Ingemar, Thank-you for your complements. Regarding adhesive dispensing - for the most part, our MCM's do not require extremely fine pitch adhesive dispensing. Typically, for our applications, the quality and consistency of the adhesive is more important than the need for fine pitch dispensing. The very small needle I had referred to was used for dispensing of an un-filled adhesive. Because of the adhesive's tendency to wrap around the dispense tip and climb the outer diameter of the needle, and small program requirements, it was done semi-manually using a Westbond. We use a variety of methods, including: Stenciling, screening, Camelot - both time/pressure and auger. We use Westbond 7200 dispensers as well - best way to describe them is that they allow for manual dispensing using an augmented X-Y-Z manipulator. Asymtek - Millenium is on the way. As yet, I have not attempted to dispense conductive adhesive for flip chip attach. Given a choice, I might rather consider having a b-stagable material applied to the wafer. Our flip chips are still attached with "old-fashioned solders" - which the customers feel more comfortable with, at the present time. Steven Creswick - CTS Microelectronics ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################