What would be a best way to cool boards exiting from a reflow oven prior to printing the other side in a continous double side SMT assembly process? Typical board tempeature is 100'c to 80'c afther exiting oven and it required to cool down to room temp (30'c / below) before processing the other side. who are some of conveyor vendors who has experienc making such a cooling unit? Matthew Park ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################