Hello.

You may be, instead, refering to SSD, Solid Solder Deposits, which is now
used as one means for producing solder bumps for flip chip die?

See, for example,
http://www.masktek.com/our_products.htm

for one method of solder deposition, which may be subsequently reflowed to
form the bump.

Michael Alderete
Aerojet


su-kyoung Lee wrote...
------------------------------

Date:    Mon, 13 Sep 1999 17:13:10 +0900
From:    su-kyoung Lee <[log in to unmask]>
Subject: what is super solder technology on the bump pad?

Hell, technetters.
what is super solder technology on the bump pad?
Is SST adequit for soldering on pad?
what is the adequit height of the solder and flux before and after
plattening?
I'm searching for the possible soldering  process on the small bump pad.
thanks. all

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