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September 1999

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Subject:
Baking SOIC packages to dry them prior to reflow solder
From:
Alan Shaw <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 14 Sep 1999 16:34:13 -0400
Content-Type:
text/plain
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text/plain (28 lines) 
I have 5 year old plastic SOIC packages on reels and want to dry them out in
an oven rather than leave it to the pre-heat of the reflow solder machine.
Production asked for temperature and time for the SOIC to be in the oven.
My initial thoughts are to put them in a cold oven and set the thermostat to
110'C and leave them baking for 4 hours. Then turn off the oven. Remove them
when cool and use in the insertion machines the next day.
Is the temperature and time suitable?

The leads have passed a solderability test already, would the time in the
oven have a significant effect on solderabitiy?

Al Shaw
ashaw at napcosecurity dot com

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