In a message dated 12/16/99 6:25:35 PM Central Standard Time, [log in to unmask] writes: << Hi everyone ... I have been looking at solder joint failures for quite a while and have stumbled on something new to me. I hope someone has seen this and can give me some insights. Here it is ... >> Ed, I have seen this failure many times in the past. It is normally related to two conditions. One being a high thermal excursion and the second being poor solderability of the copper. What you did not mention was what the thermal excursions were and how many cycles to failure. You may also have unrealistic expectations of the system in general. Larry Tawyea ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################