0805 Pad Geometry (3 Messages)
1st European Symposium - Call for Participation (2 Messages)
2D inspection at DEK printer (1 Message)
<No subject> (1 Message)
adhesive bonding to Teflon coated coax (2 Messages)
Adjustable punching tool (2 Messages)
Allergies to ESD Wriststraps (10 Messages)
Annular rings for plated through holes (4 Messages)
Another view of lead-free (13 Messages)
Apex Lunch (16 Messages)
Apex/Expo Lunch (1 Message)
Baking IC's to J-STD-033 that are not in a suitable pack aging (1 Message)
Baking IC's to J-STD-033 that are not in a suitable packaging (6 Messages)
Baking of Laminates before processing (2 Messages)
Bed-of-nails testing (2 Messages)
BGA and Water solube paste (3 Messages)
BGA re balling process (3 Messages)
BGA Socket and PowerPC BGA... (5 Messages)
BGA Solder bumps deformation (2 Messages)
BGA Vibration Issues (1 Message)
Blind Via Reliability Data/Literature (2 Messages)
Board assembly in Florida or Platsburgh (2 Messages)
capacitor networks (8 Messages)
Carbon Traces (2 Messages)
CASTELLATED PARTS (10 Messages)
CASTELLATED PARTS SPAM (1 Message)
Cheryl Tulkoff/AUS/NIC is out of the office. (1 Message)
Chip Die Bonding Material, CHANNEL VOIDS (1 Message)
Cleaners (4 Messages)
Cleaning Chemistry (7 Messages)
Conductivity and Resistivity Correlation (11 Messages)
Conformal coat over RTV? (9 Messages)
Conformal Coating Boards. (5 Messages)
Contamination on a SOT-23 component (12 Messages)
contamination problems on reworks (3 Messages)
copper thieving (2 Messages)
Copper vs nickel flash; which is best? (1 Message)
Crack Inspection in component (3 Messages)
Crack solder joint on TSOP-48 device (3 Messages)
Cutter Resharpening (2 Messages)
Die Bonding Channel Voids (1 Message)
Drill bit problems (2 Messages)
Dross inhibitor (1 Message)
Dye (4 Messages)
Electroless Ni-B (5 Messages)
Embedded Passives Conference Goes to Germany (1 Message)
ENIG (2 Messages)
ESD Mesh (7 Messages)
Facility Humidity control (8 Messages)
fixture pins, bareboard testing (2 Messages)
Flex Circuit house search (1 Message)
fluorescing agents (10 Messages)
FR-4 standard thickness (17 Messages)
gold plating on key pads (2 Messages)
Gold Plating Removal (2 Messages)
Goldresidues in non-plated holes (7 Messages)
Grinding/Polishing Equipment (5 Messages)
HASL Contract Houses (3 Messages)
HELP! Looking for proto flex circuit house (2 Messages)
hot bar soldering (3 Messages)
ID eglbrm... thanks (7 Messages)
Ion Chromatography (5 Messages)
IPC 6016 for microvias (1 Message)
IPC Webcast on BGA Updates (1 Message)
IPC-4101 Material (7 Messages)
iron tip potential (9 Messages)
Is removal of lead from electronics solders a legitimate effort? (9 Messages)
James Vincent (1 Message)
Kapton insulated wire (2 Messages)
Laser BGA Rework (1 Message)
Lead Free Workshop Series (1 Message)
looking for Hans (1 Message)
looking for ultra fine line manufacturer (1 Message)
MaskFlake photos (1 Message)
Matte vs. Gloss Finish for Solder Mask (1 Message)
MIL-spec info needed (4 Messages)
Need proper title etc. for IEC 68-20-2 (2 Messages)
new request for old tech (1 Message)
Ni galvanic / chemical (6 Messages)
Ni/Au solderability on kapton (11 Messages)
Nickel vice copper flash question question, again (2 Messages)
Nitrogen (4 Messages)
NTC aluminum foil eating barbecue sauce (21 Messages)
NTC Food grade plastic question (1 Message)
NTC Friday's post... (1 Message)
NTC RE: [TN] Spoofed e-mail (1 Message)
NTC Technilith Developer (1 Message)
NTC...Technet Launch (1 Message)
OT: thank you for wire harness leads (1 Message)
PCB Thermal Capabilities (1 Message)
Pick-and-place Tolerance (4 Messages)
Placement of large SMT connectors (3 Messages)
Please move this discussion to the leadfree forumAnother view of lead-free (1 Message)
Probe Marks (1 Message)
Pure Tin Component Finish (5 Messages)
QQ-S-571 (3 Messages)
Question about Plating (2 Messages)
Recall: looking for Hans (1 Message)
References for ADot Design Engineering (1 Message)
Regarding Solder Mask Preference (1 Message)
Rescheduled SNEC Mtg (1 Message)
Rework (1 Message)
Rework Gold Finish (8 Messages)
Robert Coburn/TDI_NOTES is out of the office. (1 Message)
Routing tolerance question (2 Messages)
Seeking experienced PCB manufacturers with Thermally conductive substrate (2 Messages)
Seeking help on hand soldering problem please (2 Messages)
Shieldinf over BGA (1 Message)
Skewed Components (7 Messages)
SMT Assembly Costing (2 Messages)
SMT Chip Components End Overlap (Section 12.2.2.8) (2 Messages)
Solder Bath Coating "Melonite" (3 Messages)
Solder Mask Flaking (27 Messages)
Soldering .250" thick boards... (2 Messages)
Space Qualified Materials (2 Messages)
SPAM:: [TN] Cutter Resharpening (1 Message)
Spoofed e-mail (9 Messages)
Spray coating! (6 Messages)
Static Reflow Oven (3 Messages)
Steve's Web page (2 Messages)
Surprising Reliability question (1 Message)
Table Top Convection Reflow Oven (1 Message)
TechNet Digest - 12 Feb 2004 to 13 Feb 2004 (#2004-42) (1 Message)
Technet Lunch at APEX/EXPO/Designer's Summit (1 Message)
Technical details of SAC alloys? (2 Messages)
Technilith Developer (5 Messages)
Test points: Question on swaging of turrets (5 Messages)
THT components placed in SMT (3 Messages)
Underfill for TCE Problem (1 Message)
Universal VCD Technician (2 Messages)
unsubscribe (2 Messages)
upgrades and repair (4 Messages)
Use Nitrogen or Not! (2 Messages)
V-Score service? (2 Messages)
Vac laminators & Wet Laminators? (2 Messages)
Valerie St Cyr/Bos/Teradyne is out of the office. (1 Message)
Well... (1 Message)
White legend turning yellow (4 Messages)
Zephyrtronics and BIG, THICK backplanes... (1 Message)
[TN] Kapton insulated wire (2 Messages)
[TN] Matte vs. Gloss Finish for Solder Mask (5 Messages)