Ingemar,

Thank-you for your complements.

Regarding adhesive dispensing - for the most part, our MCM's do not require
extremely fine pitch adhesive dispensing.  Typically, for our applications,
the quality and consistency of the adhesive is more important than the need
for fine pitch dispensing.

The very small needle I had referred to was used for dispensing of an
un-filled adhesive.  Because of the adhesive's tendency to wrap around the
dispense tip and climb the outer diameter of the needle, and small program
requirements, it was done semi-manually using a Westbond.

We use a variety of methods, including: Stenciling, screening, Camelot -
both time/pressure and auger.  We use Westbond 7200 dispensers as well -
best way to describe them is that they allow for manual dispensing using an
augmented X-Y-Z manipulator.  Asymtek - Millenium is on the way.

As yet, I have not attempted to dispense conductive adhesive for flip chip
attach.  Given a choice, I might rather consider having a b-stagable
material applied to the wafer.

Our flip chips are still attached with "old-fashioned solders" - which the
customers feel more comfortable with, at the present time.

Steven Creswick - CTS Microelectronics

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