Hi Eric, You write: >I'm sure IPC has some document which outlines suitable test procedures for >qualifying a new pad design. What is it you like to qualify for? Is it just process yield, you simply will have to run an adequate sample through your processes. There is no IPC spec for this. Do you want to assure reliability, than there is IPC-SM-785; but before I would embark into expensive and time-consuming accelerated reliability testing, I would look hard at IPC-D-279, Appendix A. Werner Engelmaier Engelmaier Associates, L.C. Electronic Packaging, Interconnection and Reliability Consulting 7 Jasmine Run Ormond Beach, FL 32174 USA Phone: 904-437-8747, Fax: 904-437-8737 E-mail: [log in to unmask], Website: www.engelmaier.com ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################