Hi Craig, One risk might be that your film comp's have been generated to facilitate this bake (which may or may not affect layer movement). If that's the case then you may see some negative affects in drill registration. This shouldn't be too hard to prove out by running several lots of various PCB types and monitor for drill registration. You're right not to take changes lightly. Production people know what they need. It's engineering's job to give it to them. It's never a good idea to make changes "from the hip" especially ones that can load your shop up with garbage before you even know you have a problem. Perform the tests first - don't allow pressures from ANY department to get in the way of solid engineering. From my own experience with PEP, we didn't bake prior to it. As Rick Howieson pointed out, the bake after oxide should preclude the need for an additional moisture bake. Hope this helps Mark Mazzoli ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################