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November 1999

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Wed, 10 Nov 1999 20:53:58 EST
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"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
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Werner Engelmaier <[log in to unmask]>
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Hi Eric,
You write:
>I'm sure IPC has some document which outlines suitable test procedures for
>qualifying a new pad design.
What is it you like to qualify for? Is it just process yield, you simply will
have to run an adequate sample through your processes. There is no IPC spec
for this.
Do you want to assure reliability, than there is IPC-SM-785; but before I
would embark into expensive and time-consuming accelerated reliability
testing, I would look hard at IPC-D-279, Appendix A.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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