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Tue, 28 Sep 1999 19:07:21 -0700 |
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Hi,
Is expose basis metal on pcb's circuitry, as a result of assembly
process scratches, and not as a defective solder mask, acceptable under
IPC 610/J-STD-001?
I have concluded that IPC-610 does not addresses this as a condition,
other then being mentioned as an element of a rejectable solder mask
degradation, 7.2.1, figure 7-9. I have, also, noticed that correction
amendment, January 1996, removed the expose bare copper from the
rejectable conditions for class 2,3 on 7.2.2, figure 7-12.
I'm really looking at tiny spots (approx. .010" dia. max). Any help
would be appreciated.
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