Hi Craig,

One risk might be that your film comp's have been generated to facilitate
this bake (which may or may not affect layer movement).  If that's the case
then you may see some negative affects in drill registration.  This shouldn't
be too hard to prove out by running several lots of various PCB types and
monitor for drill registration.

You're right not to take changes lightly.  Production people know what they
need.  It's engineering's job to give it to them.  It's never a good idea to
make changes "from the hip" especially ones that can load your shop up with
garbage before you even know you have a problem.  Perform the tests first -
don't allow pressures from ANY department to get in the way of solid
engineering.

From my own experience with PEP, we didn't bake prior to it.  As Rick
Howieson pointed out, the bake after oxide should preclude the need for an
additional moisture bake.

Hope this helps

Mark Mazzoli

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