In a message dated 12/16/99 6:25:35 PM Central Standard Time,
[log in to unmask] writes:

<< Hi everyone ... I have been looking at solder joint failures for quite a
 while and have stumbled on something new to me.  I hope someone has seen
 this and can give me some insights.  Here it is ...
  >>
Ed,

I have seen this failure many times in the past.  It is normally related to
two conditions. One being a high thermal excursion and the second being poor
solderability of the copper.  What you did not mention was what the thermal
excursions were and how many cycles to failure.  You may also have
unrealistic expectations of the system in general.

Larry Tawyea

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