unmask]>

Mon, 27 Aug 2007 09:54:26 -0500

165 lines

New Thread

SV: [TN] Friday NTC - water logged cell phone repair

SV: [TN] Friday NTC - water logged cell phone repair

Hfjord <[log in to unmask]>

Fri, 10 Aug 2007 17:34:56 +0200

178 lines

New Thread

SV: [TN] Is Brian allowed to boast?

SV: [TN] Is Brian allowed to boast?

Hfjord <[log in to unmask]>

Thu, 9 Aug 2007 20:00:11 +0200

151 lines

New Thread

SV: [TN] Microwave Laminate Material

SV: [TN] Microwave Laminate Material

Hfjord <[log in to unmask]>

Tue, 7 Aug 2007 22:33:06 +0200

103 lines

New Thread

SV: [TN] Odd migration

SV: [TN] Odd migration

Hfjord <[log in to unmask]>

Thu, 23 Aug 2007 22:01:04 +0200

121 lines

New Thread

SV: [TN] optics

SV: [TN] optics

Hfjord <[log in to unmask]>

Wed, 15 Aug 2007 17:15:22 +0200

80 lines

New Thread

SV: [TN] PCB matl properties - water effect NTC

SV: [TN] PCB matl properties - water effect NTC

Hfjord <[log in to unmask]>

Wed, 29 Aug 2007 21:14:10 +0200

157 lines

Re: SV: [TN] PCB matl properties - water effect NTC

Stadem, Richard D. <[log in to unmask]>

Wed, 29 Aug 2007 14:40:31 -0500

195 lines

New Thread

SV: [TN] Plasma "oxidation"

SV: [TN] Plasma "oxidation"

Hfjord <[log in to unmask]>

Fri, 31 Aug 2007 17:41:06 +0200

239 lines

SV: [TN] Plasma "oxidation"

Hfjord <[log in to unmask]>

Fri, 31 Aug 2007 20:46:16 +0200

639 lines

Re: SV: [TN] Plasma "oxidation"

Wayne Thayer <[log in to unmask]>

Fri, 31 Aug 2007 15:09:43 -0400

590 lines

Re: SV: [TN] Plasma "oxidation"

Frederick Miller <[log in to unmask]>

Fri, 31 Aug 2007 15:23:32 -0400

665 lines

Re: SV: [TN] Plasma "oxidation"

Upton, Shawn <[log in to unmask]>

Fri, 31 Aug 2007 15:25:14 -0400

621 lines

Re: SV: [TN] Plasma "oxidation"

Dennis Fritz <[log in to unmask]>

Fri, 31 Aug 2007 16:00:46 EDT

40 lines

New Thread

SV: [TN] Rework question

SV: [TN] Rework question

Hfjord <[log in to unmask]>

Tue, 7 Aug 2007 21:44:22 +0200

176 lines

New Thread

SV: [TN] Solder mask as an insulator - illustration posted

SV: [TN] Solder mask as an insulator - illustration posted

Hfjord <[log in to unmask]>

Fri, 17 Aug 2007 20:42:15 +0200

189 lines

New Thread

SV: [TN] SV: [TN] Analysts, look here, nice tool for you

SV: [TN] SV: [TN] Analysts, look here, nice tool for you

Hfjord <[log in to unmask]>

Tue, 21 Aug 2007 20:53:47 +0200

160 lines

New Thread

SV: [TN] SV: [TN] PCB matl properties - water effect NTC

SV: [TN] SV: [TN] PCB matl properties - water effect NTC

Hfjord <[log in to unmask]>

Wed, 29 Aug 2007 22:09:11 +0200

229 lines

Re: SV: [TN] SV: [TN] PCB matl properties - water effect NTC

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Wed, 29 Aug 2007 13:26:48 -0700

260 lines

Re: SV: [TN] SV: [TN] PCB matl properties - water effect NTC

John Burke <[log in to unmask]>

Wed, 29 Aug 2007 16:24:56 -0700

295 lines

Re: SV: [TN] SV: [TN] PCB matl properties - water effect NTC

Hernefjord Ingemar <[log in to unmask]>

Thu, 30 Aug 2007 08:02:26 +0200

264 lines

New Thread

SV: [TN] The perils of using Alcohol for cleaning

SV: [TN] The perils of using Alcohol for cleaning

Hfjord <[log in to unmask]>

Wed, 29 Aug 2007 21:07:37 +0200

177 lines

New Thread

SV: [TN] U/S vs liquids vs temp vs cavity efficiency

SV: [TN] U/S vs liquids vs temp vs cavity efficiency

Hfjord <[log in to unmask]>

Thu, 30 Aug 2007 22:27:08 +0200

261 lines

Re: SV: [TN] U/S vs liquids vs temp vs cavity efficiency

Stadem, Richard D. <[log in to unmask]>

Thu, 30 Aug 2007 15:46:41 -0500

246 lines

New Thread

SV: [TN] U/S vs liquids vs temp vs cavity efficiensy

SV: [TN] U/S vs liquids vs temp vs cavity efficiensy

Hfjord <[log in to unmask]>

Thu, 23 Aug 2007 17:26:51 +0200

221 lines

SV: [TN] U/S vs liquids vs temp vs cavity efficiensy

Hfjord <[log in to unmask]>

Thu, 23 Aug 2007 22:33:46 +0200

222 lines

New Thread

SV: [TN] [EN] Is Brian allowed to boast?

SV: [TN] [EN] Is Brian allowed to boast?

Hfjord <[log in to unmask]>

Thu, 2 Aug 2007 16:56:27 +0200

178 lines

New Thread

Tacking potting material

Tacking potting material

[log in to unmask]

Tue, 14 Aug 2007 14:05:19 -0500

49 lines

Re: Tacking potting material

Douglas O. Pauls <[log in to unmask]>

Tue, 14 Aug 2007 14:17:11 -0500

87 lines

Re: Tacking potting material

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Tue, 14 Aug 2007 12:24:03 -0700

55 lines

Re: Tacking potting material

Louis, Edwin @ CSE <[log in to unmask]>

Tue, 14 Aug 2007 15:42:37 -0400

52 lines

Re: Tacking potting material

Richard Kraszewski <[log in to unmask]>

Tue, 14 Aug 2007 14:46:45 -0500

66 lines

Re: Tacking potting material

Gerald Bogert <[log in to unmask]>

Tue, 14 Aug 2007 18:28:49 -0400

57 lines

Re: Tacking potting material

Hernefjord Ingemar <[log in to unmask]>

Wed, 15 Aug 2007 08:28:02 +0200

83 lines

Re: Tacking potting material

Stadem, Richard D. <[log in to unmask]>

Wed, 15 Aug 2007 08:04:46 -0500

105 lines

New Thread

The perils of using Alcohol for cleaning

The perils of using Alcohol for cleaning

Phil Nutting <[log in to unmask]>

Tue, 28 Aug 2007 09:11:37 -0400

34 lines

Re: The perils of using Alcohol for cleaning

Brian Ellis <[log in to unmask]>

Wed, 29 Aug 2007 11:54:26 +0300

73 lines

Re: The perils of using Alcohol for cleaning

Hernefjord Ingemar <[log in to unmask]>

Wed, 29 Aug 2007 12:26:54 +0200

115 lines

Re: The perils of using Alcohol for cleaning

Brian Ellis <[log in to unmask]>

Wed, 29 Aug 2007 14:22:27 +0300

130 lines

Re: The perils of using Alcohol for cleaning

Mike Fenner <[log in to unmask]>

Wed, 29 Aug 2007 12:37:30 +0100

110 lines

Re: The perils of using Alcohol for cleaning

Bill Kunkle <[log in to unmask]>

Wed, 29 Aug 2007 12:40:36 -0500

138 lines

Re: The perils of using Alcohol for cleaning

[log in to unmask]

Thu, 30 Aug 2007 00:08:14 EDT

68 lines

Re: The perils of using Alcohol for cleaning

Phil Nutting <[log in to unmask]>

Thu, 30 Aug 2007 07:57:21 -0400

129 lines

New Thread

Thermal Back Plane Termination Devices, IPC-A-610D

Thermal Back Plane Termination Devices, IPC-A-610D

Victor G. Hernandez <[log in to unmask]>

Thu, 23 Aug 2007 07:15:49 -0500

30 lines

Re: Thermal Back Plane Termination Devices, IPC-A-610D

Bev Christian <[log in to unmask]>

Thu, 23 Aug 2007 09:05:31 -0400

76 lines

New Thread

Through hole soldering of ENIG finish

Through hole soldering of ENIG finish

Kathy Bergman <[log in to unmask]>

Thu, 9 Aug 2007 16:08:16 -0700

44 lines

New Thread

Transfer Check sheet/list

Transfer Check sheet/list

Dan Mauro <[log in to unmask]>

Tue, 28 Aug 2007 11:38:30 -0400

35 lines

Re: Transfer Check sheet/list

Phil Nutting <[log in to unmask]>

Tue, 28 Aug 2007 14:10:33 -0400

68 lines

New Thread

U/S vs liquids vs temp vs cavity efficiency

Re: U/S vs liquids vs temp vs cavity efficiency

Hernefjord Ingemar <[log in to unmask]>

Thu, 23 Aug 2007 16:25:06 +0200

149 lines

Re: U/S vs liquids vs temp vs cavity efficiency

Blomberg, Rainer (FL51) <[log in to unmask]>

Thu, 30 Aug 2007 14:49:59 -0500

196 lines

New Thread

U/S vs liquids vs temp vs cavity efficiensy

U/S vs liquids vs temp vs cavity efficiensy

Hernefjord Ingemar <[log in to unmask]>

Thu, 23 Aug 2007 10:50:27 +0200

37 lines

Re: U/S vs liquids vs temp vs cavity efficiensy

Bev Christian <[log in to unmask]>

Thu, 23 Aug 2007 09:17:04 -0400

86 lines

Re: U/S vs liquids vs temp vs cavity efficiensy

Brian Ellis <[log in to unmask]>

Thu, 23 Aug 2007 16:52:02 +0300

110 lines

Re: U/S vs liquids vs temp vs cavity efficiensy

Bev Christian <[log in to unmask]>

Thu, 23 Aug 2007 10:41:36 -0400

144 lines

Re: U/S vs liquids vs temp vs cavity efficiensy

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Thu, 23 Aug 2007 07:46:42 -0700

186 lines

Re: U/S vs liquids vs temp vs cavity efficiensy

Brian Ellis <[log in to unmask]>

Thu, 23 Aug 2007 18:08:17 +0300

212 lines

Re: U/S vs liquids vs temp vs cavity efficiensy

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Thu, 23 Aug 2007 09:36:15 -0700

248 lines

New Thread

UV epoxy

UV epoxy

Genny Gibbard <[log in to unmask]>

Tue, 28 Aug 2007 11:06:03 -0600

38 lines

Re: UV epoxy

Peter Swanson <[log in to unmask]>

Wed, 29 Aug 2007 13:56:32 +0100

99 lines

New Thread

VACUM CHAMBER

VACUM CHAMBER

al shirazi <[log in to unmask]>

Wed, 29 Aug 2007 09:28:51 -0700

77 lines

New Thread

vOID IN Micro BGA

vOID IN Micro BGA

shankar rao <[log in to unmask]>

Fri, 31 Aug 2007 16:48:44 +0100

34 lines

Re: vOID IN Micro BGA

Vladimir Igoshev <[log in to unmask]>

Fri, 31 Aug 2007 12:04:23 -0400

69 lines

Re: vOID IN Micro BGA

Joe Macko <[log in to unmask]>

Fri, 31 Aug 2007 09:52:43 -0700

107 lines

Re: vOID IN Micro BGA

Bev Christian <[log in to unmask]>

Fri, 31 Aug 2007 13:14:16 -0400

152 lines

Re: void IN Micro BGA

John Burke <[log in to unmask]>

Fri, 31 Aug 2007 14:36:03 -0700

142 lines

Re: vOID IN Micro BGA

Dwight Mattix <[log in to unmask]>

Fri, 31 Aug 2007 15:45:25 -0700

176 lines

New Thread

Werner Engelmaier contact info

Werner Engelmaier contact info

Kevin Glidden <[log in to unmask]>

Fri, 31 Aug 2007 14:06:51 -0400

33 lines

Re: Werner Engelmaier contact info

Bev Christian <[log in to unmask]>

Fri, 31 Aug 2007 14:12:40 -0400

88 lines

Re: Werner Engelmaier contact info

Kevin Glidden <[log in to unmask]>

Fri, 31 Aug 2007 14:23:53 -0400

118 lines

Re: Werner Engelmaier contact info

Werner Engelmaier <[log in to unmask]>

Fri, 31 Aug 2007 15:11:12 -0400

71 lines

Re: Werner Engelmaier contact info

John Burke <[log in to unmask]>

Fri, 31 Aug 2007 14:37:18 -0700

116 lines

New Thread

[EN] Is Brian allowed to boast?

Re: [EN] Is Brian allowed to boast?

John Burke <[log in to unmask]>

Wed, 1 Aug 2007 11:29:11 -0700

85 lines

Re: [EN] Is Brian allowed to boast?

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Wed, 1 Aug 2007 12:38:20 -0700

119 lines

Re: [EN] Is Brian allowed to boast?

Randy Bock Sr. <[log in to unmask]>

Wed, 1 Aug 2007 16:17:20 -0400

176 lines

Re: [EN] Is Brian allowed to boast?

Mike Fenner <[log in to unmask]>

Thu, 2 Aug 2007 11:23:48 +0100

116 lines

Re: [EN] Is Brian allowed to boast?

Steve Gregory <[log in to unmask]>

Thu, 2 Aug 2007 07:04:09 -0500

64 lines

New Thread

[LF] Request for LF shrinkhole or hot tear failure data

Re: [LF] Request for LF shrinkhole or hot tear failure data

Whittaker, Dewey (EHCOE) <[log in to unmask]>

Fri, 17 Aug 2007 13:39:59 -0700

173 lines

Re: [LF] Request for LF shrinkhole or hot tear failure data

Stadem, Richard D. <[log in to unmask]>

Mon, 20 Aug 2007 06:51:49 -0500

228 lines

Re: [LF] Request for LF shrinkhole or hot tear failure data

Roberts, Jon <[log in to unmask]>

Tue, 21 Aug 2007 15:03:38 -0500

376 lines

Re: [LF] Request for LF shrinkhole or hot tear failure data

Stadem, Richard D. <[log in to unmask]>

Tue, 21 Aug 2007 16:16:22 -0500

420 lines

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