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October 1999

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Subject:
cooling boards/ cooling conveyor
From:
Matthew Park <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 18 Oct 1999 13:16:27 -0500
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What would be a best way to cool boards exiting from a reflow oven prior to printing the other side in a continous double side SMT assembly process?

Typical board tempeature is 100'c to 80'c afther exiting oven and it required to cool down to room temp (30'c / below) before processing the other side.

who are some of conveyor vendors who has experienc making such a cooling unit?

Matthew Park

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