I have 5 year old plastic SOIC packages on reels and want to dry them out in an oven rather than leave it to the pre-heat of the reflow solder machine. Production asked for temperature and time for the SOIC to be in the oven. My initial thoughts are to put them in a cold oven and set the thermostat to 110'C and leave them baking for 4 hours. Then turn off the oven. Remove them when cool and use in the insertion machines the next day. Is the temperature and time suitable? The leads have passed a solderability test already, would the time in the oven have a significant effect on solderabitiy? Al Shaw ashaw at napcosecurity dot com ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################